Semiconductors · Memory · Foundry
Samsung Electronics
A diversified semiconductor company spanning memory, foundry, and finished products. In the AI cycle it supplies HBM to AMD and NVIDIA and builds chips for Tesla, Apple, and Qualcomm through its foundry.
005930.KS Updated Jun 21, 2026 1 AI consumers· 1 recurring
Money in ▸Tesla●Contract value $16BNVIDIA●AMD●Alphabet (Google)◐Market share >60Qualcomm◐Apple◐Marvell◐Broadcom◐
Samsung Electronics₩333.6T
▸ Money outSamsung Electro-Mechanics●Dongjin Semichem●ASML●Applied Materials●KLA●Lam Research●Soulbrain●HPSP●Wonik IPS●Foosung●Tokyo Electron (TEL)●Shin-Etsu Chemical●SUMCO Corporation●GlobalWafers●Advantest●Teradyne●PSK Inc●ASMPT◐Hanmi Semiconductor◐Hanwha Semitech◐BESI◐ENF Technology◐Jusung Engineering◐Synopsys◐SK Siltron◐Arm Holdings◐Cadence Design Systems◐심텍○LG이노텍○
Financials & Segments
- Total revenue · ₩333.6T (FY2025 consolidated)
- Operating profit · ₩43.6T
- Net income · ₩45.2T
- Segments · DS (Semiconductors) · DX · SDC · Harman
Revenue from
- Tesla High confidence· Contract value $16B · multi-year
Foundry (Taylor fab AI chip).Mentions KO DART (FSS Electronic Disclosure) Published Mar 10, 2026: "Samsung business report: this revenue arises in the DS (semiconductor)/foundry segment. FY2025 consolidated revenue ₩333.6T, operating profit ₩43.6T. The filing does not disclose individual customer names (segment level)."Confirms EN SEC EDGAR Published Jan 29, 2026: "Tesla 10-K: "a new collaboration with Samsung to manufacture advanced semiconductors for AI inference and training in the U.S." Buyer-side (Tesla) primary filing confirming Samsung to Tesla foundry ($16B)."Confirms EN TrendForce Published Nov 13, 2025: "Samsung and Tesla signed a $16B contract to make AI chips at the Taylor fab." - NVIDIA High confidence
Began supplying HBM3E from Q3 2025.Mentions KO DART (FSS Electronic Disclosure) Published Mar 10, 2026: "Samsung business report: this revenue arises in the DS (semiconductor)/foundry segment. FY2025 consolidated revenue ₩333.6T, operating profit ₩43.6T. The filing does not disclose individual customer names (segment level)."Confirms EN SEC EDGAR Published Feb 26, 2026: "NVIDIA 10-K (FY2026): "We purchase memory from ... Samsung" and "We utilize foundries, such as TSMC and Samsung, to produce our semiconductor wafers." Confirms NVIDIA's Samsung memory purchases and foundry use."Confirms EN KED Global Published Oct 30, 2025: "After starting HBM shipments to NVIDIA in Q3, Samsung sold out its 2026 volume." - AMD High confidence
Supplies 12-high HBM3E (MI350 accelerator); seen as ahead on HBM4.Mentions KO DART (FSS Electronic Disclosure) Published Mar 10, 2026: "Samsung business report: this revenue arises in the DS (semiconductor)/foundry segment. FY2025 consolidated revenue ₩333.6T, operating profit ₩43.6T. The filing does not disclose individual customer names (segment level)."Confirms EN SEC EDGAR Published Feb 4, 2026: "AMD 10-K: "we utilize TSMC, UMC and Samsung Electronics" (foundry). Buyer-side (AMD) primary filing confirming Samsung to AMD supply." - Alphabet (Google) Medium confidence· Market share >60 · 2024 · Samsung’s share of HBM in Google TPUs
Supplies HBM/DRAM to Google’s TPUs and datacenters (60%+ of Google TPU HBM in 2024); also in talks to make the next-gen TPU I/O die on Samsung 2nm foundry (≈2028, not finalized).Confirms KO Seoul Economic Daily Published Jan 10, 2026: "Supplied 60%+ of HBM in Google TPUs last year."Mentions KO THE ELEC Accessed Jun 20, 2026: "Google is considering Samsung’s foundry for some next-gen TPU components." - Qualcomm Medium confidence
Supplies foundry (partial, 2nm talks) to Qualcomm. - Apple Medium confidence
Foundry contract manufacturing.Mentions EN TrendForce Published Nov 13, 2025: "In 2025 Samsung secured foundry contracts with major North American firms including Tesla and Apple." - Marvell Medium confidence
Custom HBM collaboration for Marvell's custom AI chips.Confirms KO Korea Economic Daily Published Dec 11, 2024: "Marvell works with Samsung and SK hynix on custom HBM." - Broadcom Medium confidence
Supplies HBM for Broadcom's AI accelerators.Confirms KO Seoul Economic Daily Published Mar 6, 2026: "Broadcom's AI revenue surge opens a door for Samsung HBM."
Pays to
- Samsung Electro-Mechanics High confidence
Buys MLCCs, IC substrates (FC-BGA) and camera modules from affiliate Samsung Electro-Mechanics — its largest customer (~29% of its revenue, diversifying into AI/auto).Confirms KO CEO Score Daily Published Mar 11, 2026: "Samsung is ~29% (2021) of Samsung Electro-Mechanics revenue, declining."Mentions EN Blackridge Research Accessed Jun 19, 2026: "Component affiliates such as Samsung Electro-Mechanics." - Dongjin Semichem High confidence
Buys photoresist (incl. EUV) and process chemicals from Dongjin Semichem; Samsung is ~59% (Q3 2025) of Dongjin revenue — a key domestic alternative reducing reliance on Japan.Confirms KO Korea Economic TV Published Dec 2, 2025: "Samsung is 59% of Dongjin revenue (Q3 2025); KRW 552.8bn (37.9%) last year."Mentions EN Blackridge Research Accessed Jun 19, 2026: "Korean materials and packaging suppliers such as Dongjin Semichem." - ASML High confidence
Buys EUV lithography from ASML (its largest customer).Confirms EN Seoul Economic Daily Published Apr 17, 2026: "Samsung and SK secured two-thirds of ASML's 2025 EUV shipments (~40 units, $14B)." - Applied Materials High confidence
Buys Applied Materials wafer-fab tools.Confirms KO Asia Business Daily Published Apr 28, 2026: "Samsung expands tool purchases with memory and foundry capex." - KLA High confidence
Buys KLA inspection and metrology tools. - Lam Research High confidence
Buys Lam Research etch and deposition tools (memory/logic). - Soulbrain High confidence
Buys etchants, cleaners and CMP slurry from Soulbrain (incl. 3nm GAA etchant). - HPSP High confidence
Buys high-pressure hydrogen annealing tools from HPSP (sole supplier).Confirms KO Korea Economic Daily Published Jul 13, 2025: "Samsung Electronics adopts HPSP high-pressure annealing tools." - Wonik IPS High confidence
Buys PECVD/ALD deposition tools from Wonik IPS (incl. leading-edge foundry).Confirms KO Hankyung (Daum) Published Nov 4, 2025: "Samsung adopts Wonik IPS deposition tools at scale." - Foosung High confidence
Buys C4F6 (etch) and WF6 (interconnect) specialty gases from Foosung.Confirms KO HuffPost Korea Accessed Jun 20, 2026: "Samsung uses Foosung’s domestic specialty gases." - Tokyo Electron (TEL) High confidence
Buys coater, etch, deposition and clean tools from Tokyo Electron. - Shin-Etsu Chemical High confidence
Buys 300mm silicon wafers from Shin-Etsu Chemical under LTA.Confirms KO ICN Magazine Published Jan 15, 2026: "Samsung Electronics depends on Shin-Etsu Chemical for wafer supply." - SUMCO Corporation High confidence
Buys 300mm silicon wafers from SUMCO Corporation under LTA.Confirms KO ICN Magazine Published Jan 15, 2026: "Samsung Electronics depends on SUMCO Corporation for wafer supply." - GlobalWafers High confidence
Uses/buys 300mm silicon wafers from GlobalWafers.Confirms EN Mordor Intelligence Published Jan 1, 2025: "Top-five 300mm oligopoly; GlobalWafers ~15%." - Advantest High confidence
Buys test equipment (ATE) from Advantest. - Teradyne High confidence
Buys test equipment (ATE) from Teradyne. - PSK Inc High confidence
Buys dry-strip (PR removal) tools from PSK (global No.1). - ASMPT Medium confidence
HBM TC bonder. - Hanmi Semiconductor Medium confidence
HBM bonding equipment (TC bonder). Shares this supplier with SK hynix. - Hanwha Semitech Medium confidence
HBM TC bonder. - BESI Medium confidence
HBM bonder. - ENF Technology Medium confidence
Buys stripper, etchant and precursors from ENF. - Jusung Engineering Medium confidence
Buys ALD and other deposition tools from Jusung Engineering.Confirms KO Sisa Journal e Accessed Jun 20, 2026: "Samsung adopts Jusung ALD tools as it raises ALD share." - Synopsys Medium confidence
Uses/buys EDA tools and IP from Synopsys.Confirms EN SEC EDGAR Published Dec 18, 2024: "10-K: EDA tools/IP revenue and major chip customers." - SK Siltron Medium confidence
Buys 300mm silicon wafers from SK Siltron. - Arm Holdings Medium confidence
Uses/buys CPU-architecture IP (license and royalty) from Arm Holdings. - Cadence Design Systems Medium confidence
Uses/buys EDA tools and IP from Cadence Design Systems. - 심텍 Low confidence
Package substrates. Supply relationship inferred. - LG이노텍 Low confidence
Substrates and components. Supply relationship inferred.Mentions EN Blackridge Research Accessed Jun 19, 2026: "Components and substrates from suppliers such as LG Innotek."
Value-chain ripple (tiers 2–3)
Following node-to-node links up to 3 tiers; each firm is shown once, at its nearest tier.
Leading firms (revenue chain)
Beneficiaries (payment chain)
- T1 Samsung Electro-Mechanics, ASMPT, Hanmi Semiconductor, Hanwha Semitech, BESI, Dongjin Semichem, ASML, Applied Materials, KLA, Lam Research, Soulbrain, ENF Technology, HPSP, Wonik IPS, Jusung Engineering, Foosung, Tokyo Electron (TEL), Shin-Etsu Chemical, SUMCO Corporation, Synopsys, SK Siltron, Arm Holdings, GlobalWafers, Cadence Design Systems, Advantest, Teradyne, PSK Inc