# 신코덴키 (6967.T)
> FC-BGA 패키지 기판 세계 2위(점유율 약 18%). 후지쯔 계열로 CPU용 기판에 강하며 인텔·AMD에 공급. AI용 고층 기판으로 전환 중.
Canonical: https://valuechain.wiki/shinko · Updated: 2026-06-21T12:40:59.877021+00:00 · Source: ValueChain.wiki (refined facts, cited)

## Financials & segments
- 총매출: FC-BGA 패키지 기판 세계 2위
- 사업부문: FC-BGA 패키지 기판 세계 2위

## Value-chain annual returns (top→bottom: demand → node → supply)
| Company | Chain | 2021 | 2022 | 2023 | 2024 | 2025 | YTD |
| --- | --- | --- | --- | --- | --- | --- | --- |
| 알파벳 (구글) | lead2 | +65.3% | -39.1% | +58.3% | +35.8% | +66.1% | +17.8% |
| 메타 플랫폼스 | lead2 | +23.1% | -64.2% | +194.1% | +65.9% | +13.1% | -12.3% |
| 마이크로소프트 | lead2 | +52.5% | -28% | +58.2% | +12.9% | +15.6% | -21.2% |
| Intel | lead1 | +6.1% | -46.6% | +94.6% | -59.6% | +84% | +263.1% |
| AMD | lead1 | +56.9% | -55% | +127.6% | -18.1% | +77.3% | +150.9% |
| 신코덴키 | node | · | · | · | · | · | · |
| Resonac | benef1 | -2.6% | -4% | +37.5% | +30.3% | +137.9% | +105.5% |

## Money in · revenue from (2)
### Intel (high)  → /intel.md
- metric: 점유율 18 · 2024 · FC-BGA 기판 세계 점유율
- note: Intel에 FC-BGA 패키지 기판 공급/제공.
- [confirms] EDINET/회사 IR (JA, filing, published 2025-06-25) https://disclosure2dl.edinet-fsa.go.jp/searchdocument/pdf/S100W56G.pdf: "有価証券報告書: 매출·고객·사업."
- [confirms] 디지털투데이 (KO, news, published 2025-06-01) https://www.digitaltoday.co.kr/news/articleView.html?idxno=610284: "HBM4 일본 소부장 의존(신코 기판)"
- [confirms] 신코덴키 (EN, ir, published 2025-05-01) https://www.shinko.co.jp/english/: "Intel에 FC-BGA 패키지 기판 공급/제공."
- [confirms] Market Growth Reports (EN, analysis, published 2025-01-01) https://www.marketgrowthreports.com/market-reports/abf-substrate-fc-bga-market-107527: "Intel에 FC-BGA 패키지 기판 공급/제공."

### AMD (mid)  → /amd.md
- note: AMD에 FC-BGA 패키지 기판 공급/제공.
- [confirms] 신코덴키 (EN, ir, published 2025-05-01) https://www.shinko.co.jp/english/: "AMD에 FC-BGA 패키지 기판 공급/제공."
- [confirms] Market Growth Reports (EN, analysis, published 2025-01-01) https://www.marketgrowthreports.com/market-reports/abf-substrate-fc-bga-market-107527: "AMD에 FC-BGA 패키지 기판 공급/제공."

## Money out · pays to (2)
### Resonac (mid)  → /resonac.md
- note: Resonac에서 ABF 필름·기판 소재 매입.
- [confirms] 신코덴키 (EN, ir, published 2025-05-01) https://www.shinko.co.jp/english/: "Resonac에서 ABF 필름·기판 소재 매입."
- [confirms] Market Growth Reports (EN, analysis, published 2025-01-01) https://www.marketgrowthreports.com/market-reports/abf-substrate-fc-bga-market-107527: "Resonac에서 ABF 필름·기판 소재 매입."

### 동박·빌드업 소재 (비공개) (low)
- note: 제조용 원재료·소재·R&D(비공개).
- [confirms] 신코덴키 (EN, ir, published 2025-05-01) https://www.shinko.co.jp/english/: "제조용 원재료·소재·R&D(비공개)."

---
_Generated for LLM/agent consumption. Each edge lists stance (confirms/mentions/contradicts), source publisher, language, date, and excerpt for verification._