Wire and TCB bonding equipment

Kulicke & Soffa

A wire-bonding leader and major TCB bonder supplier serving 800+ OSAT facilities; growing on AI/HPC packaging. Customers include ASE, Amkor and ASMPT.

KLIC Updated Jun 21, 2026 1 AI consumers

Annual return · 2026-06-18'21+92.6%'22-25.9%'23+25.5%'24-13.3%'25-0.3%YTD+170%
Kulicke & SoffaWire and TCB bonding equipment
Money out설비·인프라 (비공개)부품·소재·R&D (비공개)

Financials & Segments

  • Total revenue · Wire and TCB bonding equipment
  • Segments · Wire and TCB bonding equipment

Revenue from

  • Amkor Technology High confidence
    Supplies bonding equipment to 앰코테크놀로지.
    Confirms EN BRI Published Jan 1, 2025: "Supplies bonding equipment to 앰코테크놀로지."
    Confirms EN SEC EDGAR Published Nov 14, 2024: "Supplies bonding equipment to 앰코테크놀로지."
  • ASE Technology High confidence
    Supplies bonding equipment to ASE테크놀로지.
    Confirms EN BRI Published Jan 1, 2025: "Supplies bonding equipment to ASE테크놀로지."
    Confirms EN SEC EDGAR Published Nov 14, 2024: "Supplies bonding equipment to ASE테크놀로지."
  • JCET (Jiangsu Changjiang Electronics) Medium confidence
    Supplies bonding and test equipment to JCET.
    Confirms EN TrendForce Published May 13, 2025: "Supplies bonding and test equipment to JCET."
    Confirms EN JCET Published May 1, 2025: "Supplies bonding and test equipment to JCET."
  • Hana Micron Low confidence
    Supplies bonding and test equipment to 하나마이크론.
    Confirms KO Daum News Published Jun 17, 2026: "Supplies bonding and test equipment to 하나마이크론."
    Confirms EN Hana Micron Published May 1, 2025: "Supplies bonding and test equipment to 하나마이크론."
  • ASMPT Low confidence
    Supplies bonding equipment to ASMPT.
    Confirms EN BRI Published Jan 1, 2025: "Supplies bonding equipment to ASMPT."
    Confirms EN SEC EDGAR Published Nov 14, 2024: "Supplies bonding equipment to ASMPT."
  • Powertech Technology (PTI) Low confidence
    Supplies test and bonding equipment to 파워텍 (PTI).
    Confirms EN TrendForce Published May 13, 2025: "Supplies test and bonding equipment to 파워텍 (PTI)."
    Confirms EN PTI Published May 1, 2025: "Supplies test and bonding equipment to 파워텍 (PTI)."

Pays to

  • 설비·인프라 (비공개) Low confidence
    Production equipment and infrastructure (undisclosed).
    Confirms EN SEC EDGAR Published Nov 14, 2024: "Production equipment and infrastructure (undisclosed)."
  • 부품·소재·R&D (비공개) Low confidence
    Parts, materials and R&D (undisclosed).
    Confirms EN SEC EDGAR Published Nov 14, 2024: "Parts, materials and R&D (undisclosed)."

Value-chain ripple (tiers 2–3)

Following node-to-node links up to 3 tiers; each firm is shown once, at its nearest tier.

CompanyChain'21'22'23'24'25YTD
Marvelllead3+84.9-57.5+63.7+83.8-22.8+265.9
AMDlead3+56.9-55+127.6-18.1+77.3+150.9
Qualcommlead3+22.3-38.4+35.1+7.7+13.9+34.2
Broadcomlead3+56.8-13.4+104.9+110.9+50.7+19.3
Alphabet (Google)lead3+65.3-39.1+58.3+35.8+66.1+17.8
NVIDIAlead3+125.5-50.3+239+171.3+38.9+13.1
Applelead3+34.6-26.4+49+30.7+9.1+9.8
Amazonlead3+2.4-49.6+80.9+44.4+5.2+5.9
Meta Platformslead3+23.1-64.2+194.1+65.9+13.1-12.3
Micron Technologylead2+24.1-46+72.1-1+240.5+297.6
SK hynixlead2-0.4-25.6+53.9+48.6+361.1+204.7
MediaTeklead2+27.8-26.6+49+59.1+25.1+154.3
Samsung Electronicslead2-9-14.2+20.9-26.4+212.9+121
NXP Semiconductorslead2+44.8-29.4+48.4-8+6.4+45.7
ASE Technologylead1+38.3-12.8+60.9+10.1+65.6+151.9
Amkor Technologylead1+65.6-2.4+40.3-22+58.4+130.3
ASMPTlead1-29-12.4+21.8-4.8+47.6+102.3
JCET (Jiangsu Changjiang Electronics)lead1-34+0.2-15.2+73.3+28+67.8
Powertech Technology (PTI)lead1+4.8-7.5+86-16+128.6+43.1
Hana Micronlead1+109-41+143.5-52.4+269.3+29.8
Kulicke & Soffanode+92.6-25.9+25.5-13.3-0.3+170

YTD as of 2026-06-18 · source: Yahoo Finance


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