FC-BGA substrate · MLCC · Components

Samsung Electro-Mechanics

A component maker of FC-BGA semiconductor substrates and MLCC for AI accelerators. Began supplying AI-accelerator substrates in Q2 2025, shipping to NVIDIA, AMD, Apple and Marvell, with Broadcom added as a new customer for 2H 2026. FY2025 revenue ₩11.3T (operating profit ₩913B).

009150.KS Updated Jun 21, 2026 1 AI consumers· 1 recurring

Money in ▸Samsung Electronics●Revenue share ~28.6NVIDIA●AMD●Broadcom◐Apple◐Marvell◐Amkor Technology◐ASE Technology◐
Samsung Electro-Mechanics₩11.3T
▸ Money out소재 공급사 (구리박·세라믹분말)○MLCC 적층·소성 장비 (비공개)○

Financials & Segments

  • Total revenue · ₩11.3T (FY2025 consolidated; operating profit ₩913B, net income ₩731B)
  • Operating profit · ₩913.3B
  • Net income · ₩731B
  • Customer concentration · Surging demand for AI-server FC-BGA and MLCC. Big tech's in-house chips drive substrate demand.
  • Segments · Package Solutions · Components · Optics & Communication

Revenue from

  • Samsung Electronics High confidence· Revenue share ~28.6 · 2021 · Samsung’s share of Samsung Electro-Mechanics revenue
    Supplies MLCCs, IC substrates and camera modules to Samsung Electronics, its largest customer (~29%, diversifying).
    Confirms KO CEO Score Daily Published Mar 11, 2026: "Samsung-related revenue ~KRW 3tn, ~29% (2021), now diversifying."
    Mentions KO DART (FSS Electronic Disclosure) Published Mar 10, 2026: "Samsung Electro-Mechanics business report: Package Solutions (FC-BGA) and Components (MLCC). FY2025 revenue ₩11.3T."
    Confirms KO The Elec Published Jan 31, 2026: "Samsung Electro-Mechanics added Broadcom to FC-BGA customers (after NVIDIA, AMD, Google, Amazon, Apple), supplying AI-accelerator substrates."
    Confirms KO IB Tomato Published Sep 1, 2025: "World No.2 in MLCC (~25%, after Murata ~40%); 2024 MLCC revenue KRW 4.46tn."
  • NVIDIA High confidence
    Supplies FC-BGA substrates for AI accelerators.
    Mentions KO DART (FSS Electronic Disclosure) Published Mar 10, 2026: "Samsung Electro-Mechanics business report: Package Solutions (FC-BGA) and Components (MLCC). FY2025 revenue ₩11.3T."
    Confirms KO The Elec Published Jan 31, 2026: "Samsung Electro-Mechanics added Broadcom to FC-BGA customers (after NVIDIA, AMD, Google, Amazon, Apple), supplying AI-accelerator substrates."
  • AMD High confidence
    Supplies FC-BGA substrates for AI accelerators (MI series).
    Mentions KO DART (FSS Electronic Disclosure) Published Mar 10, 2026: "Samsung Electro-Mechanics business report: Package Solutions (FC-BGA) and Components (MLCC). FY2025 revenue ₩11.3T."
    Confirms KO The Elec Published Jan 31, 2026: "Samsung Electro-Mechanics added Broadcom to FC-BGA customers (after NVIDIA, AMD, Google, Amazon, Apple), supplying AI-accelerator substrates."
  • Broadcom Medium confidence
    New FC-BGA supply for advanced AI accelerators from 2H 2026.
    Mentions KO DART (FSS Electronic Disclosure) Published Mar 10, 2026: "Samsung Electro-Mechanics business report: Package Solutions (FC-BGA) and Components (MLCC). FY2025 revenue ₩11.3T."
    Confirms KO The Elec Published Jan 31, 2026: "Samsung Electro-Mechanics added Broadcom to FC-BGA customers (after NVIDIA, AMD, Google, Amazon, Apple), supplying AI-accelerator substrates."
  • Apple Medium confidence
    Supplies MLCC, substrates and other parts.
    Mentions KO DART (FSS Electronic Disclosure) Published Mar 10, 2026: "Samsung Electro-Mechanics business report: Package Solutions (FC-BGA) and Components (MLCC). FY2025 revenue ₩11.3T."
    Confirms KO The Elec Published Jan 31, 2026: "Samsung Electro-Mechanics added Broadcom to FC-BGA customers (after NVIDIA, AMD, Google, Amazon, Apple), supplying AI-accelerator substrates."
  • Marvell Medium confidence
    Supplies silicon capacitors for AI accelerators.
    Mentions KO DART (FSS Electronic Disclosure) Published Mar 10, 2026: "Samsung Electro-Mechanics business report: Package Solutions (FC-BGA) and Components (MLCC). FY2025 revenue ₩11.3T."
    Confirms KO The Elec Published Jan 31, 2026: "Samsung Electro-Mechanics added Broadcom to FC-BGA customers (after NVIDIA, AMD, Google, Amazon, Apple), supplying AI-accelerator substrates."
  • Amkor Technology Medium confidence
    Supplies package substrates to OSATs and packaging houses such as Amkor.
    Mentions EN Amkor Technology IR Accessed Jun 20, 2026: "Amkor is a customer buying back-end equipment and substrates."
  • ASE Technology Medium confidence
    Supplies package substrates to OSATs such as ASE.
    Mentions EN SEC EDGAR Published Apr 1, 2026: "ASE sources package substrates."

Pays to

  • 소재 공급사 (구리박·세라믹분말) Low confidence
    Buys raw materials for FC-BGA and MLCC (copper foil, ceramic powder, etc.). Suppliers not disclosed.
    Mentions KO DART (FSS Electronic Disclosure) Published Mar 10, 2026: "Samsung Electro-Mechanics business report: purchases of key raw materials (ceramic powder, copper foil, etc.)."
  • MLCC 적층·소성 장비 (비공개) Low confidence
    Invests in MLCC stacking, sintering and electrode equipment (undisclosed).
    Mentions KO IB Tomato Published Sep 1, 2025: "Expanding MLCC capex."

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