Semiconductor packaging materials (back-end)

Resonac

A world-class supplier of advanced-packaging materials (films, CMP slurry, high-purity gases). 2024 semiconductor/electronic-materials revenue ~¥450B. Won a TSMC Excellent Performance Award.

4004.T Updated Jun 21, 2026

Annual return · 2026-06-19'21-2.6%'22-4%'23+37.5%'24+30.3%'25+137.9%YTD+105.5%
Money in ▸TSMC●ASE Technology◐Amkor Technology◐Samsung Electronics◐Shinko Electric Industries◐Unimicron◐AT&S○Nan Ya PCB○LG Innotek○
ResonacSemiconductor packaging materials
▸ Money out부품·소재·R&D (비공개)○설비·인프라 (비공개)○

Financials & Segments

  • Total revenue · Semiconductor packaging materials (back-end)
  • Segments · Semiconductor packaging materials (back-end)

Revenue from

  • TSMC High confidence
    Supplies packaging materials to TSMC.
    Confirms EN Resonac Published Dec 1, 2025: "Supplies packaging materials to TSMC."
    Confirms EN Resonac Published May 1, 2025: "Supplies packaging materials to TSMC."
  • ASE Technology Medium confidence
    Supplies packaging materials to ASE테크놀로지.
    Confirms EN Resonac Published Dec 1, 2025: "Supplies packaging materials to ASE테크놀로지."
    Confirms EN Resonac Published May 1, 2025: "Supplies packaging materials to ASE테크놀로지."
  • Amkor Technology Medium confidence
    Supplies packaging materials to 앰코테크놀로지.
    Confirms EN Resonac Published Dec 1, 2025: "Supplies packaging materials to 앰코테크놀로지."
    Confirms EN Resonac Published May 1, 2025: "Supplies packaging materials to 앰코테크놀로지."
  • Samsung Electronics Medium confidence
    Supplies packaging materials to 삼성전자.
    Confirms EN Resonac Published Dec 1, 2025: "Supplies packaging materials to 삼성전자."
    Confirms EN Resonac Published May 1, 2025: "Supplies packaging materials to 삼성전자."
  • Shinko Electric Industries Medium confidence
    Supplies ABF film and substrate materials to 신코덴키.
    Confirms EN Shinko Published May 1, 2025: "Supplies ABF film and substrate materials to 신코덴키."
    Confirms EN MGR Published Jan 1, 2025: "Supplies ABF film and substrate materials to 신코덴키."
  • Unimicron Medium confidence
    Supplies ABF and substrate materials to 유니마이크론.
    Confirms EN Unimicron Published May 1, 2025: "Supplies ABF and substrate materials to 유니마이크론."
    Confirms EN MGR Published Jan 1, 2025: "Supplies ABF and substrate materials to 유니마이크론."
  • AT&S Low confidence
    Supplies ABF and substrate materials to AT&S.
    Confirms KO DigitalToday Published Jun 1, 2025: "Resonac leads HBM NCF/TIM materials"
    Confirms EN AT&S Published May 1, 2025: "Supplies ABF and substrate materials to AT&S."
    Confirms JA EDINET / company IR Published Mar 26, 2025: "Annual securities report: revenue, customers, business."
    Confirms EN IMR Published Jan 1, 2025: "Supplies ABF and substrate materials to AT&S."
  • Nan Ya PCB Low confidence
    Supplies substrate materials to 난야PCB.
    Confirms EN Nan Ya PCB Published May 1, 2025: "Supplies substrate materials to 난야PCB."
    Confirms EN MatrixBCG Published Jan 1, 2025: "Supplies substrate materials to 난야PCB."
  • LG Innotek Low confidence
    Supplies ABF and substrate materials to LG이노텍.
    Confirms KO Financial News Published Jun 17, 2026: "Supplies ABF and substrate materials to LG이노텍."
    Confirms KO TechM Published Jan 1, 2025: "Supplies ABF and substrate materials to LG이노텍."

Pays to

  • 부품·소재·R&D (비공개) Low confidence
    Parts, materials and R&D (undisclosed).
    Confirms EN Resonac Published May 1, 2025: "Parts, materials and R&D (undisclosed)."
  • 설비·인프라 (비공개) Low confidence
    Production equipment and infrastructure (undisclosed).
    Confirms EN Resonac Published May 1, 2025: "Production equipment and infrastructure (undisclosed)."

Value-chain ripple (tiers 2–3)

Following node-to-node links up to 3 tiers; each firm is shown once, at its nearest tier.

CompanyChain'21'22'23'24'25YTD
SK hynixlead3-0.4-25.6+53.9+48.6+361.1+204.7
Samsung Electronicslead3-9-14.2+20.9-26.4+212.9+121
CoreWeavelead3·····+64.7
Arista Networkslead3+97.9-15.6+94.1+87.7+18.5+29.5
Foxconn (Hon Hai)lead3-5.1+2.8+7.8+80.1+26.9+21.8
Alphabet (Google)lead3+65.3-39.1+58.3+35.8+66.1+17.8
Amazonlead3+2.4-49.6+80.9+44.4+5.2+5.9
Super Microlead3+38.8+86.8+246.2+7.2-4+4.7
Meta Platformslead3+23.1-64.2+194.1+65.9+13.1-12.3
Microsoftlead3+52.5-28+58.2+12.9+15.6-21.2
Marvelllead2+84.9-57.5+63.7+83.8-22.8+265.9
Intellead2+6.1-46.6+94.6-59.6+84+263.1
MediaTeklead2+27.8-26.6+49+59.1+25.1+154.3
AMDlead2+56.9-55+127.6-18.1+77.3+150.9
Astera Labslead2····+25.6+150.7
Credo Technologylead2··+46.3+245.2+114.1+88.9
Global Unichiplead2+21.4+67.6+99.4-13.7+101.4+86.3
Renesas Electronicslead2+8.2+2.4+88-13.6+23.8+83.8
NXP Semiconductorslead2+44.8-29.4+48.4-8+6.4+45.7
Alchip Technologieslead2+14.3-8.7+365.1-18.9+0.8+40.2
Qualcommlead2+22.3-38.4+35.1+7.7+13.9+34.2
Broadcomlead2+56.8-13.4+104.9+110.9+50.7+19.3
NVIDIAlead2+125.5-50.3+239+171.3+38.9+13.1
Applelead2+34.6-26.4+49+30.7+9.1+9.8
Sony Semiconductor Solutionslead2+27.2-8.4+27.8+17.9+1-8.7
AT&Slead1+57.5-22-27.6-41.3+188.9+493.2
LG Innoteklead1+78.2-22-28.8-22.1+66.8+370.1
Unimicronlead1+133.5-30.2+35.2-19.7+175.7+155.7
ASE Technologylead1+38.3-12.8+60.9+10.1+65.6+151.9
Amkor Technologylead1+65.6-2.4+40.3-22+58.4+130.3
Nan Ya PCBlead1+110.6-46.7-0.5-38.3+188.2+125
TSMClead1+12.1-36.8+42.5+92.9+56+53.3
Resonacnode-2.6-4+37.5+30.3+137.9+105.5

YTD as of 2026-06-19 · source: Yahoo Finance

← All companiesMarkdown · JSON

For information only, not investment advice. Data is refined from public sources and may contain errors.

ValueChain.wikiCompany value-chain data