Memory interface (DDR5 RCD, CXL)
Montage Technology
A Chinese memory-interface chip maker (澜起科技). A global top-3 in DDR5 RCD (register clock driver), with 2025 revenue RMB 5.46B (+50%) and net profit +58% on AI-server and DDR5 demand. It also samples CXL MXC memory-expander chips. A fabless firm made at TSMC.
688008.SS Updated Jul 12, 2026 4 AI consumers· 2 recurring
Per the valuechain.wiki graph, Montage Technology is directly linked to 3 companies (1 supply, 2 revenue relationships) and reaches 43 companies within two hops; the links are backed by 2 dated sources, 1 of them primary filings (as of 2026-07-12).
Financials & Segments
- Total revenue · RMB 5.46bn (FY2025, +50%)
- Customer concentration · Top-3 in DDR5 RCD; made at TSMC.
- Segments · DDR5 RCD · CXL MXC · PCIe interconnect
Revenue from
- Memory modules · AI servers (RCD) High confidence
Supplies RCD interface chips to DDR5 modules and AI servers (global top-3). - CXL · PCIe interconnect (new) Medium confidence
CXL MXC memory expanders and PCIe retimers. - Samsung Electronics Medium confidence
Supplies RCD for Samsung DDR5 modules — an interface-chip demand point with both memory leaders as customers. - SK hynix Medium confidence
Supplies RCD interface chips for SK Hynix DDR5 modules — as high-capacity server DRAM grows, per-module RCD demand rises with it.
Pays to
- TSMC High confidence
Manufactures DDR5 RCD and CXL chips at TSMC (fabless). - EDA · IP · R&D (undisclosed) Low confidence
Design EDA, IP and R&D.
Value-chain ripple (2 tiers)
Following node-to-node links up to 2 tiers; each firm is shown once, at its nearest tier.
| Company | Chain | '21 | '22 | '23 | '24 | '25 | YTD |
|---|---|---|---|---|---|---|---|
| Marvell | lead2 | +84.6 | -57.5 | +63.7 | +83.8 | -22.8 | +177.8 |
| AMD | lead2 | +56.9 | -55 | +127.6 | -18.1 | +77.3 | +160.5 |
| Everpure (formerly Pure Storage) | lead2 | +44 | -17.8 | +33.3 | +72.3 | +9.1 | +18.4 |
| Broadcom | lead2 | +56.5 | -13.3 | +104.2 | +110.5 | +50.6 | +16 |
| NVIDIA | lead2 | +125.5 | -50.3 | +239 | +171.2 | +38.9 | +13.3 |
| Qualcomm | lead2 | +22.3 | -38.6 | +35.1 | +8.3 | +13.8 | +11.7 |
| SK hynix | lead1 | -0.4 | -25.6 | +53.9 | +48.6 | +361.1 | +140.3 |
| Samsung Electronics | lead1 | -9 | -14.2 | +20.9 | -26.4 | +212.9 | +77.9 |
| Montage Technology | node | -18.2 | -21.8 | -18 | +51.4 | +169 | +47.4 |
| TSMC | benef1 | +12.1 | -36.7 | +42.3 | +92.6 | +55.9 | +43.6 |
| SUMCO Corporation | benef2 | -4.3 | -3.9 | +21.3 | -48.1 | +41.7 | +225.8 |
| GlobalWafers | benef2 | +26.9 | -29.9 | +14.3 | -39 | +48.9 | +171.6 |
| Applied Materials | benef2 | +83.6 | -37.5 | +68 | +1.1 | +59.6 | +135 |
| Lam Research | benef2 | +53.7 | -40.7 | +88.6 | -6.8 | +139.2 | +105 |
| Onto Innovation | benef2 | +112.9 | -32.7 | +124.6 | +9 | -5.3 | +103.6 |
| KLA | benef2 | +68 | -11.2 | +56 | +9.4 | +94.5 | +91 |
| SCREEN Holdings | benef2 | +40.7 | -13.2 | +220.1 | -24.1 | +84.9 | +86.3 |
| Teradyne | benef2 | +36.8 | -46.3 | +24.8 | +16.5 | +54.4 | +85.9 |
| Resonac | benef2 | -2.6 | -4 | +37.5 | +30.3 | +137.9 | +80.4 |
| Tokyo Electron (TEL) | benef2 | +40.4 | -14.5 | +89.8 | -4.4 | +61.6 | +78.2 |
| Qnity Electronics | benef2 | · | · | · | · | · | +76.3 |
| Entegris | benef2 | +44.6 | -52.5 | +83.5 | -17.1 | -14.6 | +72.8 |
| ASML | benef2 | +64.1 | -30.5 | +39.9 | -7.7 | +55.8 | +68.6 |
| Global Unichip | benef2 | +21.4 | +67.6 | +99.4 | -13.7 | +101.4 | +66.4 |
| BESI | benef2 | +33.7 | -6.1 | +121.8 | -9.3 | +35 | +56.2 |
| Fujimi Incorporated | benef2 | +64.7 | -1.6 | +40.4 | -24.2 | +28.4 | +54.6 |
| Shin-Etsu Chemical | benef2 | +6.3 | +3.1 | +57.8 | -15.6 | +7.6 | +44 |
| Tokyo Ohka Kogyo (TOK) | benef2 | -2.7 | -3 | +63.8 | +4.3 | +111.5 | +42.9 |
| Ebara | benef2 | +58.1 | +2.3 | +76.1 | +41 | +84 | +32.3 |
| ASM International | benef2 | +44.2 | +2.9 | +68.7 | +10.3 | +25.9 | +28.8 |
| Linde | benef2 | +33.4 | -4.4 | +27.7 | +3.2 | +3.2 | +25.1 |
| Cadence Design Systems | benef2 | +36.6 | -13.8 | +69.6 | +10.3 | +4 | +22.9 |
| Lasertec | benef2 | +78.9 | +2.4 | +57 | -60.6 | +138.9 | +22.4 |
| Advantest | benef2 | +17 | -2.3 | +155.7 | +49.5 | +196 | +17.1 |
| Air Liquide | benef2 | +14.1 | +7.9 | +20.9 | +8.5 | -4.8 | +12.5 |
| Disco Corporation | benef2 | -6.6 | +27.7 | +218.5 | +11.6 | +49.6 | +10.2 |
| EO Technics | benef2 | +7.6 | -28.2 | +130.5 | -16.2 | +163.2 | +0.7 |
| HPSP | benef2 | · | · | +216.5 | -30.4 | +54.7 | -4.5 |
| Synopsys | benef2 | +42.1 | -13.4 | +61.3 | -5.7 | -3.2 | -5.2 |
| Photronics | benef2 | +68.9 | -10.7 | +86.4 | -24.9 | +35.8 | -6.6 |
| Leeno Industrial | benef2 | +21 | -5.3 | +18.3 | +9.5 | +150.1 | -30.3 |
YTD as of 2026-07-10 · source: Yahoo Finance
A Chinese memory-interface fabless firm, top-3 globally in DDR5 RCD (register clock driver), tied directly to expanding AI-server and DDR5 adoption. The thesis has two axes — RCD is required in every high-capacity DRAM module of an AI server, lifting volume (2025 revenue +50%), while CXL MXC and PCIe retimers open a new axis in next-gen memory expansion. Risks are capacity dependence from a design-only, TSMC-outsourced model and the memory cycle, and in graph terms Samsung/SK Hynix DDR5-module demand transmits into Montage RCD.
Analysis generated from returns as of 2026-07-10Analyst ratings
Consensus: Buy 3 · Hold 0 · Sell 0 · Avg. target ¥332 · Price ¥268.06 (07-10) · Upside +24%
| Broker | Rating | Target | Published | |
|---|---|---|---|---|
| Goldman Sachs | 买入 (Buy) | ¥387 | May 27, 2026 | Report ↗ |
| CLSA | 高度确信跑赢大市 (High-Conviction Outperform) | ¥277.9 | May 8, 2026 | Report ↗ |
| Guoyuan Securities | 买入 (Buy) | — | Apr 15, 2026 | Report ↗ |
On DDR5 transition and AI server demand, Goldman Sachs raised its A-share target to RMB 387 in May 2026, with global and Chinese brokers uniformly bullish on Montage Technology.
Analyses covering this node
- Export controls wind China's chain clock: the makers rise, not the buyers Jul 10, 2026
- The memory supercycle is a balloon effect: one point of HBM demand re-rated the whole asset class Jun 23, 2026
- China replicates the chain in parallel: the second map that sanctions drew Jun 23, 2026