World No.1 in dicing and grinding equipment
Disco Corporation
World No.1 in dicing/grinding/polishing equipment (60–70% share), bundling tools, consumable blades and service. Essential to TSMC, Samsung, SK hynix, ASE and Amkor. FY revenue ~$2.9B.
6146.T Updated Jun 21, 2026
Annual return · 2026-06-19'21-6.6%'22+27.7%'23+218.5%'24+11.6%'25+49.6%YTD+29%
Disco CorporationWorld No.1 in dicing and grinding equipment
▸ Money out설비·인프라 (비공개)○블레이드 소재·부품 (비공개)○
Financials & Segments
- Total revenue · World No.1 in dicing and grinding equipment
- Segments · World No.1 in dicing and grinding equipment
Revenue from
- TSMC High confidence· Market share >65 · 2024 · global dicing/grinding share
Supplies dicing and grinding equipment to TSMC. - ASE Technology Medium confidence
Supplies dicing and grinding equipment to ASE테크놀로지.Confirms EN SemiAnalysis Published Jan 1, 2025: "Supplies dicing and grinding equipment to ASE테크놀로지." - Amkor Technology Medium confidence
Supplies dicing and grinding equipment to 앰코테크놀로지.Confirms EN SemiAnalysis Published Jan 1, 2025: "Supplies dicing and grinding equipment to 앰코테크놀로지." - Samsung Electronics Medium confidence
Supplies dicing and grinding equipment to 삼성전자.Confirms JA EDINET / company IR Published Jun 24, 2025: "Annual securities report: revenue, customers, business." - SK hynix Medium confidence
Supplies dicing and grinding equipment to SK하이닉스.
Pays to
- 설비·인프라 (비공개) Low confidence
Equipment and infrastructure (undisclosed). - 블레이드 소재·부품 (비공개) Low confidence
Parts, materials and R&D (undisclosed).
Value-chain ripple (tiers 2–3)
Following node-to-node links up to 3 tiers; each firm is shown once, at its nearest tier.
| Company | Chain | '21 | '22 | '23 | '24 | '25 | YTD |
|---|---|---|---|---|---|---|---|
| SK hynix | lead3 | -0.4 | -25.6 | +53.9 | +48.6 | +361.1 | +204.7 |
| Samsung Electronics | lead3 | -9 | -14.2 | +20.9 | -26.4 | +212.9 | +121 |
| CoreWeave | lead3 | · | · | · | · | · | +64.7 |
| Arista Networks | lead3 | +97.9 | -15.6 | +94.1 | +87.7 | +18.5 | +29.5 |
| Foxconn (Hon Hai) | lead3 | -5.1 | +2.8 | +7.8 | +80.1 | +26.9 | +21.8 |
| Alphabet (Google) | lead3 | +65.3 | -39.1 | +58.3 | +35.8 | +66.1 | +17.8 |
| Amazon | lead3 | +2.4 | -49.6 | +80.9 | +44.4 | +5.2 | +5.9 |
| Super Micro | lead3 | +38.8 | +86.8 | +246.2 | +7.2 | -4 | +4.7 |
| Meta Platforms | lead3 | +23.1 | -64.2 | +194.1 | +65.9 | +13.1 | -12.3 |
| Microsoft | lead3 | +52.5 | -28 | +58.2 | +12.9 | +15.6 | -21.2 |
| Marvell | lead2 | +84.9 | -57.5 | +63.7 | +83.8 | -22.8 | +265.9 |
| Intel | lead2 | +6.1 | -46.6 | +94.6 | -59.6 | +84 | +263.1 |
| MediaTek | lead2 | +27.8 | -26.6 | +49 | +59.1 | +25.1 | +154.3 |
| AMD | lead2 | +56.9 | -55 | +127.6 | -18.1 | +77.3 | +150.9 |
| Astera Labs | lead2 | · | · | · | · | +25.6 | +150.7 |
| Credo Technology | lead2 | · | · | +46.3 | +245.2 | +114.1 | +88.9 |
| Global Unichip | lead2 | +21.4 | +67.6 | +99.4 | -13.7 | +101.4 | +86.3 |
| Renesas Electronics | lead2 | +8.2 | +2.4 | +88 | -13.6 | +23.8 | +83.8 |
| NXP Semiconductors | lead2 | +44.8 | -29.4 | +48.4 | -8 | +6.4 | +45.7 |
| Alchip Technologies | lead2 | +14.3 | -8.7 | +365.1 | -18.9 | +0.8 | +40.2 |
| Qualcomm | lead2 | +22.3 | -38.4 | +35.1 | +7.7 | +13.9 | +34.2 |
| Broadcom | lead2 | +56.8 | -13.4 | +104.9 | +110.9 | +50.7 | +19.3 |
| NVIDIA | lead2 | +125.5 | -50.3 | +239 | +171.3 | +38.9 | +13.1 |
| Apple | lead2 | +34.6 | -26.4 | +49 | +30.7 | +9.1 | +9.8 |
| Sony Semiconductor Solutions | lead2 | +27.2 | -8.4 | +27.8 | +17.9 | +1 | -8.7 |
| ASE Technology | lead1 | +38.3 | -12.8 | +60.9 | +10.1 | +65.6 | +151.9 |
| Amkor Technology | lead1 | +65.6 | -2.4 | +40.3 | -22 | +58.4 | +130.3 |
| TSMC | lead1 | +12.1 | -36.8 | +42.5 | +92.9 | +56 | +53.3 |
| Disco Corporation | node | -6.6 | +27.7 | +218.5 | +11.6 | +49.6 | +29 |
YTD as of 2026-06-19 · source: Yahoo Finance