Bonding equipment · Hybrid bonding
BESI
Netherlands-listed bonding-equipment maker. Leader in hybrid bonding for next-gen HBM, with HBM4+ adoption expanding.
BESI.AS Updated Jun 20, 2026 1 AI consumers· 1 recurring
BESI
▸ Money out정밀 부품·광학 (비공개)○계측·모션 모듈 (비공개)○
Financials & Segments
- Segments · Hybrid bonding
Revenue from
- TSMC Medium confidence· Revenue >$2B · 장기목표 · BESI long-term revenue target €1.5-1.9B
Supplies hybrid-bonding and die-attach tools to TSMC (advanced packaging).Confirms EN BESI Investor Relations Published Feb 19, 2026: "BESI long-term revenue target €1.5-1.9B, expecting new AI customers."Confirms EN Yole Group Published Aug 1, 2025: "BESI supplies hybrid-bonding tools to TSMC and others." - SK hynix Medium confidence
Next-gen hybrid bonding (HBM4+).Mentions EN TrendForce Published Dec 12, 2025: "TrendForce: BESI is expanding its hybrid-bonding share."Confirms KO ZDNet Korea Published Jul 25, 2025: "The hybrid-bonding market for next-gen HBM (HBM4+) is expanding, with BESI in the lead." - Samsung Electronics Medium confidence
Samsung is evaluating whether to adopt BESI's hybrid bonding.Confirms KO The Elec Published Apr 10, 2026: "A decision on Samsung adopting Netherlands-based BESI's hybrid bonding is expected soon." - Intel Medium confidence
Supplies hybrid-bonding and die-attach tools to Intel. - ASE Technology Medium confidence
Supplies die-attach and hybrid-bonding tools to OSATs such as ASE. - Amkor Technology Medium confidence
Supplies die-attach and hybrid-bonding tools to OSATs such as Amkor.Confirms EN BESI Investor Relations Published Feb 19, 2026: "BESI annual report: supplies tools to OSATs (Amkor, ASE) and foundries."Mentions EN Amkor Technology IR Accessed Jun 20, 2026: "Amkor is a customer buying back-end equipment and substrates."
Pays to
- 정밀 부품·광학 (비공개) Low confidence
Outsources ultra-precision motion and optics parts (suppliers undisclosed).Mentions EN BESI Investor Relations Published Feb 19, 2026: "Annual report: depends on precision-parts supply." - 계측·모션 모듈 (비공개) Low confidence
Buys metrology and motion-control modules (undisclosed).Mentions EN BESI Investor Relations Published Feb 19, 2026: "Annual report: sources parts and modules."
Value-chain ripple (tiers 2–3)
Following node-to-node links up to 3 tiers; each firm is shown once, at its nearest tier.