{"slug":"intel","name":"Intel","name_en":"Intel","ticker":"INTC","updated_at":"2026-06-21T08:17:57.457413+00:00","canonical":"https://valuechain.wiki/intel","kicker":"CPU · 데이터센터 · 파운드리","kicker_en":"CPU · Data center · Foundry","lead":"PC·서버 CPU의 전통 강자이자 파운드리(Intel Foundry)에 재도전 중. 첨단 공정(18A·14A)에 ASML High-NA EUV를 업계 최초 도입. 동시에 일부 칩 타일은 TSMC에 외주하는 파운드리 고객이기도 하다.","lead_en":"The longtime leader in PC and server CPUs, now rebuilding a foundry (Intel Foundry). First in the industry to adopt ASML's High-NA EUV for its leading-edge nodes (18A, 14A). At the same time it outsources some chip tiles to TSMC, so it is also a foundry customer.","segments":{"fy":2025,"parts":[{"desc":"PC용 CPU(Core)","name":"Client Computing"},{"desc":"서버 CPU(Xeon)·Gaudi 가속기","name":"Data Center & AI"},{"desc":"위탁생산 사업(18A·14A)","name":"Intel Foundry"}],"total":"Client Computing · Data Center & AI · Intel Foundry 3개 부문","source":"https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm","concentration":"Dell·Lenovo가 각 10%+ 고객(10-K). 파운드리는 외부고객 확보가 관건."},"segments_en":{"parts":[{"desc":"PC CPUs (Core)","name":"Client Computing"},{"desc":"Server CPUs (Xeon) and Gaudi accelerators","name":"Data Center & AI"},{"desc":"Contract manufacturing (18A, 14A)","name":"Intel Foundry"}],"total":"Client Computing, Data Center & AI, Intel Foundry (three segments)","concentration":"Dell and Lenovo are each 10%+ customers (10-K). Winning external foundry customers is the key question."},"edges":[{"direction":"revenue","counterparty":"Dell","counterparty_slug":null,"confidence":"high","metric":null,"note":"PC·서버 CPU 최대 고객 중 하나(10-K 10%+).","note_en":"One of the largest PC/server CPU customers (10%+ in the 10-K).","sources":[{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-01-23","url":"https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm","title":"Intel Form 10-K (FY2025, 2025-12-27)","title_en":"Intel Form 10-K (FY2025, 2025-12-27)","excerpt":"Intel 10-K: Dell이 매출의 10% 이상 고객.","excerpt_en":"Intel 10-K: Dell is a 10%+ revenue customer."},{"stance":"confirms","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2025-10-23","url":"https://www.sec.gov/Archives/edgar/data/0000050863/000005086325000169/q325earningsrelease.htm","title":"Intel FY2025 3분기 실적 (8-K)","title_en":"Intel FY2025 Q3 results (8-K)","excerpt":"FY2025 인텔 프로덕트 매출 $48.9B, 파운드리 $17.5B.","excerpt_en":"FY2025 Intel Products revenue $48.9B, Foundry $17.5B."}]},{"direction":"revenue","counterparty":"Lenovo","counterparty_slug":null,"confidence":"high","metric":null,"note":"PC CPU 주요 고객(10-K 10%+).","note_en":"Major PC CPU customer (10%+ in the 10-K).","sources":[{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-01-23","url":"https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm","title":"Intel Form 10-K (FY2025, 2025-12-27)","title_en":"Intel Form 10-K (FY2025, 2025-12-27)","excerpt":"Intel 10-K: Lenovo가 매출의 10% 이상 고객.","excerpt_en":"Intel 10-K: Lenovo is a 10%+ revenue customer."}]},{"direction":"cost","counterparty":"TSMC","counterparty_slug":"tsmc","confidence":"high","metric":{"type":"supply_status","basis":"외부 파운드리(타일)","basis_en":"external foundry (tiles)","qualifier":"confirmed_no_disclosed_value"},"note":"일부 칩 타일(컴퓨트 등)을 TSMC에 외주. 자체 파운드리와 병행하는 파운드리 고객.","note_en":"Outsources some chip tiles (e.g. compute) to TSMC; a foundry customer alongside running its own foundry.","sources":[{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-01-23","url":"https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm","title":"Intel Form 10-K (FY2025, 2025-12-27)","title_en":"Intel Form 10-K (FY2025, 2025-12-27)","excerpt":"Intel 10-K: 외부 파운드리를 제품에 통합해 사용.","excerpt_en":"Intel 10-K: incorporates external foundries into its products."}]},{"direction":"cost","counterparty":"ASML","counterparty_slug":"asml","confidence":"high","metric":{"type":"supply_status","basis":"EUV·High-NA EUV","basis_en":"EUV and High-NA EUV","qualifier":"first_adopter"},"note":"첨단공정(18A·14A)용 EUV·High-NA EUV 핵심 매입처. Intel이 High-NA 업계 최초 도입.","note_en":"Key supplier of EUV and High-NA EUV for leading-edge nodes (18A, 14A). Intel was first in the industry to adopt High-NA.","sources":[{"stance":"confirms","publisher":"한국경제","publisher_en":"Korea Economic Daily","kind":"news","lang":"ko","published_at":"2026-04-23","url":"https://www.hankyung.com/article/202604231581i","title":"대만 TSMC, 네덜란드 ASML 최신 장비 도입 보류","title_en":"Taiwan's TSMC holds off on adopting ASML's latest equipment","excerpt":"Intel·삼성·SK·마이크론·TSMC 모두 ASML High-NA EUV 발주.","excerpt_en":"Intel, Samsung, SK, Micron and TSMC have all ordered ASML's High-NA EUV."},{"stance":"mentions","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-01-23","url":"https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm","title":"Intel Form 10-K (FY2025, 2025-12-27)","title_en":"Intel Form 10-K (FY2025, 2025-12-27)","excerpt":"Intel 10-K: Intel 18A·14A 등 EUV 리소그래피 공정에 대규모 투자.","excerpt_en":"Intel 10-K: substantial investment in EUV lithography nodes such as Intel 18A and 14A."},{"stance":"confirms","publisher":"전자신문","publisher_en":"ETNews","kind":"news","lang":"ko","published_at":"2024-10-16","url":"https://www.etnews.com/20241016000345","title":"ASML '초미세화 위한 하이퍼 NA EUV 개발'","title_en":"ASML develops High-NA EUV for finer scaling","excerpt":"Intel이 ASML High-NA EUV를 업계 최초 도입(18A·14A).","excerpt_en":"Intel was the first to adopt ASML's High-NA EUV (for 18A and 14A)."}]},{"direction":"cost","counterparty":"HPSP","counterparty_slug":"hpsp","confidence":"high","metric":null,"note":"HPSP에서 고압 수소 어닐링 장비 매입(세계 유일).","note_en":"Buys high-pressure hydrogen annealing tools from HPSP (sole supplier).","sources":[{"stance":"confirms","publisher":"한국경제","publisher_en":"Korea Economic Daily","kind":"news","lang":"ko","published_at":"2025-07-13","url":"https://www.hankyung.com/article/2025071351421","title":"초미세 공정 판 바꾼 K기술…HPSP 고압수소장비 독점","title_en":"HPSP holds a monopoly in high-pressure hydrogen annealing","excerpt":"Intel가 HPSP 고압 어닐링 장비를 채용.","excerpt_en":"Intel adopts HPSP high-pressure annealing tools."}]},{"direction":"cost","counterparty":"Ibiden","counterparty_slug":"ibiden","confidence":"high","metric":null,"note":"Ibiden에서 FC-BGA 패키지 기판 매입.","note_en":"Buys FC-BGA package substrates from Ibiden.","sources":[{"stance":"confirms","publisher":"자본시장뉴스","publisher_en":"Jabon","kind":"news","lang":"ko","published_at":"2026-02-01","url":"https://www.jabon.co.kr/news/articleView.html?idxno=926","title":"이비덴, 4.7조원 베팅…엔비디아용 AI 기판 증설","title_en":"Ibiden bets ¥500B to expand NVIDIA AI substrates","excerpt":"엔비디아용 AI 기판 4.7조원 증설.","excerpt_en":"¥500B expansion for NVIDIA AI substrates."},{"stance":"confirms","publisher":"이비덴","publisher_en":"Ibiden","kind":"ir","lang":"en","published_at":"2025-05-01","url":"https://www.ibiden.com/ir/","title":"이비덴 IR","title_en":"Ibiden Investor Relations","excerpt":"IR: IC 패키지 기판 매출.","excerpt_en":"IR: IC package-substrate revenue."},{"stance":"confirms","publisher":"디지타임스","publisher_en":"DigiTimes","kind":"news","lang":"en","published_at":"2025-01-02","url":"https://www.digitimes.com/news/a20250102PD221/ibiden-ic-substrate-demand-market-intel-nvidia.html","title":"이비덴, 인텔·엔비디아와 AI 기판 독점적 지위","title_en":"Ibiden’s exclusive AI-substrate position with Intel and NVIDIA","excerpt":"인텔·엔비디아에 FC-BGA 독점적 공급.","excerpt_en":"Exclusive FC-BGA supply to Intel and NVIDIA."}]},{"direction":"revenue","counterparty":"HP Inc","counterparty_slug":null,"confidence":"mid","metric":null,"note":"PC CPU 주요 OEM 고객.","note_en":"Major PC CPU OEM customer.","sources":[{"stance":"mentions","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-01-23","url":"https://www.sec.gov/Archives/edgar/data/50863/000005086326000011/intc-20251227.htm","title":"Intel Form 10-K (FY2025, 2025-12-27)","title_en":"Intel Form 10-K (FY2025, 2025-12-27)","excerpt":"Intel 10-K: 주요 OEM 고객 중 하나.","excerpt_en":"Intel 10-K: one of the major OEM customers."}]},{"direction":"revenue","counterparty":"마이크로소프트","counterparty_slug":"microsoft","confidence":"mid","metric":null,"note":"Azure 서버용 제온(Xeon) CPU 공급. ND MI300X v5 VM은 4세대 제온을 호스트로 사용.","note_en":"Supplies Xeon CPUs for Azure servers; the ND MI300X v5 VM uses 4th-gen Xeon as host.","sources":[{"stance":"confirms","publisher":"AMD 투자자관계","publisher_en":"AMD Investor Relations","kind":"ir","lang":"en","published_at":"2024-05-21","url":"https://ir.amd.com/news-events/press-releases/detail/1198/amd-instinct-mi300x-accelerators-power-microsoft-azure-openai-service-workloads-and-new-azure-nd-mi300x-v5-vms","title":"AMD 인스팅트 MI300X, 마이크로소프트 Azure OpenAI 서비스 구동","title_en":"AMD Instinct MI300X Accelerators Power Microsoft Azure OpenAI Service Workloads","excerpt":"ND MI300X v5는 \"2개의 4세대 인텔 제온\" 프로세서를 호스트 CPU로 사용.","excerpt_en":"The ND MI300X v5 uses \"two 4th Gen Intel Xeon Scalable processors\" as host CPUs."}]},{"direction":"revenue","counterparty":"알파벳 (구글)","counterparty_slug":"alphabet","confidence":"mid","metric":null,"note":"구글 차세대 TPU 일부 물량을 파운드리에서 수주(TSMC 대체 공급처).","note_en":"Won foundry orders for part of Google’s next-gen TPU volume (alternative to TSMC).","sources":[{"stance":"confirms","publisher":"헤럴드경제","publisher_en":"Herald Economy","kind":"news","lang":"ko","published_at":"2026-06-10","url":"https://biz.heraldcorp.com/article/10768088","title":"TSMC가 다 못 만든다…인텔, 구글 AI 칩 수주","title_en":"TSMC at capacity: Intel wins Google AI-chip foundry orders","excerpt":"인텔 파운드리가 구글 AI 칩(TPU)을 수주.","excerpt_en":"Intel Foundry won Google AI-chip (TPU) orders."}]},{"direction":"cost","counterparty":"어플라이드 머티어리얼즈","counterparty_slug":"applied-materials","confidence":"mid","metric":null,"note":"어플라이드의 로직 fab 전공정 장비 매입.","note_en":"Buys Applied Materials logic-fab tools.","sources":[{"stance":"mentions","publisher":"PatentPC","publisher_en":"PatentPC","kind":"analysis","lang":"en","published_at":null,"url":"https://patentpc.com/blog/top-chip-making-equipment-companies-asml-applied-materials-and-lam-research-market-data","title":"반도체 장비 톱: ASML·어플라이드·램","title_en":"Top chip-making equipment companies: ASML, Applied Materials, Lam Research","excerpt":"인텔 fab에 어플라이드 장비 사용.","excerpt_en":"Intel fabs use Applied Materials tools."}]},{"direction":"cost","counterparty":"KLA","counterparty_slug":"kla","confidence":"mid","metric":null,"note":"KLA의 검사·계측 장비 매입.","note_en":"Buys KLA inspection and metrology tools.","sources":[{"stance":"confirms","publisher":"KIPOST","publisher_en":"KIPOST","kind":"news","lang":"ko","published_at":null,"url":"https://www.kipost.net/news/articleView.html?idxno=201410","title":"KLA, EUV 공정용 결함 검사 장비 발표 (인텔·삼성·SK 공급)","title_en":"KLA unveils EUV defect-inspection tools (supplies Intel, Samsung, SK)","excerpt":"KLA가 인텔에 검사장비 공급.","excerpt_en":"KLA supplies Intel with inspection tools."}]},{"direction":"cost","counterparty":"BESI","counterparty_slug":"besi","confidence":"mid","metric":null,"note":"BESI에서 하이브리드 본딩·다이 어태치 장비 매입.","note_en":"Buys hybrid-bonding and die-attach tools from BESI.","sources":[{"stance":"confirms","publisher":"Yole Group","publisher_en":"Yole Group","kind":"analysis","lang":"en","published_at":"2025-08-01","url":"https://www.yolegroup.com/press-release/advanced-packaging-fuels-transformation-in-back-end-equipment-tcb-and-hybrid-bonding-to-lead-1-3-billion-market-expansion-by-2030/","title":"첨단 패키징 장비, TCB·하이브리드 본딩 주도","title_en":"Advanced packaging back-end equipment: TCB and hybrid bonding lead","excerpt":"인텔이 BESI 하이브리드 본딩 장비 채용.","excerpt_en":"Intel adopts BESI hybrid-bonding tools."}]},{"direction":"cost","counterparty":"피에스케이","counterparty_slug":"psk-inc","confidence":"mid","metric":null,"note":"PSK에서 드라이 스트립 장비 매입.","note_en":"Buys dry-strip tools from PSK.","sources":[{"stance":"confirms","publisher":"디일렉","publisher_en":"THE ELEC","kind":"news","lang":"ko","published_at":null,"url":"https://www.thelec.kr/news/articleView.html?idxno=37929","title":"PSK, 메탈 에처 출시…삼성·SK·인텔 고객","title_en":"PSK launches metal etcher; customers Samsung, SK, Intel","excerpt":"인텔이 PSK 고객.","excerpt_en":"Intel is a PSK customer."}]},{"direction":"cost","counterparty":"도쿄일렉트론","counterparty_slug":"tokyo-electron","confidence":"mid","metric":null,"note":"도쿄일렉트론에서 코터·식각·증착·세정 장비 매입.","note_en":"Buys coater, etch, deposition and clean tools from Tokyo Electron.","sources":[{"stance":"confirms","publisher":"시사저널e","publisher_en":"Sisa Journal e","kind":"news","lang":"ko","published_at":null,"url":"https://www.sisajournal-e.com/news/articleView.html?idxno=406466","title":"해외 장비社 삼성·SK 공략 강화 (TEL 등 국내투자 봇물)","title_en":"Foreign toolmakers including TEL ramp investment to court Samsung and SK","excerpt":"Intel가 TEL 전공정 장비 도입.","excerpt_en":"Intel adopts TEL wafer-fab tools."}]},{"direction":"cost","counterparty":"신에쓰화학","counterparty_slug":"shin-etsu","confidence":"mid","metric":null,"note":"Shin-Etsu Chemical에서 300mm 실리콘 웨이퍼 매입(LTA).","note_en":"Buys 300mm silicon wafers from Shin-Etsu Chemical under LTA.","sources":[{"stance":"confirms","publisher":"아이씨엔매거진","publisher_en":"ICN Magazine","kind":"news","lang":"ko","published_at":"2026-01-15","url":"https://icnweb.kr/2026/79720/","title":"HBM4 시대의 보이지 않는 병목—특수 폴리시드 웨이퍼","title_en":"HBM4’s hidden bottleneck — special polished wafers","excerpt":"Intel 웨이퍼 수급에 Shin-Etsu Chemical 의존.","excerpt_en":"Intel depends on Shin-Etsu Chemical for wafer supply."}]},{"direction":"cost","counterparty":"섬코","counterparty_slug":"sumco","confidence":"mid","metric":null,"note":"SUMCO Corporation에서 300mm 실리콘 웨이퍼 매입(LTA).","note_en":"Buys 300mm silicon wafers from SUMCO Corporation under LTA.","sources":[{"stance":"confirms","publisher":"아이씨엔매거진","publisher_en":"ICN Magazine","kind":"news","lang":"ko","published_at":"2026-01-15","url":"https://icnweb.kr/2026/79720/","title":"HBM4 시대의 보이지 않는 병목—특수 폴리시드 웨이퍼","title_en":"HBM4’s hidden bottleneck — special polished wafers","excerpt":"Intel 웨이퍼 수급에 SUMCO Corporation 의존.","excerpt_en":"Intel depends on SUMCO Corporation for wafer supply."}]},{"direction":"cost","counterparty":"Synopsys","counterparty_slug":"synopsys","confidence":"mid","metric":null,"note":"Synopsys에서 EDA 설계 툴·IP 매입/사용.","note_en":"Uses/buys EDA tools and IP from Synopsys.","sources":[{"stance":"confirms","publisher":"서울경제","publisher_en":"Seoul Economic Daily","kind":"news","lang":"ko","published_at":"2025-07-01","url":"https://www.sedaily.com/NewsView/2GVCJ4DVZD","title":"中, 시높시스-앤시스 합병 조건부 승인","title_en":"China conditionally approves Synopsys-Ansys merger","excerpt":"삼성 등 시높시스 EDA 활용.","excerpt_en":"Samsung and others use Synopsys EDA."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2024-12-18","url":"https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=SNPS&type=10-K","title":"Synopsys 연례보고서 (10-K)","title_en":"Synopsys Form 10-K","excerpt":"10-K: EDA 툴·IP 매출, 주요 반도체 고객.","excerpt_en":"10-K: EDA tools/IP revenue and major chip customers."},{"stance":"confirms","publisher":"SemiAnalysis","publisher_en":"SemiAnalysis","kind":"analysis","lang":"en","published_at":"2024-06-01","url":"https://newsletter.semianalysis.com/p/eda-market-primer","title":"EDA 시장 입문 (시높시스 31%·케이던스 30%)","title_en":"EDA Market Primer (Synopsys 31%, Cadence 30%)","excerpt":"시높시스 EDA 세계 ~31% 1위.","excerpt_en":"Synopsys leads EDA at ~31%."}]},{"direction":"cost","counterparty":"Cadence Design Systems","counterparty_slug":"cadence","confidence":"mid","metric":null,"note":"Cadence Design Systems에서 EDA 설계 툴·IP 매입/사용.","note_en":"Uses/buys EDA tools and IP from Cadence Design Systems.","sources":[{"stance":"confirms","publisher":"서울경제","publisher_en":"Seoul Economic Daily","kind":"news","lang":"ko","published_at":"2025-03-01","url":"https://www.sedaily.com/article/14136879","title":"AI 반도체 설계 강자 케이던스, 성장엔진 재점화","title_en":"Cadence, an AI chip-design leader, reignites growth","excerpt":"AI 칩 설계로 케이던스 성장.","excerpt_en":"Cadence grows on AI-chip design."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2025-02-24","url":"https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=CDNS&type=10-K","title":"Cadence 연례보고서 (10-K)","title_en":"Cadence Form 10-K","excerpt":"10-K: EDA 툴·IP 매출.","excerpt_en":"10-K: EDA tools/IP revenue."},{"stance":"confirms","publisher":"SemiAnalysis","publisher_en":"SemiAnalysis","kind":"analysis","lang":"en","published_at":"2024-06-01","url":"https://newsletter.semianalysis.com/p/eda-market-primer","title":"EDA 시장 입문 (시높시스 31%·케이던스 30%)","title_en":"EDA Market Primer (Synopsys 31%, Cadence 30%)","excerpt":"케이던스 EDA 세계 ~30% 2위.","excerpt_en":"Cadence is No.2 in EDA at ~30%."}]},{"direction":"cost","counterparty":"GlobalWafers","counterparty_slug":"globalwafers","confidence":"mid","metric":null,"note":"GlobalWafers에서 300mm 실리콘 웨이퍼 매입/사용.","note_en":"Uses/buys 300mm silicon wafers from GlobalWafers.","sources":[{"stance":"confirms","publisher":"GlobalWafers","publisher_en":"GlobalWafers","kind":"ir","lang":"en","published_at":"2025-03-01","url":"https://www.globalwafers.com/en/investors","title":"글로벌웨이퍼스 IR","title_en":"GlobalWafers Investor Relations","excerpt":"IR: 실리콘 웨이퍼 매출·고객.","excerpt_en":"IR: silicon-wafer revenue and customers."},{"stance":"confirms","publisher":"Mordor Intelligence","publisher_en":"Mordor Intelligence","kind":"analysis","lang":"en","published_at":"2025-01-01","url":"https://www.mordorintelligence.com/industry-reports/semiconductor-silicon-wafer-market","title":"실리콘 웨이퍼 시장 (상위 5사 과점)","title_en":"Silicon Wafer Market (top-five oligopoly)","excerpt":"300mm 상위 5사 과점, 글로벌웨이퍼스 ~15%.","excerpt_en":"Top-five 300mm oligopoly; GlobalWafers ~15%."},{"stance":"confirms","publisher":"디일렉","publisher_en":"THE ELEC","kind":"news","lang":"ko","published_at":"2024-06-01","url":"https://www.thelec.kr/news/articleView.html?idxno=9435","title":"글로벌웨이퍼스, 실트로닉 인수 시도(獨 불허로 무산)","title_en":"GlobalWafers’ Siltronic bid (blocked by Germany)","excerpt":"TSMC·UMC·삼성 등에 웨이퍼 공급.","excerpt_en":"Supplies wafers to TSMC, UMC, Samsung."}]}]}