TSE · semiconductor materials · No.1 in photoresist

Tokyo Ohka Kogyo (TOK)

A Japanese materials maker holding one axis of the leading-edge lithography-materials oligopoly: No.1 in photoresist overall (~24.7%) and No.2 in EUV resist (~28%). Its customers are TSMC, Samsung, SK hynix, Intel and Kioxia, and with over 80% of sales overseas, results track leading-edge fabs' EUV wafer starts directly. FY2024 revenue hit a record ¥200.9B, and its strategy of exiting equipment to focus on leading-edge resist defends share and margin.

4186.T Updated Jul 12, 2026 4 AI consumers· 1 recurring

Per the valuechain.wiki graph, Tokyo Ohka Kogyo (TOK) is directly linked to 5 companies (0 supply, 5 revenue relationships) and reaches 36 companies within two hops; the links are backed by 7 dated sources, 2 of them primary filings (as of 2026-07-12).

Annual return · 2026-07-10'21-2.7%'22-3%'23+63.8%'24+4.3%'25+111.5%YTD+42.9%
Tokyo Ohka Kogyo (TOK)Net sales ¥237.0bn
Money outequipment & infrastructure (undisclosed)components, materials & R&D (undisclosed)

Financials & Segments

  • Total revenue · Net sales ¥237.0bn (+17.9%, record FY2025), operating income ¥47.4bn (+43.2%). Electronic Functional Materials ¥124.7bn, High-purity Chemicals ¥109.4bn. FY2026 guidance ¥261.0bn (+10.1%)
  • Segments · Photoresist (No.1 overall 24.7% · No.2 in EUV 28%)

Revenue from

  • SK hynix High confidence
    Supplies EUV photoresist to SK hynix — demand grows as HBM DRAM shifts to EUV.
    Confirms EN Tokyo Ohka Kogyo Published Feb 9, 2026: FY2025 Financial Results (year ended December 31, 2025)
    Confirms KO JK Daily Published Jun 1, 2025: TOK leads EUV PR at 25%
    Confirms EN TOK Published May 1, 2025: Tokyo Ohka Kogyo IR
  • Samsung Electronics High confidence
    Supplies EUV photoresist to Samsung memory/logic — a key customer behind its No.1-overall (~24.7%) position, with wider EUV adoption lifting consumption.
    Confirms EN Tokyo Ohka Kogyo Published Feb 9, 2026: FY2025 Financial Results (year ended December 31, 2025)
    Mentions JA LogMi Finance Published Nov 15, 2025: TOK: 24.7% world-No.1 photoresist share; 28% No.2 in EUV resist
    Confirms JA EDINET / company IR Published Jun 25, 2025: Annual Securities Report (EDINET)
    Confirms KO JK Daily Published Jun 1, 2025: TOK leads EUV PR at 25%
    Confirms EN TOK Published May 1, 2025: Tokyo Ohka Kogyo IR
  • Intel Medium confidence
    Supplies EUV photoresist to Intel's leading-edge logic — a customer axis tied to Intel Foundry's EUV ramp.
    Confirms EN Tokyo Ohka Kogyo Published Feb 9, 2026: FY2025 Financial Results (year ended December 31, 2025)
    Confirms KO JK Daily Published Jun 1, 2025: TOK leads EUV PR at 25%
    Confirms EN TOK Published May 1, 2025: Tokyo Ohka Kogyo IR
  • TSMC Medium confidence
    Supplies EUV photoresist to TSMC's leading-edge logic — more EUV layers mean more consumption per wafer, so TSMC utilization is TOK revenue. As one of few oligopoly suppliers, it is hard to substitute.
    Mentions EN Analyst consensus (Nomura, Citi) Published Feb 10, 2026: Tokyo Ohka Kogyo (4186) analyst consensus: Buy, target ¥11,542 (Nomura, Citi upgrades)
    Confirms EN Tokyo Ohka Kogyo Published Feb 9, 2026: FY2025 Financial Results (year ended December 31, 2025)
    Mentions JA LogMi Finance Published Nov 15, 2025: TOK: 24.7% world-No.1 photoresist share; 28% No.2 in EUV resist
    Confirms KO JK Daily Published Jun 1, 2025: TOK leads EUV PR at 25%
    Confirms EN TOK Published May 1, 2025: Tokyo Ohka Kogyo IR
  • Kioxia Medium confidence
    Supplies photoresist to Kioxia — named in company IR alongside TSMC, Samsung, SK and Intel (per-customer share undisclosed). A NAND leading-edge demand axis.
    Mentions JA Eventos (IR lecture note) Published Dec 6, 2025: TOK IR briefing: key customers and business structure

Pays to

  • equipment & infrastructure (undisclosed) Low confidence
    Production equipment and infrastructure investment — leading-edge resist capacity expansion underpins share defense (suppliers undisclosed).
    Confirms EN TOK Published May 1, 2025: Tokyo Ohka Kogyo IR
  • components, materials & R&D (undisclosed) Low confidence
    Parts, materials and R&D for resist manufacturing — purity and photosensitivity are the source of competitiveness, making materials sourcing and research the barrier to entry (undisclosed).
    Confirms EN TOK Published May 1, 2025: Tokyo Ohka Kogyo IR

Value-chain ripple (2 tiers)

Following node-to-node links up to 2 tiers; each firm is shown once, at its nearest tier.

CompanyChain'21'22'23'24'25YTD
Dell Technologieslead2+51.2-26.6+95.9+53+11.2+248.1
Marvelllead2+84.6-57.5+63.7+83.8-22.8+177.8
Lenovolead2-4.6-20.9+36.2+18.2-0.6+175.7
AMDlead2+56.9-55+127.6-18.1+77.3+160.5
Astera Labslead2····+25.6+148.2
MediaTeklead2+27.8-26.6+52.9+58.3+24.9+124.3
Fortinetlead2+142-32+19.7+61.4-16+98.4
Renesas Electronicslead2+8.2+2.4+88-13.6+23.8+84.9
Credo Technologylead2··+46.3+245.2+114.1+79.2
Realteklead2+19.6-33.8+56.2+19.1-6.4+73.7
Global Unichiplead2+21.4+67.6+99.4-13.7+101.4+66.4
Ciscolead2+45.8-22.5+9.3+21+33.5+59.8
Mercury Systemslead2-37.5-18.7-18.3+14.8+73.8+47.9
Montage Technologylead2-18.2-21.8-18+51.4+169+47.4
ASUSTeK Computerlead2+35.5-12.9+72+41.1-14.1+46.7
Analog Deviceslead2+21-4.9+23.4+8.8+29.8+46.7
Microchip Technologylead2+27.5-18+30.9-35+14.6+40.6
NXP Semiconductorslead2+44.8-29.2+48.4-8+6.4+35.8
Alchip Technologieslead2+14.3-8.7+365.1-18.9+0.8+34.7
Everpure (formerly Pure Storage)lead2+44-17.8+33.3+72.3+9.1+18.4
Broadcomlead2+56.5-13.3+104.2+110.5+50.6+16
Alphabet (Google)lead2+65.3-39.1+58.3+36+66+14.3
NVIDIAlead2+125.5-50.3+239+171.2+38.9+13.3
Qualcommlead2+22.3-38.6+35.1+8.3+13.8+11.7
Ambarellalead2+121-59.5-25.5+18.7-2.6+9.1
Sony Semiconductor Solutionslead2+27.2-8.4+27.8+17.9+1-2.4
Phison Electronicslead2+26.8-10.7+45.1-6.7+418.3-6
Mobileyelead2··+23.6-54-47.6-8.5
Will Semiconductorlead2-12.1-49.7-8.3+22.8+15.5-14.8
Microsoftlead2+52.5-28+58.2+12.9+15.6-20
Kioxialead1····+1082.1+260.5
Intellead1+6.1-46.6+94.6-59.6+84+197.7
SK hynixlead1-0.4-25.6+53.9+48.6+361.1+140.3
Samsung Electronicslead1-9-14.2+20.9-26.4+212.9+77.9
TSMClead1+12.1-36.7+42.3+92.6+55.9+43.6
Tokyo Ohka Kogyo (TOK)node-2.7-3+63.8+4.3+111.5+42.9

YTD as of 2026-07-10 · source: Yahoo Finance

Tokyo Ohka Kogyo holds one axis of the leading-edge lithography-materials oligopoly. It is No.1 in photoresist overall (~24.7%) and No.2 in EUV resist (~28%), feeding leading-edge fabs like TSMC, Samsung, SK hynix, Intel and Kioxia, with over 80% of sales overseas. The driver is fabs' EUV wafer starts — as EUV layer counts rise and nodes shrink, resist consumption per wafer grows, so HBM and leading-edge logic ramps are TOK demand. FY2024 revenue set a record at ¥200.9B, and its strategy of exiting equipment to focus on resist defends share and margin. Re-rating triggers are the pace of EUV-layer expansion, customer fab utilization, and the EUV-share contest.

Analysis generated from returns as of 2026-07-10

Analyst ratings

Consensus: Buy 2 · Hold 1 · Sell 0 · Avg. target ¥11,933 · Price ¥10,365 (07-10) · Upside +15%

BrokerRatingTargetPublished
Nomura SecuritiesNeutral(継続)¥10,500Jun 12, 2026Report
SMBC Nikko Securities1(継続)¥13,300May 19, 2026Report
BofA SecuritiesBuy(継続)¥12,000May 11, 2026Report

Buy-leaning consensus (average target around JPY 11,542) on strong AI-driven advanced photoresist demand, though Nomura and Morgan Stanley MUFG stay neutral on valuation grounds.


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