Back-end packaging and bonding equipment

ASMPT

Hong Kong-listed global back-end equipment maker. Newly won SK hynix HBM4 TC bonder orders, splitting volume with Hanmi.

0522.HK Updated Jun 21, 2026 1 AI consumers· 1 recurring

ASMPT

▸ Money out정밀 모션·광학·정렬 모듈 (비공개)○본더 서브시스템·제어 (비공개)○

Financials & Segments

SK hynix High confidence· Supply share ~50% · HBM4 2026 · SK HBM4 TC bonder orders
HBM4 TC bonder orders. About half of current order volume.
Confirms EN TrendForce Published Dec 12, 2025: "TrendForce: SK hynix ordered HBM4 TC bonders from ASMPT, split with Hanmi."
Confirms KO The Elec Published Sep 10, 2025: "SK hynix placed a new order with ASMPT for 7 HBM4 TC bonders (about ₩300B)."
Confirms EN ASMPT / HKEX Published Feb 28, 2025: "2024 results: record TCB revenue and bookings, HBM breakthrough (Q4 bulk order); AP revenue +23% to ~$505M."
Samsung Electronics Medium confidence
Supplies TC bonders for Samsung's HBM lines.
Amkor Technology Medium confidence
Supplies back-end packaging tools to OSATs such as Amkor.
Mentions EN Amkor Technology IR Accessed Jun 20, 2026: "Amkor is a customer buying back-end equipment and substrates."
ASE Technology Medium confidence
Supplies back-end packaging tools to OSATs such as ASE.
Mentions EN SEC EDGAR Published Apr 1, 2026: "ASE is a customer buying back-end equipment."

정밀 모션·광학·정렬 모듈 (비공개) Low confidence
Buys precision motion, optics and alignment modules for bonders (undisclosed).
Mentions EN ASMPT / HKEX Published Feb 28, 2025: "Results: component and module costs."
본더 서브시스템·제어 (비공개) Low confidence
Outsources thermocompression heads and control subsystems (undisclosed).
Mentions EN ASMPT / HKEX Published Feb 28, 2025: "Results: outsourced subsystems."

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