Nasdaq · Back-end equipment · #1 in wire/TCB bonding

Kulicke & Soffa

The world's #1 wire-bonding equipment maker and a major TCB (thermo-compression) bonder supplier, tied directly to the capacity-expansion cycle of 800-plus back-end (OSAT) fabs. The growth thesis is a generational shift in packaging — as AI/HPC chips move from wire bonding to TCB and hybrid bonding, they create tool-replacement demand, with large OSATs like ASE, Amkor and JCET the channel for it. The crux is that this demand is tied to the volatile back-end capex cycle, and the race with ASMPT and BESI to own the next-gen hybrid-bonding standard.

KLIC Updated Jul 12, 2026 4 AI consumers· 2 recurring

Per the valuechain.wiki graph, Kulicke & Soffa is directly linked to 6 companies (0 supply, 6 revenue relationships) and reaches 12 companies within two hops; the links are backed by 9 dated sources, 2 of them primary filings (as of 2026-07-12).

Annual return · 2026-07-10'21+92.4%'22-25.8%'23+25.5%'24-13.2%'25-0.3%YTD+150.1%
Kulicke & SoffaFY2025
Money outequipment & infrastructure (undisclosed)components, materials & R&D (undisclosed)

Financials & Segments

  • Total revenue · FY2025 (ended Oct 2025) revenue $654M (-7.4%, cyclical trough), net income $0.2M. Ball Bonding $293M, Wedge $111M, Advanced Solutions (TCB) $73M, APS $156M
  • Segments · Wire and TCB bonding equipment

Revenue from

  • Amkor Technology High confidence
    Amkor, a major OSAT — advanced-packaging capacity expansion feeds K&S bonding-tool demand.
    Confirms EN SEC EDGAR Published Nov 19, 2025: Kulicke & Soffa Form 10-K (FY2025, ended Oct 4 2025)
    Confirms EN BRI Published Jan 1, 2025: TCB bonder market
    Confirms EN SEC EDGAR Published Nov 14, 2024: Kulicke & Soffa Form 10-K
  • ASE Technology High confidence
    ASE, the largest OSAT, is a core buyer of K&S bonders — the AI/HPC shift to TCB drives wire-bonder replacement and expansion demand.
    Mentions EN MarketScreener Published Jun 1, 2026: Kulicke & Soffa (KLIC) analyst consensus and price target
    Confirms EN SEC EDGAR Published Nov 19, 2025: Kulicke & Soffa Form 10-K (FY2025, ended Oct 4 2025)
    Confirms EN BRI Published Jan 1, 2025: TCB bonder market
    Confirms EN SEC EDGAR Published Nov 14, 2024: Kulicke & Soffa Form 10-K
  • Powertech Technology (PTI) Medium confidence
    Powertech (PTI), a Taiwan memory/logic back-end house — a buyer of test and bonding tools.
    Confirms EN SEC EDGAR Published Nov 19, 2025: Kulicke & Soffa Form 10-K (FY2025, ended Oct 4 2025)
    Confirms EN TrendForce Published May 13, 2025: Top 10 OSAT 2024 (PTI No.5)
    Confirms EN PTI Published May 1, 2025: PTI IR
  • JCET (Jiangsu Changjiang Electronics) Medium confidence
    JCET, a large China-based OSAT — sources bonding and test tools as it expands back-end capacity.
    Confirms EN SEC EDGAR Published Nov 19, 2025: Kulicke & Soffa Form 10-K (FY2025, ended Oct 4 2025)
    Confirms EN TrendForce Published May 13, 2025: Top 10 OSAT 2024 (PTI No.5)
    Confirms EN JCET Published May 1, 2025: JCET IR
  • Hana Micron Medium confidence
    Hana Micron, a Korean OSAT — a bonding/test tool buyer tied to back-end investment.
    Confirms KO Daum News Published Jun 17, 2026: Memory back-end packaging upturn
    Confirms EN SEC EDGAR Published Nov 19, 2025: Kulicke & Soffa Form 10-K (FY2025, ended Oct 4 2025)
    Confirms EN Hana Micron Published May 1, 2025: Hana Micron IR
  • ASMPT Low confidence
    Supplies equipment to ASMPT — a large back-end player that is both a K&S customer and a rival in hybrid bonding.
    Confirms EN BRI Published Jan 1, 2025: TCB bonder market
    Confirms EN SEC EDGAR Published Nov 14, 2024: Kulicke & Soffa Form 10-K

Pays to

  • equipment & infrastructure (undisclosed) Low confidence
    Production equipment and infrastructure (undisclosed).
    Confirms EN SEC EDGAR Published Nov 14, 2024: Kulicke & Soffa Form 10-K
  • components, materials & R&D (undisclosed) Low confidence
    Parts, materials and R&D (undisclosed).
    Confirms EN SEC EDGAR Published Nov 14, 2024: Kulicke & Soffa Form 10-K

Value-chain ripple (2 tiers)

Following node-to-node links up to 2 tiers; each firm is shown once, at its nearest tier.

CompanyChain'21'22'23'24'25YTD
Micron Technologylead2+24.2-45.9+71.9-1+240.2+243.3
ASE Technologylead2+38.3-12.8+60.9+10.1+65.6+167.6
SK hynixlead2-0.4-25.6+53.9+48.6+361.1+140.3
MediaTeklead2+27.8-26.6+52.9+58.3+24.9+124.3
Samsung Electronicslead2-9-14.2+20.9-26.4+212.9+77.9
NXP Semiconductorslead2+44.8-29.2+48.4-8+6.4+35.8
Applelead2+34.6-26.4+49+30.7+9.1+16.2
JCET (Jiangsu Changjiang Electronics)lead1-34+0.2-15.2+73.3+28+104.6
ASMPTlead1-29-12.4+21.8-4.8+47.6+82
Amkor Technologylead1+65.6-2.3+40.3-20.8+55.9+79
Powertech Technology (PTI)lead1+4.8-7.5+86-16+128.6+26
Hana Micronlead1+109-41+143.5-52.4+269.3+5.3
Kulicke & Soffanode+92.4-25.8+25.5-13.2-0.3+150.1

YTD as of 2026-07-10 · source: Yahoo Finance

The #1 wire-bonding equipment maker and a major TCB bonder supplier, tied directly to the OSAT capacity-expansion cycle. The thesis is clear — AI/HPC packaging is shifting from wire to TCB and hybrid bonding, creating tool-replacement demand, with large OSATs (ASE, Amkor, JCET) the channel. The risks are the volatility of the back-end capex cycle and the standard-setting race with ASMPT and BESI in hybrid bonding. In graph terms, OSAT-customer utilization and expansion transmit forward into K&S orders.

Analysis generated from returns as of 2026-07-09

Analyst ratings

Consensus: Buy 1 · Hold 2 · Sell 0 · Avg. target $103 · Price $113.41 (07-10) · Upside -9%

BrokerRatingTargetPublished
B. Riley Securities · Craig EllisNeutral$100May 8, 2026Report
Needham & Company · Charles ShiBuy$105May 7, 2026Report
TD CowenHoldMay 6, 2026Report

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