Inspection and metrology (HBM, packaging)

Camtek

A wafer inspection/metrology maker strong in HBM, advanced packaging and hybrid bonding. 2024 revenue $429M (+36%). 250+ customers incl. SK hynix, Samsung and OSATs.

CAMT Updated Jun 21, 2026

Annual return · 2026-06-18'21+110.1%'22-52.3%'23+215.9%'24+18.3%'25+31.7%YTD+83.5%
CamtekInspection and metrology
Money out설비·인프라 (비공개)부품·소재·R&D (비공개)

Financials & Segments

  • Total revenue · Inspection and metrology (HBM, packaging)
  • Segments · Inspection and metrology (HBM, packaging)

Revenue from

  • SK hynix High confidence· Revenue ~$429M · FY2024 · annual revenue
    Supplies inspection and metrology tools to SK하이닉스.
    Confirms EN SEC EDGAR Published Mar 1, 2025: "Supplies inspection and metrology tools to SK하이닉스."
    Confirms KO THE ELEC Published Jan 1, 2025: "Supplies inspection and metrology tools to SK하이닉스."
  • ASE Technology Medium confidence
    Supplies inspection and metrology tools to ASE테크놀로지.
    Confirms EN SEC EDGAR Published Mar 1, 2025: "Supplies inspection and metrology tools to ASE테크놀로지."
    Confirms KO THE ELEC Published Jan 1, 2025: "Supplies inspection and metrology tools to ASE테크놀로지."
  • Samsung Electronics Medium confidence
    Supplies inspection and metrology tools to 삼성전자.
    Confirms EN SEC EDGAR Published Mar 1, 2025: "Supplies inspection and metrology tools to 삼성전자."
    Confirms KO THE ELEC Published Jan 1, 2025: "Supplies inspection and metrology tools to 삼성전자."
  • Amkor Technology Medium confidence
    Supplies inspection and metrology tools to 앰코테크놀로지.
    Confirms EN SEC EDGAR Published Mar 1, 2025: "Supplies inspection and metrology tools to 앰코테크놀로지."
    Confirms KO THE ELEC Published Jan 1, 2025: "Supplies inspection and metrology tools to 앰코테크놀로지."

Pays to

  • 설비·인프라 (비공개) Low confidence
    Production equipment and infrastructure (undisclosed).
    Confirms EN SEC EDGAR Published Mar 1, 2025: "Production equipment and infrastructure (undisclosed)."
  • 부품·소재·R&D (비공개) Low confidence
    Parts, materials and R&D (undisclosed).
    Confirms EN SEC EDGAR Published Mar 1, 2025: "Parts, materials and R&D (undisclosed)."

Value-chain ripple (tiers 2–3)

Following node-to-node links up to 3 tiers; each firm is shown once, at its nearest tier.

CompanyChain'21'22'23'24'25YTD
CoreWeavelead3·····+64.7
Arista Networkslead3+97.9-15.6+94.1+87.7+18.5+29.5
Foxconn (Hon Hai)lead3-5.1+2.8+7.8+80.1+26.9+21.8
Alphabet (Google)lead3+65.3-39.1+58.3+35.8+66.1+17.8
Applelead3+34.6-26.4+49+30.7+9.1+9.8
Amazonlead3+2.4-49.6+80.9+44.4+5.2+5.9
Super Microlead3+38.8+86.8+246.2+7.2-4+4.7
Meta Platformslead3+23.1-64.2+194.1+65.9+13.1-12.3
Microsoftlead3+52.5-28+58.2+12.9+15.6-21.2
Marvelllead2+84.9-57.5+63.7+83.8-22.8+265.9
AMDlead2+56.9-55+127.6-18.1+77.3+150.9
Qualcommlead2+22.3-38.4+35.1+7.7+13.9+34.2
Broadcomlead2+56.8-13.4+104.9+110.9+50.7+19.3
NVIDIAlead2+125.5-50.3+239+171.3+38.9+13.1
SK hynixlead1-0.4-25.6+53.9+48.6+361.1+204.7
ASE Technologylead1+38.3-12.8+60.9+10.1+65.6+151.9
Amkor Technologylead1+65.6-2.4+40.3-22+58.4+130.3
Samsung Electronicslead1-9-14.2+20.9-26.4+212.9+121
Camteknode+110.1-52.3+215.9+18.3+31.7+83.5

YTD as of 2026-06-18 · source: Yahoo Finance


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