CPU · Data center · Foundry

Intel

The longtime leader in PC and server CPUs, now rebuilding a foundry (Intel Foundry). First in the industry to adopt ASML's High-NA EUV for its leading-edge nodes (18A, 14A). At the same time it outsources some chip tiles to TSMC, so it is also a foundry customer.

INTC Updated Jun 21, 2026 1 AI consumers· 1 recurring

Money in ▸Dell●Lenovo●HP Inc◐Microsoft◐Alphabet (Google)◐

IntelClient Computing, Data Center & AI, Intel Foundry

▸ Money outTSMC●ASML●HPSP●Ibiden●Applied Materials◐KLA◐BESI◐PSK Inc◐Tokyo Electron (TEL)◐Shin-Etsu Chemical◐SUMCO Corporation◐Synopsys◐Cadence Design Systems◐GlobalWafers◐

Financials & Segments

Total revenue · Client Computing, Data Center & AI, Intel Foundry (three segments)
Customer concentration · Dell and Lenovo are each 10%+ customers (10-K). Winning external foundry customers is the key question.
Segments · Client Computing · Data Center & AI · Intel Foundry

Revenue from

Dell High confidence
One of the largest PC/server CPU customers (10%+ in the 10-K).
Confirms EN SEC EDGAR Published Jan 23, 2026: "Intel 10-K: Dell is a 10%+ revenue customer."
Confirms EN SEC EDGAR Published Oct 23, 2025: "FY2025 Intel Products revenue $48.9B, Foundry $17.5B."
Lenovo High confidence
Major PC CPU customer (10%+ in the 10-K).
Confirms EN SEC EDGAR Published Jan 23, 2026: "Intel 10-K: Lenovo is a 10%+ revenue customer."
HP Inc Medium confidence
Major PC CPU OEM customer.
Mentions EN SEC EDGAR Published Jan 23, 2026: "Intel 10-K: one of the major OEM customers."
Microsoft Medium confidence
Supplies Xeon CPUs for Azure servers; the ND MI300X v5 VM uses 4th-gen Xeon as host.
Confirms EN AMD Investor Relations Published May 21, 2024: "The ND MI300X v5 uses "two 4th Gen Intel Xeon Scalable processors" as host CPUs."
Alphabet (Google) Medium confidence
Won foundry orders for part of Google’s next-gen TPU volume (alternative to TSMC).
Confirms KO Herald Economy Published Jun 10, 2026: "Intel Foundry won Google AI-chip (TPU) orders."

Pays to

TSMC High confidence
Outsources some chip tiles (e.g. compute) to TSMC; a foundry customer alongside running its own foundry.
Confirms EN SEC EDGAR Published Jan 23, 2026: "Intel 10-K: incorporates external foundries into its products."
ASML High confidence
Key supplier of EUV and High-NA EUV for leading-edge nodes (18A, 14A). Intel was first in the industry to adopt High-NA.
Confirms KO Korea Economic Daily Published Apr 23, 2026: "Intel, Samsung, SK, Micron and TSMC have all ordered ASML's High-NA EUV."
Mentions EN SEC EDGAR Published Jan 23, 2026: "Intel 10-K: substantial investment in EUV lithography nodes such as Intel 18A and 14A."
Confirms KO ETNews Published Oct 16, 2024: "Intel was the first to adopt ASML's High-NA EUV (for 18A and 14A)."
HPSP High confidence
Buys high-pressure hydrogen annealing tools from HPSP (sole supplier).
Confirms KO Korea Economic Daily Published Jul 13, 2025: "Intel adopts HPSP high-pressure annealing tools."
Ibiden High confidence
Buys FC-BGA package substrates from Ibiden.
Confirms KO Jabon Published Feb 1, 2026: "¥500B expansion for NVIDIA AI substrates."
Confirms EN Ibiden Published May 1, 2025: "IR: IC package-substrate revenue."
Confirms EN DigiTimes Published Jan 2, 2025: "Exclusive FC-BGA supply to Intel and NVIDIA."
Applied Materials Medium confidence
Buys Applied Materials logic-fab tools.
Mentions EN PatentPC Accessed Jun 20, 2026: "Intel fabs use Applied Materials tools."
KLA Medium confidence
Buys KLA inspection and metrology tools.
Confirms KO KIPOST Accessed Jun 20, 2026: "KLA supplies Intel with inspection tools."
BESI Medium confidence
Buys hybrid-bonding and die-attach tools from BESI.
Confirms EN Yole Group Published Aug 1, 2025: "Intel adopts BESI hybrid-bonding tools."
PSK Inc Medium confidence
Buys dry-strip tools from PSK.
Confirms KO THE ELEC Accessed Jun 21, 2026: "Intel is a PSK customer."
Tokyo Electron (TEL) Medium confidence
Buys coater, etch, deposition and clean tools from Tokyo Electron.
Confirms KO Sisa Journal e Accessed Jun 21, 2026: "Intel adopts TEL wafer-fab tools."
Shin-Etsu Chemical Medium confidence
Buys 300mm silicon wafers from Shin-Etsu Chemical under LTA.
Confirms KO ICN Magazine Published Jan 15, 2026: "Intel depends on Shin-Etsu Chemical for wafer supply."
SUMCO Corporation Medium confidence
Buys 300mm silicon wafers from SUMCO Corporation under LTA.
Confirms KO ICN Magazine Published Jan 15, 2026: "Intel depends on SUMCO Corporation for wafer supply."
Synopsys Medium confidence
Uses/buys EDA tools and IP from Synopsys.
Confirms KO Seoul Economic Daily Published Jul 1, 2025: "Samsung and others use Synopsys EDA."
Confirms EN SEC EDGAR Published Dec 18, 2024: "10-K: EDA tools/IP revenue and major chip customers."
Confirms EN SemiAnalysis Published Jun 1, 2024: "Synopsys leads EDA at ~31%."
Cadence Design Systems Medium confidence
Uses/buys EDA tools and IP from Cadence Design Systems.
Confirms KO Seoul Economic Daily Published Mar 1, 2025: "Cadence grows on AI-chip design."
Confirms EN SEC EDGAR Published Feb 24, 2025: "10-K: EDA tools/IP revenue."
Confirms EN SemiAnalysis Published Jun 1, 2024: "Cadence is No.2 in EDA at ~30%."
GlobalWafers Medium confidence
Uses/buys 300mm silicon wafers from GlobalWafers.
Confirms EN GlobalWafers Published Mar 1, 2025: "IR: silicon-wafer revenue and customers."
Confirms EN Mordor Intelligence Published Jan 1, 2025: "Top-five 300mm oligopoly; GlobalWafers ~15%."
Confirms KO THE ELEC Published Jun 1, 2024: "Supplies wafers to TSMC, UMC, Samsung."

Value-chain ripple (tiers 2–3)

Following node-to-node links up to 3 tiers; each firm is shown once, at its nearest tier.

Leading firms (revenue chain)

T1 Microsoft, Alphabet (Google)

Beneficiaries (payment chain)

T1 TSMC, ASML, Applied Materials, KLA, BESI, HPSP, PSK Inc, Tokyo Electron (TEL), Shin-Etsu Chemical, SUMCO Corporation, Synopsys, Cadence Design Systems, GlobalWafers, Ibiden
T2 Lam Research, Teradyne, Advantest

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