Memory packaging/test OSAT (world No.5)

Powertech Technology (PTI)

Taiwan’s OSAT, world No.5 (5.5% share, $2.28B), the leading memory-IC packaging specialist (BGA, MCP, HBM stacking) for Micron, Samsung and SK hynix.

6239.TW Updated Jun 21, 2026

Annual return · 2026-06-18'21+4.8%'22-7.5%'23+86%'24-16%'25+128.6%YTD+43.1%
Powertech Technology (PTI)Memory packaging/test OSAT
Money outAdvantest원재료·소재·R&D (비공개)Kulicke & Soffa

Financials & Segments

  • Total revenue · Memory packaging/test OSAT (world No.5)
  • Segments · Memory packaging/test OSAT (world No.5)

Revenue from

  • Micron Technology High confidence· Market share 5.5 · 2024 · global OSAT share
    Provides memory packaging and test to Micron Technology.
    Confirms KO DigitalToday Published Jun 1, 2025: "OSAT rebound on HBM (PTI etc.)"
    Confirms EN TrendForce Published May 13, 2025: "Provides memory packaging and test to Micron Technology."
    Confirms EN PTI Published May 1, 2025: "Provides memory packaging and test to Micron Technology."
    Confirms EN Company IR / exchange filing Published Apr 1, 2025: "Annual report: revenue, customers, business."
  • SK hynix Medium confidence
    Provides memory packaging and test to SK하이닉스.
    Confirms EN TrendForce Published May 13, 2025: "Provides memory packaging and test to SK하이닉스."
    Confirms EN PTI Published May 1, 2025: "Provides memory packaging and test to SK하이닉스."
  • Samsung Electronics Medium confidence
    Provides memory packaging and test to 삼성전자.
    Confirms EN TrendForce Published May 13, 2025: "Provides memory packaging and test to 삼성전자."
    Confirms EN PTI Published May 1, 2025: "Provides memory packaging and test to 삼성전자."

Pays to

  • Advantest Medium confidence
    Buys test and bonding equipment from Advantest.
    Confirms EN TrendForce Published May 13, 2025: "Buys test and bonding equipment from Advantest."
    Confirms EN PTI Published May 1, 2025: "Buys test and bonding equipment from Advantest."
  • 원재료·소재·R&D (비공개) Low confidence
    Materials and R&D (undisclosed).
    Confirms EN TrendForce Published May 13, 2025: "Materials and R&D (undisclosed)."
  • Kulicke & Soffa Low confidence
    Buys test and bonding equipment from Kulicke & Soffa.
    Confirms EN TrendForce Published May 13, 2025: "Buys test and bonding equipment from Kulicke & Soffa."
    Confirms EN PTI Published May 1, 2025: "Buys test and bonding equipment from Kulicke & Soffa."

Value-chain ripple (tiers 2–3)

Following node-to-node links up to 3 tiers; each firm is shown once, at its nearest tier.

CompanyChain'21'22'23'24'25YTD
CoreWeavelead3·····+64.7
Arista Networkslead3+97.9-15.6+94.1+87.7+18.5+29.5
Foxconn (Hon Hai)lead3-5.1+2.8+7.8+80.1+26.9+21.8
Applelead3+34.6-26.4+49+30.7+9.1+9.8
Amazonlead3+2.4-49.6+80.9+44.4+5.2+5.9
Super Microlead3+38.8+86.8+246.2+7.2-4+4.7
Meta Platformslead3+23.1-64.2+194.1+65.9+13.1-12.3
Microsoftlead3+52.5-28+58.2+12.9+15.6-21.2
Marvelllead2+84.9-57.5+63.7+83.8-22.8+265.9
AMDlead2+56.9-55+127.6-18.1+77.3+150.9
Qualcommlead2+22.3-38.4+35.1+7.7+13.9+34.2
Broadcomlead2+56.8-13.4+104.9+110.9+50.7+19.3
Alphabet (Google)lead2+65.3-39.1+58.3+35.8+66.1+17.8
NVIDIAlead2+125.5-50.3+239+171.3+38.9+13.1
Micron Technologylead1+24.1-46+72.1-1+240.5+297.6
SK hynixlead1-0.4-25.6+53.9+48.6+361.1+204.7
Samsung Electronicslead1-9-14.2+20.9-26.4+212.9+121
Powertech Technology (PTI)node+4.8-7.5+86-16+128.6+43.1
Kulicke & Soffabenef1+92.6-25.9+25.5-13.3-0.3+170
Advantestbenef1+17-2.3+155.7+49.5+196+24.6

YTD as of 2026-06-18 · source: Yahoo Finance


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