{"slug":"amkor","name":"앰코테크놀로지","name_en":"Amkor Technology","ticker":"AMKR","updated_at":"2026-06-20T09:06:41.986604+00:00","canonical":"https://valuechain.wiki/amkor","kicker":"OSAT (후공정 패키징·테스트)","kicker_en":"OSAT (packaging & test)","lead":"미국 본사 최대 OSAT(후공정 패키징·테스트). FY2025 매출 $6.7B. 최대 고객은 애플로 10년 넘게 칩을 패키징해 왔고, TSMC가 만든 애플 실리콘을 애리조나 신캠퍼스($7B)에서 패키징할 예정. 패키징 장비는 ASMPT·BESI, 기판은 삼성전기 등에서 매입.","lead_en":"The largest US-headquartered OSAT (outsourced packaging and test). FY2025 revenue $6.7B. Its largest customer is Apple, whose chips it has packaged for over a decade; its $7B Arizona campus will package Apple silicon made at TSMC. Buys packaging equipment from ASMPT and BESI and substrates from suppliers such as Samsung Electro-Mechanics.","segments":{"fy":2025,"parts":[{"desc":"플립칩·웨이퍼레벨·SiP","name":"첨단 패키징"},{"desc":"리드프레임·기판","name":"주류 패키징"},{"desc":"최종 테스트","name":"테스트"}],"total":"FY2025 매출 $6.7B","source":"https://www.sec.gov/Archives/edgar/data/0001047127/000104712726000014/amkr-20251231.htm","concentration":"최대 고객 애플(10년+). 애리조나 $7B 캠퍼스로 애플 실리콘·NVIDIA 패키징 예정."},"segments_en":{"parts":[{"desc":"Flip-chip, wafer-level, SiP","name":"Advanced packaging"},{"desc":"Leadframe and substrate","name":"Mainstream packaging"},{"desc":"Final test","name":"Test"}],"total":"FY2025 revenue $6.7B","concentration":"Largest customer Apple (10+ years). $7B Arizona campus to package Apple silicon and Nvidia."},"edges":[{"direction":"revenue","counterparty":"팹리스·IDM 고객 (NVIDIA 등)","counterparty_slug":null,"confidence":"high","metric":{"type":"revenue","unit":"USD","basis":"연간 총매출","value":6700000000,"period":"FY2025","basis_en":"annual total revenue"},"note":"NVIDIA 등 팹리스·IDM의 칩을 패키징·테스트(애리조나 캠퍼스 포함).","note_en":"Packages and tests chips for fabless and IDM customers such as Nvidia (incl. the Arizona campus).","sources":[{"stance":"confirms","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-02-20","url":"https://www.sec.gov/Archives/edgar/data/0001047127/000104712726000014/amkr-20251231.htm","title":"Amkor Technology FY2025 Form 10-K","title_en":"Amkor Technology FY2025 Form 10-K","excerpt":"FY2025 매출 $6.7B.","excerpt_en":"FY2025 revenue $6.7B."},{"stance":"mentions","publisher":"앰코테크놀로지 IR","publisher_en":"Amkor Technology IR","kind":"ir","lang":"en","published_at":null,"url":"https://ir.amkor.com/news-releases/news-release-details/amkor-technology-breaks-ground-new-semiconductor-advanced","title":"앰코, 애리조나 $7B 패키징 캠퍼스 착공 (애플 최대고객)","title_en":"Amkor breaks ground on $7B Arizona packaging campus (Apple largest customer)","excerpt":"애리조나 캠퍼스가 애플·NVIDIA를 지원.","excerpt_en":"Arizona campus to support Apple and Nvidia."}]},{"direction":"revenue","counterparty":"Apple","counterparty_slug":"apple","confidence":"high","metric":{"type":"qualifier","basis":"최대 고객(애플)","value":null,"period":"2025","basis_en":"largest customer (Apple)","qualifier":"sole_source"},"note":"앰코의 최대 고객. 10년 넘게 애플 칩을 패키징했고, 애리조나 캠퍼스에서 TSMC 생산 애플 실리콘을 패키징 예정.","note_en":"Amkor’s largest customer: has packaged Apple chips for 10+ years and will package TSMC-made Apple silicon at its Arizona campus.","sources":[{"stance":"confirms","publisher":"전자신문","publisher_en":"Electronic Times","kind":"news","lang":"ko","published_at":"2025-11-19","url":"https://www.etnews.com/20251119000390","title":"앰코코리아, 송도에 2700억 투자…AI 반도체 패키징","title_en":"Amkor Korea invests ₩270B in Songdo for AI chip packaging","excerpt":"앰코 송도 K5가 애플 칩 후공정 담당, AI 패키징 투자 확대.","excerpt_en":"Amkor’s Songdo K5 handles Apple chip back-end; expanding AI packaging investment."},{"stance":"confirms","publisher":"디지타임스","publisher_en":"DigiTimes","kind":"news","lang":"en","published_at":"2023-12-01","url":"https://www.digitimes.com/news/a20231201VL201/amkor-advanced-packaging-us-apple.html","title":"앰코 미국 첨단 패키징, 애플이 첫 고객","title_en":"Amkor US advanced packaging, Apple to be first customer","excerpt":"애플이 앰코 미국 첨단 패키징의 첫 고객.","excerpt_en":"Apple to be the first customer of Amkor’s US advanced packaging."},{"stance":"confirms","publisher":"앰코테크놀로지 IR","publisher_en":"Amkor Technology IR","kind":"ir","lang":"en","published_at":null,"url":"https://ir.amkor.com/news-releases/news-release-details/amkor-technology-breaks-ground-new-semiconductor-advanced","title":"앰코, 애리조나 $7B 패키징 캠퍼스 착공 (애플 최대고객)","title_en":"Amkor breaks ground on $7B Arizona packaging campus (Apple largest customer)","excerpt":"애플이 앰코의 첫·최대 고객.","excerpt_en":"Apple is Amkor’s first and largest customer."}]},{"direction":"cost","counterparty":"ASMPT","counterparty_slug":"asmpt","confidence":"mid","metric":null,"note":"다이·와이어 본더 등 후공정 패키징 장비를 ASMPT에서 매입.","note_en":"Buys die/wire bonders and back-end packaging tools from ASMPT.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-02-20","url":"https://www.sec.gov/Archives/edgar/data/0001047127/000104712726000014/amkr-20251231.htm","title":"Amkor Technology FY2025 Form 10-K","title_en":"Amkor Technology FY2025 Form 10-K","excerpt":"10-K: 후공정 장비·기판을 주요 공급사에서 매입.","excerpt_en":"10-K: buys back-end equipment and substrates from key suppliers."}]},{"direction":"cost","counterparty":"BESI","counterparty_slug":"besi","confidence":"mid","metric":null,"note":"다이 어태치·하이브리드 본딩 장비를 BESI에서 매입.","note_en":"Buys die-attach and hybrid-bonding tools from BESI.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-02-20","url":"https://www.sec.gov/Archives/edgar/data/0001047127/000104712726000014/amkr-20251231.htm","title":"Amkor Technology FY2025 Form 10-K","title_en":"Amkor Technology FY2025 Form 10-K","excerpt":"10-K: 후공정 장비·기판을 주요 공급사에서 매입.","excerpt_en":"10-K: buys back-end equipment and substrates from key suppliers."}]},{"direction":"cost","counterparty":"삼성전기","counterparty_slug":"samsung-electro-mechanics","confidence":"mid","metric":null,"note":"패키지 기판(FC-BGA 등)을 삼성전기 등에서 매입.","note_en":"Buys package substrates (FC-BGA, etc.) from suppliers such as Samsung Electro-Mechanics.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-02-20","url":"https://www.sec.gov/Archives/edgar/data/0001047127/000104712726000014/amkr-20251231.htm","title":"Amkor Technology FY2025 Form 10-K","title_en":"Amkor Technology FY2025 Form 10-K","excerpt":"10-K: 후공정 장비·기판을 주요 공급사에서 매입.","excerpt_en":"10-K: buys back-end equipment and substrates from key suppliers."}]},{"direction":"cost","counterparty":"리드프레임·소재 (비공개)","counterparty_slug":null,"confidence":"low","metric":{"type":"qualifier","value":null,"qualifier":"confirmed_no_disclosed_value"},"note":"리드프레임·본딩와이어·몰딩 소재 매입(공급사 비공개).","note_en":"Buys leadframes, bonding wire and molding materials (suppliers undisclosed).","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-02-20","url":"https://www.sec.gov/Archives/edgar/data/0001047127/000104712726000014/amkr-20251231.htm","title":"Amkor Technology FY2025 Form 10-K","title_en":"Amkor Technology FY2025 Form 10-K","excerpt":"10-K: 패키징 소재 공급망 의존.","excerpt_en":"10-K: depends on packaging-materials supply."}]}]}