World No.2 in FC-BGA substrates

Shinko Electric Industries

World No.2 in FC-BGA package substrates (~18% share). A Fujitsu affiliate strong in CPU substrates for Intel and AMD; transitioning to high-layer AI substrates.

6967.T Updated Jul 12, 2026 4 AI consumers· 2 recurring

Per the valuechain.wiki graph, Shinko Electric Industries is directly linked to 3 companies (1 supply, 2 revenue relationships) and reaches 12 companies within two hops; the links are backed by 7 dated sources, 2 of them primary filings (as of 2026-07-12).

Shinko Electric IndustriesNo.2 in FC-BGA package substrates
Money outResonaccopper foil & build-up materials (undisclosed)

Financials & Segments

  • Total revenue · No.2 in FC-BGA package substrates (~18%, duopoly with Ibiden) · delisted Jun 2025 (JIC-consortium buyout, non-public)
  • Segments · World No.2 in FC-BGA substrates

Revenue from

  • Intel High confidence· Market share 18% · 2024 · global FC-BGA share
    Provides FC-BGA package substrates to Intel.
    Confirms JA EDINET / company IR Published Jun 25, 2025: Annual Securities Report (EDINET)
    Confirms KO Digital Today Published Jun 1, 2025: Deepening reliance on Japanese suppliers in the HBM4 era
    Confirms EN Japan Exchange Group Published May 20, 2025: Shinko Electric — decision on delisting from Tokyo Stock Exchange (Jun 6, 2025)
    Confirms EN Shinko Published May 1, 2025: Shinko Electric
    Confirms EN DigiTimes Published Mar 21, 2025: Shinko Electric to delist in June; DNP and Mitsui Chemicals backend-materials partnership
    Confirms EN MGR Published Jan 1, 2025: Unimicron leads IC-substrate revenue
  • AMD Medium confidence
    Provides FC-BGA package substrates to AMD.
    Confirms EN Japan Exchange Group Published May 20, 2025: Shinko Electric — decision on delisting from Tokyo Stock Exchange (Jun 6, 2025)
    Confirms EN Shinko Published May 1, 2025: Shinko Electric
    Confirms EN DigiTimes Published Mar 21, 2025: Shinko Electric to delist in June; DNP and Mitsui Chemicals backend-materials partnership
    Confirms EN MGR Published Jan 1, 2025: Unimicron leads IC-substrate revenue

Pays to

  • Resonac Medium confidence
    Buys ABF film and substrate materials from Resonac.
    Confirms EN Shinko Published May 1, 2025: Shinko Electric
    Confirms EN MGR Published Jan 1, 2025: Unimicron leads IC-substrate revenue
  • copper foil & build-up materials (undisclosed) Low confidence
    Materials and R&D (undisclosed).
    Confirms EN Shinko Published May 1, 2025: Shinko Electric

Investors

  • DNP · JIC (Dai Nippon Printing · Japan government fund) High confidence
    A consortium led by JIC Capital (JICC-04) fully acquired Shinko via a tender offer (completed Mar 2025), delisting it on Jun 6, 2025 — with DNP and Mitsui Chemicals as backend-materials partners. Control moved from Fujitsu-affiliated to non-public under JIC.
    Confirms EN Japan Exchange Group Published May 20, 2025: Shinko Electric — decision on delisting from Tokyo Stock Exchange (Jun 6, 2025)
    Confirms KO KIPOST Published Jan 1, 2025: JIC and DNP acquire Shinko Electric

Value-chain ripple (2 tiers)

Following node-to-node links up to 2 tiers; each firm is shown once, at its nearest tier.

CompanyChain'21'22'23'24'25YTD
Dell Technologieslead2+51.2-26.6+95.9+53+11.2+248.1
Lenovolead2-4.6-20.9+36.2+18.2-0.6+175.7
Hewlett Packard Enterpriselead2+37.4+4.5+9.7+29.1+15.5+104
Mercury Systemslead2-37.5-18.7-18.3+14.8+73.8+47.9
ASUSTeK Computerlead2+35.5-12.9+72+41.1-14.1+46.7
Alphabet (Google)lead2+65.3-39.1+58.3+36+66+14.3
Meta Platformslead2+23.1-64.2+194.1+66+13.1+1.6
Microsoftlead2+52.5-28+58.2+12.9+15.6-20
Oraclelead2+36.9-4.6+30.9+60+18.1-27.4
Intellead1+6.1-46.6+94.6-59.6+84+197.7
AMDlead1+56.9-55+127.6-18.1+77.3+160.5
Shinko Electric Industriesnode······
Resonacbenef1-2.6-4+37.5+30.3+137.9+80.4

Shinko's thesis is 'the No.2 supplier in the FC-BGA substrate bottleneck, now taken private.' It forms a duopoly with Ibiden (~18% share) in high-end CPU/server substrates with heavy Intel dependence, and the shift of AI/HPC chips to large-area, high-layer FC-BGA is the substrate demand. In June 2025 a JIC consortium (JICC-04, with DNP and Mitsui Chemicals) acquired and delisted it — a structural move to reshape the backend materials/substrate supply chain around Japan's sovereign fund and materials makers. What matters is the strength of AI-packaging demand and, under private ownership, the Intel CPU cycle and investment capacity. Being non-public, individual financials are not disclosed.

Analysis generated from returns as of 2026-07-12

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