Semiconductor back-end · Samsung non-memory packaging

Nepes

A back-end advanced-packaging (FOWLP, PLP) and electronic-materials supplier that is effectively a captive back-end partner of Samsung: 80–90% of consolidated revenue rides on Samsung non-memory chips (PMIC, AP, DDI). That concentration ties its results to Samsung's smartphone cycle, and its attempt to widen its customer base through panel-level packaging (PLP) stalled when Qualcomm cancelled the main volume contract over yield issues in 2023, leaving only low-cost orders. On FY2025 consolidated revenue of KRW 521.4B (advanced packaging 352.4, electronic materials 91.6, battery 76.7), what matters is diversification toward SK hynix and others and a recovery in PLP yields.

033640.KQ Updated Jul 12, 2026 4 AI consumers· 2 recurring

Per the valuechain.wiki graph, Nepes is directly linked to 3 companies (0 supply, 3 revenue relationships) and reaches 12 companies within two hops; the links are backed by 6 dated sources, 1 of them primary filings (as of 2026-07-12).

Annual return · 2026-09-04'21-29.5%'22-44%'23+6.7%'24-62.7%'25+179.2%YTD+12.5%
NepesFY2025 consolidated revenue KRW 521.4bn
Money outraw materials (undisclosed)equipment & R&D (undisclosed)

Financials & Segments

  • Total revenue · FY2025 consolidated revenue KRW 521.4bn (advanced packaging KRW 352.4bn, electronic materials KRW 91.6bn, battery materials KRW 76.7bn, other KRW 0.7bn), operating income KRW 20.9bn
  • Segments · Advanced packaging (FOWLP, PLP) · Electronic materials · Battery materials

Revenue from

  • Samsung Electronics High confidence
    Supplies back-end packaging for Samsung non-memory (PMIC, AP, DDI) — the largest customer at 80–90% of consolidated revenue, making this concentration both the growth axis and the top risk.
    Confirms KO DART (FSS) Published Mar 18, 2026: Annual business report (DART)
    Mentions KO Dealsite Published Dec 25, 2025: nepes rides the upcycle, structural fix still pending
    Confirms EN Nepes Published May 1, 2025: Nepes IR
    Confirms KO THE VC Published Jan 1, 2025: Nepes company profile
  • SK hynix Medium confidence
    Supplies back-end packaging to SK hynix (memory and non-memory) — the No.2 customer and the key axis for easing Samsung concentration.
    Confirms KO DART (FSS) Published Mar 18, 2026: Annual business report (DART)
    Confirms EN Nepes Published May 1, 2025: Nepes IR
    Confirms KO THE VC Published Jan 1, 2025: Nepes company profile
  • Qualcomm Low confidence
    FO-PLP customer of subsidiary nepes Laweh. Qualcomm cancelled the main volume contract in 2023 over yield issues; only some low-cost package orders remain.
    Confirms EN THE ELEC Published Apr 7, 2023: Qualcomm cancels FO-PLP deal with Nepes Laweh
    Confirms KO THE ELEC Published Apr 6, 2023: Qualcomm cancels part of nepes Laweh PLP contract

Pays to

  • raw materials (undisclosed) Low confidence
    Raw materials for advanced packaging (undisclosed).
    Confirms KO THE VC Published Jan 1, 2025: Nepes company profile
  • equipment & R&D (undisclosed) Low confidence
    Production equipment and R&D (undisclosed).
    Confirms KO THE VC Published Jan 1, 2025: Nepes company profile

Investments

  • Nepes Laweh & Nepes Ark (PLP & test subsidiaries) Medium confidence
    A group structure vertically extending the back-end value chain — Nepes consolidates Nepes Laweh (panel-level packaging, PLP) and Nepes Ark (semiconductor test). Attaching PLP and test to the parent's advanced packaging (FOWLP) is the capital axis covering Samsung non-memory back-end end-to-end in-group.
    Confirms KO DART (FSS) Published Mar 18, 2026: Annual business report (DART)

Value-chain ripple (2 tiers)

Following node-to-node links up to 2 tiers; each firm is shown once, at its nearest tier.

CompanyChain'21'22'23'24'25YTD
Marvelllead2+84.6-57.5+63.7+83.8-22.8+163.4
AMDlead2+56.9-55+127.6-18.1+77.3+123
LG Electronicslead2-16.2-20.9-5.8-9.5+19.2+105.5
Kyoceralead2+7.5-2.1+33.8-24+46.7+53.5
Everpure (formerly Pure Storage)lead2+44-17.8+33.3+72.3+9.1+48.5
NVIDIAlead2+125.5-50.3+239+171.2+38.9+23.7
Alphabet (Google)lead2+65.3-39.1+58.3+36+66+8.3
Broadcomlead2+56.5-13.3+104.2+110.5+50.6+3.8
Xiaomilead2-43.9-21.1-4.6+209.7-6.9-19.9
SK hynixlead1-0.4-25.6+53.9+48.6+361.1+81.6
Samsung Electronicslead1-9-14.2+20.9-26.4+212.9+59.7
Qualcommlead1+22.3-38.6+35.1+8.3+13.8+0.2
Nepesnode-29.5-44+6.7-62.7+179.2+12.5

YTD as of 2026-09-04 · source: Yahoo Finance

Nepes operates across KOSDAQ, Semiconductor back-end, Samsung non-memory packaging. It is +12.5% in 2026. The demand side (avg +47.2%) leads the stock (+12.5%), so customer moves come first here. Among connected nodes the furthest ahead is SK hynix (+81.6%) and the furthest behind is Qualcomm (+0.2%). If chain logic explains the gap, the laggard is the next propagation candidate; if not, the link itself deserves a second look. On FY2025 consolidated revenue of KRW 521.4B (advanced packaging 352.4, electronic materials 91.6, battery 76.7), what matters is diversification toward SK hynix and others and a recovery in PLP yields.

Analysis generated from returns as of 2026-09-04

Analyst ratings

Consensus: Buy 0 · Hold 0 · Sell 0

BrokerRatingTargetPublished
Meritz SecuritiesNot Rated (투자의견·목표주가 미제시)Jun 16, 2026Report

A 2025 turnaround (+12.3% revenue, +598% operating profit) on advanced packaging demand, but formal rated coverage is thin; Meritz Securities follows the name via visit notes and a fab-tour review without a published rating or target.


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