# Resonac (4004.T)
> 어드밴스드 패키징용 소재(필름·CMP 슬러리·고순도 가스) 세계적 강자. 2024년 반도체·전자재료 매출 약 ¥4,500억. TSMC 우수성과상 수상.
Canonical: https://valuechain.wiki/resonac · Updated: 2026-06-21T12:40:59.434982+00:00 · Source: ValueChain.wiki (refined facts, cited)

## Financials & segments
- 총매출: 반도체 패키지 소재 (후공정)
- 사업부문: 반도체 패키지 소재 (후공정)

## Annual stock return (as of 2026-06-19)
- 2021: -2.6%
- 2022: -4%
- 2023: +37.5%
- 2024: +30.3%
- 2025: +137.9%
- 2026 YTD: +105.5%

## Value-chain annual returns (top→bottom: demand → node → supply; YTD as of 2026-06-19)
| Company | Chain | 2021 | 2022 | 2023 | 2024 | 2025 | YTD |
| --- | --- | --- | --- | --- | --- | --- | --- |
| SK하이닉스 | lead3 | -0.4% | -25.6% | +53.9% | +48.6% | +361.1% | +204.7% |
| 삼성전자 | lead3 | -9% | -14.2% | +20.9% | -26.4% | +212.9% | +121% |
| CoreWeave | lead3 | · | · | · | · | · | +64.7% |
| Arista Networks | lead3 | +97.9% | -15.6% | +94.1% | +87.7% | +18.5% | +29.5% |
| Foxconn | lead3 | -5.1% | +2.8% | +7.8% | +80.1% | +26.9% | +21.8% |
| 알파벳 (구글) | lead3 | +65.3% | -39.1% | +58.3% | +35.8% | +66.1% | +17.8% |
| 아마존 | lead3 | +2.4% | -49.6% | +80.9% | +44.4% | +5.2% | +5.9% |
| Super Micro | lead3 | +38.8% | +86.8% | +246.2% | +7.2% | -4% | +4.7% |
| 메타 플랫폼스 | lead3 | +23.1% | -64.2% | +194.1% | +65.9% | +13.1% | -12.3% |
| 마이크로소프트 | lead3 | +52.5% | -28% | +58.2% | +12.9% | +15.6% | -21.2% |
| Marvell | lead2 | +84.9% | -57.5% | +63.7% | +83.8% | -22.8% | +265.9% |
| Intel | lead2 | +6.1% | -46.6% | +94.6% | -59.6% | +84% | +263.1% |
| 미디어텍 | lead2 | +27.8% | -26.6% | +49% | +59.1% | +25.1% | +154.3% |
| AMD | lead2 | +56.9% | -55% | +127.6% | -18.1% | +77.3% | +150.9% |
| Astera Labs | lead2 | · | · | · | · | +25.6% | +150.7% |
| 크레도 | lead2 | · | · | +46.3% | +245.2% | +114.1% | +88.9% |
| Global Unichip | lead2 | +21.4% | +67.6% | +99.4% | -13.7% | +101.4% | +86.3% |
| 르네사스 | lead2 | +8.2% | +2.4% | +88% | -13.6% | +23.8% | +83.8% |
| NXP반도체 | lead2 | +44.8% | -29.4% | +48.4% | -8% | +6.4% | +45.7% |
| 알칩 | lead2 | +14.3% | -8.7% | +365.1% | -18.9% | +0.8% | +40.2% |
| Qualcomm | lead2 | +22.3% | -38.4% | +35.1% | +7.7% | +13.9% | +34.2% |
| Broadcom | lead2 | +56.8% | -13.4% | +104.9% | +110.9% | +50.7% | +19.3% |
| NVIDIA | lead2 | +125.5% | -50.3% | +239% | +171.3% | +38.9% | +13.1% |
| Apple | lead2 | +34.6% | -26.4% | +49% | +30.7% | +9.1% | +9.8% |
| 소니 반도체 | lead2 | +27.2% | -8.4% | +27.8% | +17.9% | +1% | -8.7% |
| AT&S | lead1 | +57.5% | -22% | -27.6% | -41.3% | +188.9% | +493.2% |
| LG이노텍 | lead1 | +78.2% | -22% | -28.8% | -22.1% | +66.8% | +370.1% |
| 유니마이크론 | lead1 | +133.5% | -30.2% | +35.2% | -19.7% | +175.7% | +155.7% |
| ASE테크놀로지 | lead1 | +38.3% | -12.8% | +60.9% | +10.1% | +65.6% | +151.9% |
| 앰코테크놀로지 | lead1 | +65.6% | -2.4% | +40.3% | -22% | +58.4% | +130.3% |
| 난야PCB | lead1 | +110.6% | -46.7% | -0.5% | -38.3% | +188.2% | +125% |
| TSMC | lead1 | +12.1% | -36.8% | +42.5% | +92.9% | +56% | +53.3% |
| Resonac | node | -2.6% | -4% | +37.5% | +30.3% | +137.9% | +105.5% |

## Money in · revenue from (9)
### TSMC (high)  → /tsmc.md
- note: TSMC에 패키징 소재 공급.
- [confirms] 레조낙 (EN, news, published 2025-12-01) https://www.resonac.com/news/2025/12/01/3669.html: "TSMC에 패키징 소재 공급."
- [confirms] 레조낙 (EN, ir, published 2025-05-01) https://www.resonac.com/investors: "TSMC에 패키징 소재 공급."

### ASE테크놀로지 (mid)  → /ase.md
- note: ASE테크놀로지에 패키징 소재 공급.
- [confirms] 레조낙 (EN, news, published 2025-12-01) https://www.resonac.com/news/2025/12/01/3669.html: "ASE테크놀로지에 패키징 소재 공급."
- [confirms] 레조낙 (EN, ir, published 2025-05-01) https://www.resonac.com/investors: "ASE테크놀로지에 패키징 소재 공급."

### 앰코테크놀로지 (mid)  → /amkor.md
- note: 앰코테크놀로지에 패키징 소재 공급.
- [confirms] 레조낙 (EN, news, published 2025-12-01) https://www.resonac.com/news/2025/12/01/3669.html: "앰코테크놀로지에 패키징 소재 공급."
- [confirms] 레조낙 (EN, ir, published 2025-05-01) https://www.resonac.com/investors: "앰코테크놀로지에 패키징 소재 공급."

### 삼성전자 (mid)  → /samsung-electronics.md
- note: 삼성전자에 패키징 소재 공급.
- [confirms] 레조낙 (EN, news, published 2025-12-01) https://www.resonac.com/news/2025/12/01/3669.html: "삼성전자에 패키징 소재 공급."
- [confirms] 레조낙 (EN, ir, published 2025-05-01) https://www.resonac.com/investors: "삼성전자에 패키징 소재 공급."

### 신코덴키 (mid)  → /shinko.md
- note: 신코덴키에 ABF 필름·기판 소재 공급.
- [confirms] 신코덴키 (EN, ir, published 2025-05-01) https://www.shinko.co.jp/english/: "신코덴키에 ABF 필름·기판 소재 공급."
- [confirms] Market Growth Reports (EN, analysis, published 2025-01-01) https://www.marketgrowthreports.com/market-reports/abf-substrate-fc-bga-market-107527: "신코덴키에 ABF 필름·기판 소재 공급."

### 유니마이크론 (mid)  → /unimicron.md
- note: 유니마이크론에 ABF·기판 소재 공급.
- [confirms] 유니마이크론 (EN, ir, published 2025-05-01) https://www.unimicron.com/en/: "유니마이크론에 ABF·기판 소재 공급."
- [confirms] Market Growth Reports (EN, analysis, published 2025-01-01) https://www.marketgrowthreports.com/market-reports/abf-substrate-fc-bga-market-107527: "유니마이크론에 ABF·기판 소재 공급."

### AT&S (low)  → /at-s.md
- note: AT&S에 ABF·기판 소재 공급.
- [confirms] 디지털투데이 (KO, news, published 2025-06-01) https://www.digitaltoday.co.kr/news/articleView.html?idxno=610284: "레조낙 HBM NCF·TIM 소재 상위 점유"
- [confirms] AT&S (EN, ir, published 2025-05-01) https://ams.at-s.com/: "AT&S에 ABF·기판 소재 공급."
- [confirms] EDINET/회사 IR (JA, filing, published 2025-03-26) https://www.resonac.com/sites/default/files/2025-03/2024%E6%9C%89%E4%BE%A1%E8%A8%BC%E5%88%B8%E5%A0%B1%E5%91%8A%E6%9B%B8.pdf: "有価証券報告書: 매출·고객·사업."
- [confirms] Intel Market Research (EN, analysis, published 2025-01-01) https://www.intelmarketresearch.com/global-package-substrates-forecast-market-27111: "AT&S에 ABF·기판 소재 공급."

### 난야PCB (low)  → /nanya-pcb.md
- note: 난야PCB에 기판 소재 공급.
- [confirms] 난야PCB (EN, ir, published 2025-05-01) https://www.npc.com.tw/npceb2b/en/: "난야PCB에 기판 소재 공급."
- [confirms] MatrixBCG (EN, analysis, published 2025-01-01) https://matrixbcg.com/blogs/growth-strategy/nanyapcb: "난야PCB에 기판 소재 공급."

### LG이노텍 (low)  → /lg-innotek.md
- note: LG이노텍에 ABF·기판 소재 공급.
- [confirms] 파이낸셜뉴스 (KO, news, published 2026-06-17) https://www.fnnews.com/news/202606170709505720: "LG이노텍에 ABF·기판 소재 공급."
- [confirms] 테크M (KO, news, published 2025-01-01) https://www.techm.kr/news/articleView.html?idxno=134965: "LG이노텍에 ABF·기판 소재 공급."

## Money out · pays to (2)
### 부품·소재·R&D (비공개) (low)
- note: 패키징 소재 제조용 부품·소재·R&D(비공개).
- [confirms] 레조낙 (EN, ir, published 2025-05-01) https://www.resonac.com/investors: "패키징 소재 제조용 부품·소재·R&D(비공개)."

### 설비·인프라 (비공개) (low)
- note: 생산 설비·인프라 투자(비공개).
- [confirms] 레조낙 (EN, ir, published 2025-05-01) https://www.resonac.com/investors: "생산 설비·인프라 투자(비공개)."

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