# AT&S (ATS.VI)
> 오스트리아 고성능 IC 패키지 기판(FC-BGA) 제조사(점유율 약 10%). HBM·3D IC용 어드밴스드 패키징에 특화, AMD·인텔에 공급.
Canonical: https://valuechain.wiki/at-s · Updated: 2026-06-21T12:43:33.030821+00:00 · Source: ValueChain.wiki (refined facts, cited)

## Financials & segments
- 총매출: 고성능 IC 패키지 기판 (HBM·3D)
- 사업부문: 고성능 IC 패키지 기판 (HBM·3D)

## Annual stock return (as of 2026-06-19)
- 2021: +57.5%
- 2022: -22%
- 2023: -27.6%
- 2024: -41.3%
- 2025: +188.9%
- 2026 YTD: +493.2%

## Value-chain annual returns (top→bottom: demand → node → supply; YTD as of 2026-06-19)
| Company | Chain | 2021 | 2022 | 2023 | 2024 | 2025 | YTD |
| --- | --- | --- | --- | --- | --- | --- | --- |
| 알파벳 (구글) | lead2 | +65.3% | -39.1% | +58.3% | +35.8% | +66.1% | +17.8% |
| 메타 플랫폼스 | lead2 | +23.1% | -64.2% | +194.1% | +65.9% | +13.1% | -12.3% |
| 마이크로소프트 | lead2 | +52.5% | -28% | +58.2% | +12.9% | +15.6% | -21.2% |
| Intel | lead1 | +6.1% | -46.6% | +94.6% | -59.6% | +84% | +263.1% |
| AMD | lead1 | +56.9% | -55% | +127.6% | -18.1% | +77.3% | +150.9% |
| AT&S | node | +57.5% | -22% | -27.6% | -41.3% | +188.9% | +493.2% |
| Resonac | benef1 | -2.6% | -4% | +37.5% | +30.3% | +137.9% | +105.5% |

## Money in · revenue from (2)
### AMD (high)  → /amd.md
- metric: 점유율 10 · 2024 · FC-BGA 기판 세계 점유율
- note: AMD에 고성능 IC 패키지 기판 공급/제공.
- [confirms] AT&S (EN, ir, published 2025-05-01) https://ams.at-s.com/: "AMD에 고성능 IC 패키지 기판 공급/제공."
- [confirms] Intel Market Research (EN, analysis, published 2025-01-01) https://www.intelmarketresearch.com/global-package-substrates-forecast-market-27111: "AMD에 고성능 IC 패키지 기판 공급/제공."

### Intel (mid)  → /intel.md
- note: Intel에 고성능 IC 패키지 기판 공급/제공.
- [confirms] 시사저널e (KO, news, published 2025-06-01) https://www.sisajournal-e.com/news/articleView.html?idxno=295754: "반도체 기판 업황(대만·오스트리아 포함)"
- [confirms] AT&S (EN, ir, published 2025-05-01) https://ams.at-s.com/: "Intel에 고성능 IC 패키지 기판 공급/제공."
- [confirms] 회사 IR/거래소 공시 (EN, filing, published 2025-04-01) https://ams.at-s.com/financial-reports: "연차보고서: 매출·고객·사업."
- [confirms] Intel Market Research (EN, analysis, published 2025-01-01) https://www.intelmarketresearch.com/global-package-substrates-forecast-market-27111: "Intel에 고성능 IC 패키지 기판 공급/제공."

## Money out · pays to (2)
### 동박·빌드업 소재 (비공개) (low)
- note: 제조용 원재료·소재·R&D(비공개).
- [confirms] AT&S (EN, ir, published 2025-05-01) https://ams.at-s.com/: "제조용 원재료·소재·R&D(비공개)."

### Resonac (low)  → /resonac.md
- note: Resonac에서 ABF·기판 소재 매입.
- [confirms] AT&S (EN, ir, published 2025-05-01) https://ams.at-s.com/: "Resonac에서 ABF·기판 소재 매입."
- [confirms] Intel Market Research (EN, analysis, published 2025-01-01) https://www.intelmarketresearch.com/global-package-substrates-forecast-market-27111: "Resonac에서 ABF·기판 소재 매입."

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_Generated for LLM/agent consumption. Each edge lists stance (confirms/mentions/contradicts), source publisher, language, date, and excerpt for verification._