High-end IC substrates (HBM, 3D)
AT&S
An Austrian maker of high-end IC substrates/FC-BGA (~10% share), specialized in HBM and 3D-IC advanced packaging for AMD and Intel.
ATS.VI Updated Jun 21, 2026
Annual return · 2026-06-19'21+57.5%'22-22%'23-27.6%'24-41.3%'25+188.9%YTD+493.2%
Financials & Segments
- Total revenue · High-end IC substrates (HBM, 3D)
- Segments · High-end IC substrates (HBM, 3D)
Revenue from
- AMD High confidence· Market share 10 · 2024 · global FC-BGA share
Provides high-end IC substrates to AMD. - Intel Medium confidence
Provides high-end IC substrates to Intel.Confirms EN Company IR / exchange filing Published Apr 1, 2025: "Annual report: revenue, customers, business."
Pays to
- 동박·빌드업 소재 (비공개) Low confidence
Materials and R&D (undisclosed). - Resonac Low confidence
Buys ABF and substrate materials from Resonac.
Value-chain ripple (tiers 2–3)
Following node-to-node links up to 3 tiers; each firm is shown once, at its nearest tier.
| Company | Chain | '21 | '22 | '23 | '24 | '25 | YTD |
|---|---|---|---|---|---|---|---|
| Alphabet (Google) | lead2 | +65.3 | -39.1 | +58.3 | +35.8 | +66.1 | +17.8 |
| Meta Platforms | lead2 | +23.1 | -64.2 | +194.1 | +65.9 | +13.1 | -12.3 |
| Microsoft | lead2 | +52.5 | -28 | +58.2 | +12.9 | +15.6 | -21.2 |
| Intel | lead1 | +6.1 | -46.6 | +94.6 | -59.6 | +84 | +263.1 |
| AMD | lead1 | +56.9 | -55 | +127.6 | -18.1 | +77.3 | +150.9 |
| AT&S | node | +57.5 | -22 | -27.6 | -41.3 | +188.9 | +493.2 |
| Resonac | benef1 | -2.6 | -4 | +37.5 | +30.3 | +137.9 | +105.5 |
YTD as of 2026-06-19 · source: Yahoo Finance