Fabless mobile SoC and modems (Snapdragon)
Qualcomm
The largest mobile-SoC/modem fabless firm; designs ARM-based Snapdragon and outsources to TSMC and Samsung foundries (most leading-edge volume moved to TSMC, with 2nm talks at Samsung). Supplies modems to Apple and others; depends on EDA (Synopsys, Cadence) and Arm IP.
QCOM Updated Jun 21, 2026 1 AI consumers
QualcommFY2024 revenue ~$39B
Financials & Segments
- Total revenue · FY2024 revenue ~$39B
- Customer concentration · Foundry at TSMC (+Samsung); depends on Arm IP and EDA; customers are smartphone OEMs and Apple.
- Segments · QCT (chipsets) · QTL (licensing)
Revenue from
- Apple High confidence· Revenue ~$39B · FY2024 · annual revenue
Supplies 5G modem chips to Apple. - 스마트폰 OEM (삼성·샤오미 등) High confidence
Supplies Snapdragon SoCs/modems to smartphone OEMs.
Pays to
- Arm Holdings High confidence
Uses/buys CPU-architecture IP from Arm Holdings. - TSMC High confidence
Uses/buys leading-edge foundry from TSMC. - Cadence Design Systems Medium confidence
Uses/buys EDA design tools from Cadence Design Systems. - Samsung Electronics Medium confidence
Uses/buys foundry (partial, 2nm talks) from Samsung Electronics. - Synopsys Medium confidence
Uses/buys EDA design tools from Synopsys. - RF·패키지 부품 (비공개) Low confidence
RF front-end and package parts (undisclosed).
Value-chain ripple (tiers 2–3)
Following node-to-node links up to 3 tiers; each firm is shown once, at its nearest tier.
Leading firms (revenue chain)
- T1 Apple
Beneficiaries (payment chain)
- T1 Arm Holdings, Cadence Design Systems, Samsung Electronics, TSMC, Synopsys
- T2 Samsung Electro-Mechanics, ASMPT, Hanmi Semiconductor, Hanwha Semitech, BESI, Dongjin Semichem, ASML, Applied Materials, KLA, Lam Research, Soulbrain, ENF Technology, HPSP, Wonik IPS, Jusung Engineering, Foosung, Tokyo Electron (TEL), Shin-Etsu Chemical, SUMCO Corporation, SK Siltron, GlobalWafers, Advantest, Teradyne, PSK Inc