Custom AI ASIC · Networking · Infra software

Broadcom

Co-designs and co-develops custom AI chips such as Google’s TPU, alongside networking chips and VMware software. AI-semiconductor revenue is surging (Q2 FY2026 $10.8B, +143%; total revenue $22.2B). FY2026 AI revenue guidance raised to $56B. Chips are fabbed at TSMC; HBM from SK hynix, Samsung and Micron.

AVGO Updated Jun 21, 2026 1 AI consumers· 1 recurring

Money in ▸Alphabet (Google)●Revenue ~$10.8B Meta Platforms●Arista Networks●Anthropic◐Apple◐

BroadcomInfra software $27B

▸ Money outTSMC●SK hynix●Synopsys●Cadence Design Systems●Samsung Electronics◐Micron Technology◐Samsung Electro-Mechanics◐United Microelectronics (UMC)◐Arm Holdings◐

Financials & Segments

Total revenue · Infra software $27B (FY2025) + semiconductors. AI semis $10.8B/quarter (+143%, Q2 FY2026), FY2026 AI guidance $56B
Customer concentration · Top 5 customers 40%, one distributor 32% (FY2025)
Segments · Semiconductor Solutions · Infrastructure Software($27B)

Revenue from

Alphabet (Google) High confidence· Revenue ~$10.8B · FY26 Q2 · AI-semi quarterly revenue (Google is the largest share)
Largest custom AI chip customer, co-designing the TPU (made by TSMC).
Confirms EN SEC EDGAR Published Jun 3, 2026: "Q2 FY2026 AI-semiconductor revenue of $10.8B (+143%), driven by custom AI accelerators and networking; FY2026 AI guidance $56B."
Confirms KO Seoul Economic Daily Published Mar 6, 2026: "Broadcom's AI chip revenue surges (Google and Meta custom chips)."
Confirms KO ZDNet Korea Published Nov 25, 2025: "Google opens its Broadcom co-designed AI chip (TPU) externally, spreading to Meta and Anthropic."
Meta Platforms High confidence
Adopts Google's TPU and develops its own AI chips with Broadcom.
Confirms KO Korea Economic Daily Published Nov 25, 2025: "Meta invests in Google's Tensor chip (TPU) as a GPU alternative."
Arista Networks High confidence
Supplies switch silicon (Tomahawk/Jericho) to Arista Networks.
Confirms KO ITWorld Published Aug 1, 2025: "Meta builds AI clusters on the 7700R4."
Confirms EN SEC EDGAR Published Feb 18, 2025: "10-K: Ethernet-switch revenue concentrated in MS and Meta."
Confirms EN Arista Published Feb 18, 2025: "2024 revenue $7B (+19.5%); cloud titans 48%."
Anthropic Medium confidence
Adopting Google's AI chip (TPU), adding to demand for Broadcom's custom silicon.
Mentions KO ZDNet Korea Published Nov 25, 2025: "Anthropic adopts Google's AI chip, accelerating the move beyond NVIDIA."
Apple Medium confidence
Supplies wireless and RF parts; Apple is one of Broadcom's largest customers.
Mentions EN SEC EDGAR Published Dec 18, 2025: "Broadcom 10-K: top 5 customers 40% (including Apple)."

Pays to

TSMC High confidence
Wafer foundry for TPU and custom AI chips; most front-end is outsourced.
Confirms EN SEC EDGAR Published Dec 18, 2025: "Broadcom 10-K: outsources the majority of front-end wafer manufacturing to external foundries including TSMC."
Confirms KO Digital Daily Published Dec 1, 2025: "TSMC manufactures the TPU co-designed by Google and Broadcom."
SK hynix High confidence
Buys HBM at large scale for custom AI accelerators.
Confirms KO ZDNet Korea Published Mar 5, 2026: "Broadcom's AI chip growth drives Samsung and SK HBM demand."
Confirms KO The Elec Published May 20, 2025: "SK hynix supplies HBM to Broadcom at large scale."
Synopsys High confidence
Uses/buys EDA tools and IP from Synopsys.
Confirms KO Seoul Economic Daily Published Jul 1, 2025: "Samsung and others use Synopsys EDA."
Confirms EN SEC EDGAR Published Dec 18, 2024: "10-K: EDA tools/IP revenue and major chip customers."
Confirms EN SemiAnalysis Published Jun 1, 2024: "Synopsys leads EDA at ~31%."
Cadence Design Systems High confidence
Uses/buys EDA tools and IP from Cadence Design Systems.
Confirms KO Seoul Economic Daily Published Mar 1, 2025: "Cadence grows on AI-chip design."
Confirms EN SEC EDGAR Published Feb 24, 2025: "10-K: EDA tools/IP revenue."
Confirms EN SemiAnalysis Published Jun 1, 2024: "Cadence is No.2 in EDA at ~30%."
Samsung Electronics Medium confidence
HBM supplier for AI accelerators.
Confirms KO Seoul Economic Daily Published Mar 6, 2026: "Broadcom's AI revenue surge opens a door for Samsung HBM."
Micron Technology Medium confidence
HBM supplier for AI accelerators.
Mentions KO ZDNet Korea Published Mar 5, 2026: "Demand for Samsung, SK and Micron HBM expands with Broadcom's AI chips."
Samsung Electro-Mechanics Medium confidence
Sources advanced AI-accelerator FC-BGA from Samsung Electro-Mechanics from 2H 2026.
Mentions KO DART (FSS Electronic Disclosure) Published Mar 10, 2026: "Samsung Electro-Mechanics business report: Package Solutions (FC-BGA) and Components (MLCC). FY2025 revenue ₩11.3T."
Confirms KO The Elec Published Jan 31, 2026: "Samsung Electro-Mechanics added Broadcom to FC-BGA customers (after NVIDIA, AMD, Google, Amazon, Apple), supplying AI-accelerator substrates."
United Microelectronics (UMC) Medium confidence
Fabricates some communications/specialty chips at UMC mature nodes.
Mentions EN SMBOM Accessed Jun 20, 2026: "Broadcom is a UMC foundry customer."
Arm Holdings Medium confidence
Uses/buys CPU-architecture IP (license and royalty) from Arm Holdings.
Confirms KO Economy6 Published Jan 15, 2026: "Apple, Qualcomm, Samsung, NVIDIA use ARM IP."
Confirms EN Arm IR Published Jul 1, 2024: "FY2024 revenue $3.23B."
Confirms EN SEC EDGAR Published May 22, 2024: "20-F: licensing and royalty revenue."

Value-chain ripple (tiers 2–3)

Following node-to-node links up to 3 tiers; each firm is shown once, at its nearest tier.

Leading firms (revenue chain)

T1 Meta Platforms, Apple, Alphabet (Google), Arista Networks
T2 Microsoft, Amazon

Beneficiaries (payment chain)

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