KOSDAQ · Package substrates · AI FC-BGA localization

Daeduck Electronics

A leading Korean substrate maker of high-performance FC-BGA and semiconductor package substrates, investing 800B+ KRW in high-layer-count substrates for AI accelerators and servers to localize the high-end substrates long led by Japan and Taiwan. It supplies Samsung and SK hynix and is expanding to overseas AI customers; FC-BGA is a high-value material whose unit price rises with more layers and larger area as AI-server and HBM demand grows. The watch points are the utilization of its large capacity investment and whether it wins overseas AI customers.

353200.KS Updated Jul 12, 2026 5 AI consumers· 1 recurring

Per the valuechain.wiki graph, Daeduck Electronics is directly linked to 2 companies (0 supply, 2 revenue relationships) and reaches 8 companies within two hops; the links are backed by 4 dated sources, 1 of them primary filings (as of 2026-07-12).

Annual return · 2026-07-10'21+64.2%'22-0.3%'23+13.3%'24-22.7%'25+250.2%YTD+92.1%
Daeduck ElectronicsFC-BGA and package substrates
Money outraw materials (undisclosed)equipment & R&D (undisclosed)

Financials & Segments

  • Total revenue · FC-BGA and package substrates
  • Segments · FC-BGA and package substrates

Revenue from

  • Samsung Electronics Medium confidence
    Supplies FC-BGA package substrates to Samsung — the key customer for localizing high-performance AI/server substrates.
    Mentions KO DB, Daishin, Hana Securities Published May 1, 2026: FCBGA/MLB/memory triple upturn; targets KRW 74,000-250,000 (Buy); 2026 OP +263%
    Confirms KO DART (FSS) Published Mar 18, 2026: Annual business report (DART)
    Confirms KO TheElec Published Feb 1, 2026: Daeduck invests 800B in AI substrates
    Confirms EN Daeduck Published May 1, 2025: Daeduck IR
  • SK hynix Medium confidence
    Supplies FC-BGA package substrates to SK hynix — a growth axis tied to HBM/AI-server demand.
    Confirms KO TheElec Published Feb 1, 2026: Daeduck invests 800B in AI substrates
    Confirms EN Daeduck Published May 1, 2025: Daeduck IR

Pays to

  • raw materials (undisclosed) Low confidence
    Raw materials for FC-BGA package substrates (undisclosed).
    Confirms KO TheElec Published Feb 1, 2026: Daeduck invests 800B in AI substrates
  • equipment & R&D (undisclosed) Low confidence
    Production equipment and R&D (undisclosed).
    Confirms KO TheElec Published Feb 1, 2026: Daeduck invests 800B in AI substrates

Investors

  • Daeduck Co. (holding company, 31.46%) High confidence
    The axis of the Daeduck group structure — holding company Daeduck Co. is the largest shareholder at 31.46%. It houses Daeduck Electronics (FCBGA/MLB substrates and memory module boards) within the group, forming one pillar of localizing semiconductor package substrates.
    Confirms KO DART (FSS) Published Mar 18, 2026: Annual business report (DART)

Value-chain ripple (2 tiers)

Following node-to-node links up to 2 tiers; each firm is shown once, at its nearest tier.

CompanyChain'21'22'23'24'25YTD
Marvelllead2+84.6-57.5+63.7+83.8-22.8+177.8
AMDlead2+56.9-55+127.6-18.1+77.3+160.5
Everpure (formerly Pure Storage)lead2+44-17.8+33.3+72.3+9.1+18.4
Broadcomlead2+56.5-13.3+104.2+110.5+50.6+16
NVIDIAlead2+125.5-50.3+239+171.2+38.9+13.3
Qualcommlead2+22.3-38.6+35.1+8.3+13.8+11.7
SK hynixlead1-0.4-25.6+53.9+48.6+361.1+140.3
Samsung Electronicslead1-9-14.2+20.9-26.4+212.9+77.9
Daeduck Electronicsnode+64.2-0.3+13.3-22.7+250.2+92.1

YTD as of 2026-07-10 · source: Yahoo Finance

A leading Korean substrate maker of high-performance FC-BGA whose growth story centers on localizing — with 800B+ KRW of investment — the high-end substrates long led by Japan (Ibiden, Shinko) and Taiwan. FC-BGA is the high-layer substrate linking AI accelerators and server CPUs, a high-value material whose unit price rises with more layers and larger area as AI-server and HBM demand grows, and it is expanding from Samsung and SK hynix to overseas AI customers. Risks are the utilization of its large capacity investment and the volatility of the downstream AI investment cycle. Upstream on the graph the trigger is package-substrate demand from Samsung, SK and overseas AI customers, and this node is the materials beneficiary of that localization demand.

Analysis generated from returns as of 2026-07-10

Analyst ratings

Consensus: Buy 4 · Hold 0 · Sell 0 · Avg. target ₩180,000 · Price ₩120,900 (07-10) · Upside +49%

BrokerRatingTargetPublished
Meritz SecuritiesBuy₩200,000Jun 16, 2026Report
Hana SecuritiesBuy₩250,000Jun 15, 2026Report
Daishin SecuritiesBuy₩130,000Apr 29, 2026Report
BNK Investment & SecuritiesBuy₩140,000Apr 27, 2026Report

Q2 OP KRW62bn (+3,224%) beat; ASP gains across FC-BGA/FC-CSP/MLB and large-area FC-BGA mass production lift target to KRW200,000.


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