Back-end semiconductor materials · ABF film & HBM materials leader
Resonac
A world-class back-end materials maker in upstream advanced-packaging materials (ABF dielectric film, CMP slurry, high-purity gases, HBM NCF and TIM), with ~¥450bn of 2024 semiconductor/electronic-materials revenue. From foundries (TSMC, Samsung) to OSATs (ASE, Amkor) to substrate makers (Shinko, Unimicron, AT&S, Nan Ya PCB), it is a common supplier feeding nearly every step of the back-end chain, so revenue tracks total advanced-packaging volume rather than any one customer. As AI accelerators add stacking layers and HBM adoption grows, NCF/TIM/ABF turnover accelerates — exposing it to the AI packaging cycle through material consumption rather than equipment.
4004.T Updated Jul 12, 2026 5 AI consumers· 4 recurring
Per the valuechain.wiki graph, Resonac is directly linked to 9 companies (0 supply, 9 revenue relationships) and reaches 34 companies within two hops; the links are backed by 16 dated sources, 2 of them primary filings (as of 2026-07-12).
Financials & Segments
- Total revenue · Semiconductor & Electronic Materials FY2025 core operating income JPY 108.4bn (+47%), 30.2% EBITDA margin (AI back-end materials share 10%→20%)
- Segments · Semiconductor packaging materials (back-end)
Revenue from
- TSMC High confidence
Supplies back-end materials to TSMC, the No.1 foundry, with a TSMC Excellent Performance Award; a materials-side beneficiary of TSMC's advanced-packaging expansion.Mentions EN Goldman Sachs, Mizuho et al. Published Feb 15, 2026: Resonac (4004) analysts: Goldman Sachs initiates Buy (target ¥8,050); consensus BuyMentions EN Earnings briefing Published Feb 13, 2026: Resonac FY2025: Semiconductor & Electronic Materials record profit, driven by AI back-end materials - ASE Technology Medium confidence
Supplies advanced-packaging materials to ASE, the world's top OSAT; a volume-linked relationship where material consumption rises with OSAT utilization.Mentions EN Earnings briefing Published Feb 13, 2026: Resonac FY2025: Semiconductor & Electronic Materials record profit, driven by AI back-end materials - Samsung Electronics Medium confidence
Supplies back-end materials to Samsung (foundry/packaging); serving a customer that competes with TSMC gives it supplier neutrality.Mentions EN Earnings briefing Published Feb 13, 2026: Resonac FY2025: Semiconductor & Electronic Materials record profit, driven by AI back-end materials - AT&S Medium confidence
Supplies ABF and substrate materials to Austria's AT&S; Resonac also holds top share in HBM NCF/TIM.Mentions EN Earnings briefing Published Feb 13, 2026: Resonac FY2025: Semiconductor & Electronic Materials record profit, driven by AI back-end materialsConfirms KO Digital Today Published Jun 1, 2025: Deepening reliance on Japanese suppliers in the HBM4 era - Nan Ya PCB Medium confidence
Supplies IC-substrate materials to Taiwan's Nan Ya PCB — one axis of substrate-channel diversification.Mentions EN Earnings briefing Published Feb 13, 2026: Resonac FY2025: Semiconductor & Electronic Materials record profit, driven by AI back-end materials - Shinko Electric Industries Medium confidence
Supplies ABF film and substrate materials to Japan's Shinko Electric — upstream material dependency for FC-BGA substrates.Mentions EN Earnings briefing Published Feb 13, 2026: Resonac FY2025: Semiconductor & Electronic Materials record profit, driven by AI back-end materials - LG Innotek Medium confidence
Supplies ABF and substrate materials to LG Innotek's FC-BGA substrate business — a newer Korean substrate customer. - Unimicron Medium confidence
Supplies ABF and substrate materials to Unimicron, Taiwan's largest IC-substrate maker — material demand tied to substrate capacity expansion.Mentions EN Earnings briefing Published Feb 13, 2026: Resonac FY2025: Semiconductor & Electronic Materials record profit, driven by AI back-end materials - Amkor Technology Medium confidence
Supplies packaging materials to Amkor, a large OSAT with a US footprint — with ASE, one of the two OSAT-channel anchors.Mentions EN Earnings briefing Published Feb 13, 2026: Resonac FY2025: Semiconductor & Electronic Materials record profit, driven by AI back-end materials
Pays to
- components, materials & R&D (undisclosed) Low confidence
Parts, materials and R&D (undisclosed). - equipment & infrastructure (undisclosed) Low confidence
Production equipment and infrastructure (undisclosed).
Value-chain ripple (2 tiers)
Following node-to-node links up to 2 tiers; each firm is shown once, at its nearest tier.
| Company | Chain | '21 | '22 | '23 | '24 | '25 | YTD |
|---|---|---|---|---|---|---|---|
| Marvell | lead2 | +84.6 | -57.5 | +63.7 | +83.8 | -22.8 | +163.4 |
| Intel | lead2 | +6.1 | -46.6 | +94.6 | -59.6 | +84 | +159.6 |
| MediaTek | lead2 | +27.8 | -26.6 | +52.9 | +58.3 | +24.9 | +152.4 |
| AMD | lead2 | +56.9 | -55 | +127.6 | -18.1 | +77.3 | +123 |
| Global Unichip | lead2 | +21.4 | +67.6 | +99.4 | -13.7 | +101.4 | +122.8 |
| Fortinet | lead2 | +142 | -32 | +19.7 | +61.4 | -16 | +96.8 |
| Astera Labs | lead2 | · | · | · | · | +25.6 | +86.6 |
| Realtek | lead2 | +19.6 | -33.8 | +56.2 | +19.1 | -6.4 | +47.5 |
| Cisco | lead2 | +45.8 | -22.5 | +9.3 | +21 | +33.5 | +43.8 |
| Alchip Technologies | lead2 | +14.3 | -8.7 | +365.1 | -18.9 | +0.8 | +36.1 |
| Analog Devices | lead2 | +21 | -4.9 | +23.4 | +8.8 | +29.8 | +34.8 |
| Renesas Electronics | lead2 | +8.2 | +2.4 | +88 | -13.6 | +23.8 | +28.2 |
| NVIDIA | lead2 | +125.5 | -50.3 | +239 | +171.2 | +38.9 | +23.7 |
| Credo Technology | lead2 | · | · | +46.3 | +245.2 | +114.1 | +18.5 |
| Microchip Technology | lead2 | +27.5 | -18 | +30.9 | -35 | +14.6 | +18.4 |
| Sony Semiconductor Solutions | lead2 | +27.2 | -8.4 | +27.8 | +17.9 | +1 | +12.9 |
| NXP Semiconductors | lead2 | +44.8 | -29.2 | +48.4 | -8 | +6.4 | +5.9 |
| Broadcom | lead2 | +56.5 | -13.3 | +104.2 | +110.5 | +50.6 | +3.8 |
| Montage Technology | lead2 | -18.2 | -21.8 | -18 | +51.4 | +169 | +3.4 |
| Qualcomm | lead2 | +22.3 | -38.6 | +35.1 | +8.3 | +13.8 | +0.2 |
| Ambarella | lead2 | +121 | -59.5 | -25.5 | +18.7 | -2.6 | -11.2 |
| Phison Electronics | lead2 | +26.8 | -10.7 | +45.1 | -6.7 | +418.3 | -14.7 |
| Mobileye | lead2 | · | · | +23.6 | -54 | -47.6 | -18 |
| Will Semiconductor | lead2 | -12.1 | -49.7 | -8.3 | +22.8 | +15.5 | -33.7 |
| AT&S | lead1 | +57.5 | -22 | -27.6 | -41.3 | +188.9 | +334.1 |
| Nan Ya PCB | lead1 | +110.6 | -46.7 | -0.5 | -38.3 | +188.2 | +172.1 |
| Unimicron | lead1 | +133.5 | -30.2 | +35.2 | -19.7 | +175.7 | +138.8 |
| ASE Technology | lead1 | +38.3 | -12.8 | +60.9 | +10.1 | +65.6 | +135.3 |
| LG Innotek | lead1 | +78.2 | -22 | -28.8 | -22.1 | +66.8 | +130.7 |
| Samsung Electronics | lead1 | -9 | -14.2 | +20.9 | -26.4 | +212.9 | +59.7 |
| TSMC | lead1 | +12.1 | -36.7 | +42.3 | +92.6 | +55.9 | +41.9 |
| Amkor Technology | lead1 | +65.6 | -2.3 | +40.3 | -20.8 | +55.9 | +21.6 |
| Resonac | node | -2.6 | -4 | +37.5 | +30.3 | +137.9 | +73.5 |
YTD as of 2026-09-04 · source: Yahoo Finance
Resonac operates across TSE, Back-end semiconductor materials, ABF film & HBM materials leader. Momentum stayed firm and it is +73.5% in 2026. The demand side (avg +171.7%) leads the stock (+73.5%), so customer moves come first here. Among connected nodes the furthest ahead is AT&S (+334.1%) and the furthest behind is TSMC (+41.9%). If chain logic explains the gap, the laggard is the next propagation candidate; if not, the link itself deserves a second look. As AI accelerators add stacking layers and HBM adoption grows, NCF/TIM/ABF turnover accelerates — exposing it to the AI packaging cycle through material consumption rather than equipment.
Analysis generated from returns as of 2026-09-04Analyst ratings
Consensus: Buy 2 · Hold 1 · Sell 0 · Avg. target ¥21,300 · Price ¥15,530 (09-04) · Upside +37%