Semiconductors · Memory · HBM
SK hynix
The leader in HBM (high-bandwidth memory), supplying the memory inside AI accelerators on a near-exclusive basis. Revenue is heavily concentrated in a few AI-chip customers; cost flows to HBM bonding-equipment suppliers.
000660.KS Updated Jun 21, 2026 1 AI consumers· 1 recurring
Money in ▸NVIDIA●Revenue share ~27%Broadcom●Apple●Alphabet (Google)◐AMD◐Marvell◐Meta Platforms◐Amazon◐
SK hynix₩97.1T
▸ Money outHanmi Semiconductor●Contract value ₩44.2BASMPT●Supply share ~50%ASML●Soulbrain●ENF Technology●Wonik IPS●Jusung Engineering●Foosung●HPSP●PSK Inc●Tokyo Electron (TEL)●Shin-Etsu Chemical●SK Siltron●Advantest●Teradyne●SUMCO Corporation●Hanwha Semitech◐BESI◐Applied Materials◐KLA◐Lam Research◐Dongjin Semichem◐GlobalWafers◐
Financials & Segments
- Total revenue · ₩97.1T (FY2025 consolidated)
- Operating profit · ₩47.2T
- Net income · ₩42.9T
- Customer concentration · Largest single customer NVIDIA ~27% (1H2025 consolidated, ~₩11T)
- Segments · Semiconductors(>90%)
Revenue from
- NVIDIA High confidence· Revenue share ~27% · 1H2025 · consolidated · ≈₩11T
HBM, DRAM, NAND. 2026 capacity effectively sold out.Mentions KO DART (FSS Electronic Disclosure) Published Mar 17, 2026: "SK business report (primary): major customers are set by monthly/quarterly agreement, names not disclosed. Semiconductors are 90%+ of revenue, FY2025 revenue about ₩97.1T, with world-first HBM4 mass production and customer shipment. The name 'NVIDIA' is inferred from media, not disclosed in the filing."Confirms EN SEC EDGAR Published Feb 26, 2026: "NVIDIA 10-K (FY2026): "We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung." Buyer-side primary filing confirming SK hynix to NVIDIA memory supply."Confirms EN TrendForce Published Aug 18, 2025: "NVIDIA accounts for about 27% (~₩11T) of SK hynix's 1H25 consolidated revenue."Confirms KO Aju Business Daily Published Aug 18, 2025: "First-half revenue from the single major customer (NVIDIA) was ₩10.8906T, about 27% of consolidated revenue."Confirms EN Notebookcheck Accessed Jun 19, 2026: "SK hynix has effectively sold out its 2026 capacity to NVIDIA orders." - Broadcom High confidence
Supplies HBM at large scale for Broadcom's custom AI accelerators. - Apple High confidence
Supplies iPhone memory (LPDDR/NAND) to Apple.Confirms KO Korea Economic Daily Published Dec 21, 2025: "The iPhone gets LPDDR from all three memory makers: Samsung, SK and Micron." - Alphabet (Google) Medium confidence
HBM/memory demand for AI cloud. - AMD Medium confidence
HBM customer for AI accelerators.Mentions EN Notebookcheck Accessed Jun 19, 2026: "Supplies HBM to global AI customers such as NVIDIA and Google." - Marvell Medium confidence
Custom HBM collaboration for Marvell's custom AI chips.Confirms KO Korea Economic Daily Published Dec 11, 2024: "Marvell works with Samsung and SK hynix on custom HBM." - Meta Platforms Medium confidence
Supplies HBM for Meta's MTIA (288GB) and data-center memory. - Amazon Medium confidence
Supplies HBM3e for Amazon’s Trainium3 (144GB) and data-center memory.
Pays to
- Hanmi Semiconductor High confidence· Contract value ₩44.2B · 2026-06-08 · Single-supply contract (latest)
HBM TC bonder. Four single-supply contracts in the past year (₩42.8B→₩1.6B→₩9.7B→₩44.2B), up to 7.66% of Hanmi's revenue.Confirms KO DART (FSS Electronic Disclosure) Published Jun 8, 2026: "Counterparty SK hynix, contract value ₩44,200,000,000, 7.66% of Hanmi's recent revenue, starting 2026-06-08."Confirms KO DART (FSS Electronic Disclosure) Published Jan 14, 2026: "Counterparty SK hynix, contract value ₩9,650,000,000, 1.73% of Hanmi's recent revenue, starting 2026-01-14."Confirms KO DART (FSS Electronic Disclosure) Published Nov 14, 2025: "Counterparty SK hynix, contract value ₩1,567,500,000, 0.28% of Hanmi's recent revenue, starting 2025-11-14."Confirms KO DART (FSS Electronic Disclosure) Published May 16, 2025: "Counterparty SK hynix, contract value ₩42,812,000,000, 7.66% of Hanmi's recent revenue, starting 2025-05-16."Confirms EN The Elec Accessed Jun 19, 2026: "Hanmi Semiconductor signed a TC bonder (Griffin) supply contract with SK hynix for HBM4." - ASMPT High confidence· Supply share ~50% · 2026
HBM4 TC bonder. About half of current orders.Confirms EN TrendForce Published Dec 12, 2025: "ASMPT supplies about half of SK hynix's roughly 50 HBM4 TC bonders." - ASML High confidence
Buys EUV lithography from ASML (a major customer).Confirms EN Seoul Economic Daily Published Apr 17, 2026: "Samsung and SK secured two-thirds of ASML's 2025 EUV shipments." - Soulbrain High confidence
Buys high-purity HF and etchants from Soulbrain (HBM/3D NAND). - ENF Technology High confidence
Buys localized HF, BOE and etchant from ENF (NAND/HBM). - Wonik IPS High confidence
Buys wafer-fab deposition tools from Wonik IPS. - Jusung Engineering High confidence
Buys all next-gen high-k DRAM ALD tools from Jusung Engineering. - Foosung High confidence
Buys C4F6/WF6 specialty gases from Foosung (WF6 surges with 3D NAND). - HPSP High confidence
Buys high-pressure hydrogen annealing tools from HPSP (sole supplier).Confirms KO Korea Economic Daily Published Jul 13, 2025: "SK하이닉스 adopts HPSP high-pressure annealing tools." - PSK Inc High confidence
Buys dry-strip tools from PSK (HBM/DDR5). - Tokyo Electron (TEL) High confidence
Buys coater, etch, deposition and clean tools from Tokyo Electron. - Shin-Etsu Chemical High confidence
Buys 300mm silicon wafers from Shin-Etsu Chemical under LTA.Confirms KO ICN Magazine Published Jan 15, 2026: "SK하이닉스 depends on Shin-Etsu Chemical for wafer supply." - SK Siltron High confidence
Buys 300mm and HBM4 wafers from affiliate SK Siltron.Confirms KO ICN Magazine Published Jan 15, 2026: "SK hynix secures HBM4 wafers early with SK Siltron." - Advantest High confidence
Buys test equipment (ATE) from Advantest. - Teradyne High confidence
Buys test equipment (ATE) from Teradyne. - SUMCO Corporation High confidence
Buys 300mm silicon wafers from SUMCO Corporation under LTA.Confirms KO ICN Magazine Published Jan 15, 2026: "SK하이닉스 depends on SUMCO Corporation for wafer supply." - Hanwha Semitech Medium confidence
Entering TC bonder supply.Mentions EN TrendForce Published Dec 12, 2025: "Hanwha Semitech entered the TC bonder supply chain this year." - BESI Medium confidence
Expanding bonder share.Mentions EN TrendForce Published Dec 12, 2025: "BESI and ASMPT are gaining share from Korean suppliers." - Applied Materials Medium confidence
Buys Applied Materials wafer-fab tools (memory/HBM). - KLA Medium confidence
Buys KLA memory inspection/metrology tools. - Lam Research Medium confidence
Buys Lam Research memory etch/deposition tools. - Dongjin Semichem Medium confidence
Buys materials such as HBM CMP slurry from Dongjin Semichem. - GlobalWafers Medium confidence
Uses/buys 300mm silicon wafers from GlobalWafers.Confirms EN Mordor Intelligence Published Jan 1, 2025: "Top-five 300mm oligopoly; GlobalWafers ~15%."
Value-chain ripple (tiers 2–3)
Following node-to-node links up to 3 tiers; each firm is shown once, at its nearest tier.
Leading firms (revenue chain)
Beneficiaries (payment chain)
- T1 Hanmi Semiconductor, ASMPT, Hanwha Semitech, BESI, ASML, Applied Materials, KLA, Lam Research, Dongjin Semichem, Soulbrain, ENF Technology, Wonik IPS, Jusung Engineering, Foosung, HPSP, PSK Inc, Tokyo Electron (TEL), Shin-Etsu Chemical, SK Siltron, GlobalWafers, Advantest, Teradyne, SUMCO Corporation