Updates

Per-node confidence is computed live from the database. Below are the update history and the next expansion schedule.

Node status

50 nodes · T4 50

Update history

• Jun 21, 2026Japanese trio promoted to T4 (EDINET filings)DoneAttached EDINET annual securities reports (primary filings) to the Samsung revenue edge of TEL, Shin-Etsu and SUMCO, satisfying the filing and cross-verification gates — T3→T4 (13/13). 36 of 40 nodes now T4. Closure/reciprocity clean.
• Jun 21, 2026SK Siltron added (completes wafer big-3, T4)DoneAdded SK Siltron — world No.3 in 300mm wafers and top-5 in SiC (~15%). Co-develops HBM4 wafers with SK hynix (group synergy) and supplies Samsung, with reciprocal edges. Being unlisted (SK Group), it reached T4 (13/13) via segments.private + KO/EN media cross-verification — unlike the listed Japanese makers (TEL, Shin-Etsu, SUMCO) which stay T3 without an EDINET filing. Wafer big-3 complete. 40 nodes, closure/reciprocity clean.
• Jun 21, 2026Silicon-wafer upstream added (Shin-Etsu, SUMCO)DoneAdded the No.1/No.2 300mm wafer makers Shin-Etsu (~30%) and SUMCO (~25%) — together over half of world volume, supplying TSMC, Samsung, SK, Micron and Intel under LTAs with reciprocal cost edges. Every fab now links upstream to both equipment (TEL) and wafers. Reflects the HBM4 ultra-flat wafer bottleneck. Both T3 (T4 once a Japanese EDINET filing is added). 39 nodes, closure/reciprocity clean.
• Jun 21, 2026Tokyo Electron added (completes the big-4 equipment makers)DoneAdded Tokyo Electron, the No.3 equipment maker (FY2025 ~$16B, +33%). Supplies coater/etch/deposition/clean to Samsung, SK, TSMC, Intel, Micron with reciprocal cost edges. ASML, AMAT, Lam, KLA and TEL — the equipment big-5 — are now all nodes. T3 (T4 once a Japanese EDINET filing is added).
• Jun 21, 2026HPSP and PSK added + Apple/Intel strengthened (28th-29th)DoneAdded HPSP (₩173B, sole global high-pressure annealing; TSMC, Intel, Samsung, SK all customers) and PSK (₩457B, global No.1 dry strip; Samsung, SK, Intel), both T4. Strengthened existing nodes: Apple promoted to T4 by adding a Services revenue edge ($109.2B); Intel promoted to T4 by adding an FY2025 Products-revenue metric ($48.9B). HPSP/PSK reciprocals enriched Samsung/SK/TSMC/Intel cost edges. Zero gaps; all nodes clear the gate.
• Jun 21, 2026Korean fab-supplier expansion (25th-27th): Wonik IPS, Jusung, FoosungDoneAdded deposition-tool maker Wonik IPS (₩527B, Samsung 50%+ and SK), ALD specialist Jusung (₩133B, won all of SK hynix’s next-gen DRAM ALD), and specialty-gas maker Foosung (₩472B, Korea’s only C4F6/WF6, Samsung and SK), all T4 on first pass. Created reciprocal cost edges on Samsung and SK. DART filings cross-verified with KO/EN media. Zero gaps; all nodes still clear the gate.
• Jun 21, 2026UMC and ENF added + BESI promoted to T4 (23rd-24th)DoneAdded UMC (Taiwan mature-node foundry $7.6B; linked to Broadcom, Intel 12nm, and the four equipment makers) and ENF Technology (₩671B, localized HF first-supplied to SK hynix). BESI promoted T2→T4 by adding hybrid-bonding revenue edges to TSMC/Intel, cost edges and an annual-report source. Every node now clears the gate (T3+), zero remaining. Zero one-directional links, zero closure gaps.
• Jun 20, 2026Materials + OSAT expansion (20th-22nd): Dongjin Semichem, Soulbrain, ASEDoneAdded Korean materials makers Dongjin Semichem (₩1.19T, Korea’s only EUV PR) and Soulbrain (₩923B, 70-100% etchant share) plus the world’s #1 OSAT ASE ($19B), all T4. Dongjin/Soulbrain supply materials to Samsung and SK (DART filings + KO/EN media); ASE does Nvidia/AMD CoWoS packaging and buys tools/substrates from ASMPT/BESI/Samsung Electro-Mechanics. Reciprocal cost edges added on Samsung/SK/Nvidia/AMD; as a side effect ASMPT was promoted to T3. Zero one-directional links, zero closure gaps.
• Jun 20, 2026Supply backbone expansion (15th-19th): equipment, foundry, OSATDoneAdded the three equipment makers (Applied Materials $28.4B, Lam Research $18.4B, KLA $12.2B) plus GlobalFoundries ($6.79B) and Amkor ($6.7B), all T4 (13/13). The equipment makers connect to TSMC/Samsung/SK/Intel/Micron fabs with revenue + reciprocal cost edges; GF buys ASML/AMAT/Lam/KLA tools and fabs for AMD; Amkor has Apple as largest customer and buys tools/substrates from ASMPT/BESI/Samsung Electro-Mechanics. Reciprocity rule created both cost↔revenue directions. Zero one-directional links, zero closure gaps.
• Jun 20, 2026Amazon expansion (14th): the Trainium demand hub — all four hyperscalers doneDoneDemand-end node on FY2025 revenue $716.9B, AWS $129B, cash capex $131.8B (+59%, ~$200B for 2026). Five cost edges (Nvidia 196k units, TSMC for Trainium2/3, Marvell design partner, SK HBM3e, Astera) and two revenue edges (AWS with Anthropic Project Rainier 500k chips, e-commerce). Back-filled Nvidia/Marvell reverse links and created TSMC/SK/Astera reciprocals. Re-verified Marvell to FY2026 ($8.195B, DC >$6B). T4 (13/13). All four hubs (Microsoft, Alphabet, Meta, Amazon) complete.
• Jun 20, 2026Meta expansion (13th): the MTIA demand hubDoneDemand-end node on FY2025 revenue $201.0B and cash capex $69.7B (+87%). Six cost edges (Nvidia 224k units, AMD MI300X for Llama, Broadcom MTIA co-development, TSMC 5nm, SK HBM, Astera) and two revenue edges (ads, Reality Labs). Back-filled reverse links on Nvidia/AMD/Broadcom and a TSMC revenue edge. Re-verified AMD to Q1 FY2026 (data center $5.8B, +57%). T4 (13/13).
• Jun 20, 2026Alphabet expansion (12th): the TPU demand hubDoneDemand-end node on FY2025 revenue $402.8B and cash capex $91.4B (+74%, 2026 guided $175-185B). Seven cost edges (Broadcom TPU co-design, TSMC fab, Nvidia 169k units, SK HBM3E, Marvell, Intel/Samsung foundry diversification) and two revenue edges (cloud, ads). Back-filled reverse links on Broadcom/Nvidia/Marvell/SK hynix and revenue edges on TSMC/Intel/Samsung. T4 (13/13).
• Jun 20, 2026Microsoft expansion (11th): the AI-chip demand hubDoneAdded the demand-end node on FY2025 revenue of $281.7B and cash capex of $64.6B (+45%). Seven cost edges (Nvidia — its largest Hopper buyer at 485k units in 2024 — plus AMD, TSMC for its own Maia chip, Astera, Intel) and two revenue edges (OpenAI, total demand). Closed the graph by back-filling reverse links on Nvidia/AMD/Marvell and revenue edges on TSMC/Intel. T4 (13/13).
• Jun 20, 2026Samsung Electro-Mechanics expansion (10th)DoneFC-BGA substrate supplier for AI accelerators. All six revenue edges (NVIDIA, AMD, Broadcom, Apple, Marvell, Samsung) are existing nodes, making it highly connective; reverse NVIDIA/AMD to SEMCO substrate-purchase edges added. DART primary filing (revenue ₩11.3T). T3.
• Jun 20, 2026Astera Labs expansion (9th) — demand layer doneDoneAI server interconnect. Aries and Scorpio adopted into NVIDIA Blackwell (linked to the NVIDIA node), TSMC sole foundry. T3. This completes the chip-design and demand layer (NVIDIA, AMD, Broadcom, Intel, Marvell, Apple, Astera).
• Jun 20, 2026Apple expansion (8th)DoneThe demand end of the chain. Cost edges to TSMC (processor), Samsung/SK/Micron (memory) and Broadcom (wireless) all link to nodes, closing five loops; reverse Broadcom to Apple edge added. TSMC second-largest customer (17%). T4.
• Jun 20, 2026Marvell expansion (7th)DoneDesign partner for Amazon Trainium; customers Microsoft and Google. Cost edges to TSMC (N2, CoWoS) and Samsung/SK (custom HBM) link to nodes, with reverse Samsung/SK to Marvell edges added. T4.
• Jun 20, 2026ASML expansion (6th)DoneThe monopoly EUV supplier. Customers TSMC, Samsung, SK, Intel and Micron are all existing nodes, so one node closes five cost loops. Suppliers Carl Zeiss (sole-source optics) and Cymer. T4. Revenue €32.7B; Samsung and SK took two-thirds of 2025 EUV shipments.
• Jun 20, 2026Intel expansion (5th)DoneA dual node: a foundry and also a TSMC customer. Outsources some tiles to TSMC (linked both ways), first to adopt ASML High-NA EUV. Customers Dell, Lenovo, HP. KO/EN cross-verification. T4.
• Jun 20, 2026Broadcom expansion (4th)DoneCo-designs Google TPU; customers Meta and Anthropic. Cost edges to TSMC, SK, Samsung and Micron link to existing nodes; also added the reverse SK to Broadcom HBM edge. KO/EN cross-verification. T4.
• Jun 20, 2026AMD expansion (3rd)DoneCost edges to TSMC, Samsung and Micron link back to existing nodes, closing three loops. Customers Microsoft, Meta, Oracle, OpenAI. Korean/English cross-verification (Korea Economic Daily, The Elec + AMD 10-K). T4.
• Jun 20, 2026TSMC expansion (2nd)DoneCustomers NVIDIA, Apple, AMD, Broadcom plus suppliers ASML, Applied Materials, Lam. Confirmed via 20-F that NVIDIA is TSMC's largest customer at 19% ($23.2B), and back-filled that figure onto the existing NVIDIA node's cost edge (two-way cross-verification).
• Jun 20, 2026NVIDIA node added (first expansion)DoneNVIDIA's cost side (HBM purchases) links back to the SK, Samsung and Micron nodes, closing the graph. Reaches T4.
• Jun 20, 2026Korean/English bilingual + source translationDoneCompany names, descriptions, notes, financials, metrics, source excerpts and publisher names are all bilingual. Machine-readable .md/.json/llms.txt provided.
• Jun 20, 2026HBM equipment cluster addedDoneAdded ASMPT, Hanwha Semitech and BESI as nodes to track HBM4 TC bonder share.
• Jun 20, 2026Micron and Hanmi added — 4 core nodes at T4DoneThe three memory makers (SK, Samsung, Micron) plus back-end equipment (Hanmi) all reach top confidence (T4).
• Jun 19, 2026SK hynix and Samsung seed nodes builtDoneFirst two nodes of the HBM/AI memory chain, with revenue/cost edges and multi-source cross-verification.

Schedule

• Jun 30, 2026More Korean materials/equipment (PSK, HPSP, etc.)PlannedAfter Dongjin and Soulbrain, add more Korean materials makers (etch, clean, precursors).
• Jun 30, 2026More foundries (SMIC, VIS, etc.)PlannedAfter ASE, expand mature/specialty foundries.
• Jun 30, 2026Materials, substrates, wafersPlannedDongjin Semichem, Soulbrain, Ibiden, Shin-Etsu, SUMCO and others.
• Jun 30, 2026Promote ASMPT and BESI to T3PlannedAdd HKEX and Euronext filings to fill cost edges and cross-verification.