OSAT (packaging & test)
Amkor Technology
The largest US-headquartered OSAT (outsourced packaging and test). FY2025 revenue $6.7B. Its largest customer is Apple, whose chips it has packaged for over a decade; its $7B Arizona campus will package Apple silicon made at TSMC. Buys packaging equipment from ASMPT and BESI and substrates from suppliers such as Samsung Electro-Mechanics.
AMKR Updated Jun 20, 2026 1 AI consumers
Amkor TechnologyFY2025 revenue $6.7B
Financials & Segments
- Total revenue · FY2025 revenue $6.7B
- Customer concentration · Largest customer Apple (10+ years). $7B Arizona campus to package Apple silicon and Nvidia.
- Segments · Advanced packaging · Mainstream packaging · Test
Revenue from
- 팹리스·IDM 고객 (NVIDIA 등) High confidence· Revenue $6.7B · FY2025 · annual total revenue
Packages and tests chips for fabless and IDM customers such as Nvidia (incl. the Arizona campus).Mentions EN Amkor Technology IR Accessed Jun 20, 2026: "Arizona campus to support Apple and Nvidia." - Apple High confidence
Amkor’s largest customer: has packaged Apple chips for 10+ years and will package TSMC-made Apple silicon at its Arizona campus.Confirms KO Electronic Times Published Nov 19, 2025: "Amkor’s Songdo K5 handles Apple chip back-end; expanding AI packaging investment."Confirms EN DigiTimes Published Dec 1, 2023: "Apple to be the first customer of Amkor’s US advanced packaging."Confirms EN Amkor Technology IR Accessed Jun 20, 2026: "Apple is Amkor’s first and largest customer."
Pays to
- ASMPT Medium confidence
Buys die/wire bonders and back-end packaging tools from ASMPT.Mentions EN SEC EDGAR Published Feb 20, 2026: "10-K: buys back-end equipment and substrates from key suppliers." - BESI Medium confidence
Buys die-attach and hybrid-bonding tools from BESI.Mentions EN SEC EDGAR Published Feb 20, 2026: "10-K: buys back-end equipment and substrates from key suppliers." - Samsung Electro-Mechanics Medium confidence
Buys package substrates (FC-BGA, etc.) from suppliers such as Samsung Electro-Mechanics.Mentions EN SEC EDGAR Published Feb 20, 2026: "10-K: buys back-end equipment and substrates from key suppliers." - 리드프레임·소재 (비공개) Low confidence
Buys leadframes, bonding wire and molding materials (suppliers undisclosed).
Value-chain ripple (tiers 2–3)
Following node-to-node links up to 3 tiers; each firm is shown once, at its nearest tier.
Leading firms (revenue chain)
- T1 Apple