KOSDAQ · Semiconductor substrates · expanding into HBM

Simmtech

A specialist in memory package substrates (FC-CSP, SiP), supplying memory makers Samsung, SK Hynix, Micron and Intel while expanding into HBM substrates. The thesis is the HBM supercycle — HBM and high-capacity DRAM expansion lift demand for high-value substrates, and because substrates are a bottleneck component, price and utilization leverage are high. But with the business tied to a single memory end-market, it fully absorbs the volatility of the memory capex cycle.

222800.KQ Updated Jul 12, 2026 5 AI consumers· 1 recurring

Per the valuechain.wiki graph, Simmtech is directly linked to 4 companies (0 supply, 4 revenue relationships) and reaches 17 companies within two hops; the links are backed by 4 dated sources, 1 of them primary filings (as of 2026-07-12).

Annual return · 2026-06-30'21+119.6%'22-34.6%'23+12.4%'24-63.3%'25+392.9%YTD+94.9%
SimmtechFY2025 consolidated revenue KRW 1,410.6bn
Money outraw materials (undisclosed)equipment & R&D (undisclosed)

Financials & Segments

  • Total revenue · FY2025 consolidated revenue KRW 1,410.6bn (+14.5%), operating profit KRW 11.9bn (turnaround)
  • Segments · Memory package substrates (FC-CSP, SiP)

Revenue from

  • SK hynix High confidence
    Supplies substrates for SK Hynix HBM/DRAM — a bottleneck-component demand point in HBM capacity expansion.
    Mentions KO Kyobo Securities / brokerages Published May 15, 2026: Brokerages — Simmtech price hikes + SOCAMM2 ramp; 2026 op profit KRW 120-154bn (Kyobo target KRW 135,000)
    Confirms KO FSS DART / Simmtech Published Mar 17, 2026: Simmtech Annual Report FY2025 (DART)
    Confirms EN Simmtech Published May 1, 2025: Simmtech IR
    Confirms KO TheElec Published Jan 1, 2025: Substrate makers grow
  • Samsung Electronics High confidence
    Supplies substrates for Samsung memory packages — HBM/DRAM expansion lifts demand for high-value substrates.
    Confirms KO FSS DART / Simmtech Published Mar 17, 2026: Simmtech Annual Report FY2025 (DART)
    Confirms EN Simmtech Published May 1, 2025: Simmtech IR
    Confirms KO TheElec Published Jan 1, 2025: Substrate makers grow
  • Intel Medium confidence
    Supplies package substrates for Intel — a customer-diversification point across memory/logic packages.
    Confirms KO FSS DART / Simmtech Published Mar 17, 2026: Simmtech Annual Report FY2025 (DART)
    Confirms EN Simmtech Published May 1, 2025: Simmtech IR
    Confirms KO TheElec Published Jan 1, 2025: Substrate makers grow
  • Micron Technology Medium confidence
    Supplies substrates for Micron memory — tied to the memory capex cycle.
    Confirms KO FSS DART / Simmtech Published Mar 17, 2026: Simmtech Annual Report FY2025 (DART)
    Confirms EN Simmtech Published May 1, 2025: Simmtech IR
    Confirms KO TheElec Published Jan 1, 2025: Substrate makers grow

Pays to

  • raw materials (undisclosed) Low confidence
    Raw materials for memory package substrates (undisclosed).
    Confirms KO TheElec Published Jan 1, 2025: Substrate makers grow
  • equipment & R&D (undisclosed) Low confidence
    Production equipment and R&D (undisclosed).
    Confirms KO TheElec Published Jan 1, 2025: Substrate makers grow

Value-chain ripple (2 tiers)

Following node-to-node links up to 2 tiers; each firm is shown once, at its nearest tier.

CompanyChain'21'22'23'24'25YTD
Dell Technologieslead2+51.2-26.6+95.9+53+11.2+248.1
Marvelllead2+84.6-57.5+63.7+83.8-22.8+177.8
Lenovolead2-4.6-20.9+36.2+18.2-0.6+175.7
AMDlead2+56.9-55+127.6-18.1+77.3+160.5
Mercury Systemslead2-37.5-18.7-18.3+14.8+73.8+47.9
ASUSTeK Computerlead2+35.5-12.9+72+41.1-14.1+46.7
Everpure (formerly Pure Storage)lead2+44-17.8+33.3+72.3+9.1+18.4
Broadcomlead2+56.5-13.3+104.2+110.5+50.6+16
Alphabet (Google)lead2+65.3-39.1+58.3+36+66+14.3
NVIDIAlead2+125.5-50.3+239+171.2+38.9+13.3
Qualcommlead2+22.3-38.6+35.1+8.3+13.8+11.7
Phison Electronicslead2+26.8-10.7+45.1-6.7+418.3-6
Microsoftlead2+52.5-28+58.2+12.9+15.6-20
Micron Technologylead1+24.2-45.9+71.9-1+240.2+243.3
Intellead1+6.1-46.6+94.6-59.6+84+197.7
SK hynixlead1-0.4-25.6+53.9+48.6+361.1+140.3
Samsung Electronicslead1-9-14.2+20.9-26.4+212.9+77.9
Simmtechnode+119.6-34.6+12.4-63.3+392.9+94.9

YTD as of 2026-06-30 · source: Yahoo Finance

A specialist supplier of memory package substrates (FC-CSP, SiP), expanding into HBM substrates and tied to the memory supercycle. The thesis is HBM — HBM and high-capacity DRAM expansion at Samsung, SK Hynix and Micron lifts demand for high-value substrates, and as a bottleneck component substrates carry strong price and utilization leverage. Customers spread across four memory makers lower single-name risk, but the business is bound to a single memory end-market with high cycle volatility. In graph terms, memory HBM investment and utilization transmit into Simmtech substrate orders.

Analysis generated from returns as of 2026-06-30

Analyst ratings

Consensus: Buy 2 · Hold 0 · Sell 0 · Avg. target ₩167,500 · Price ₩31,750 (07-19) · Upside +428%

BrokerRatingTargetPublished
iM SecuritiesBuy₩185,000Jun 8, 2026Report
Shinhan SecuritiesBuy₩150,000May 28, 2026Report

Recent drop is sentiment-driven (warning designation, SOCAMM cut worries), not fundamental; forecasts 2026/27 OP KRW176.9bn/301.0bn, sees ~80% upside on undervaluation.

Analyses covering this node


← All companiesMarkdown · JSON

For information only, not investment advice. Content on this site is generated by AI from verified, cross-checked sources and may contain errors.

© 2026 Willow Investments, Inc.Company value-chain data · contact@willowinvt.com