{"slug":"asmpt","name":"ASMPT","name_en":"ASMPT","ticker":"0522.HK","updated_at":"2026-06-21T07:38:08.064606+00:00","canonical":"https://valuechain.wiki/asmpt","kicker":"후공정 패키징·본딩 장비","kicker_en":"Back-end packaging and bonding equipment","lead":"홍콩 상장 글로벌 후공정 장비사. SK하이닉스 HBM4 TC본더를 신규 수주하며 한미와 물량 분할.","lead_en":"Hong Kong-listed global back-end equipment maker. Newly won SK hynix HBM4 TC bonder orders, splitting volume with Hanmi.","segments":{"note":"홍콩 상장 0522. 후공정 패키징·본딩 장비 글로벌사.","parts":[{"desc":"TC본더, 다이본더","name":"TCB/패키징"}]},"segments_en":{"parts":[{"desc":"TC bonder, die bonder","name":"TCB/Packaging"}]},"edges":[{"direction":"revenue","counterparty":"SK하이닉스","counterparty_slug":"sk-hynix","confidence":"high","metric":{"type":"supply_share","unit":"pct","basis":"SK HBM4 TC본더 발주","value":50,"period":"HBM4 2026","basis_en":"SK HBM4 TC bonder orders","qualifier":"approx"},"note":"HBM4 TC본더 발주. 현 발주 물량 약 절반.","note_en":"HBM4 TC bonder orders. About half of current order volume.","sources":[{"stance":"confirms","publisher":"TrendForce","publisher_en":null,"kind":"news","lang":"en","published_at":"2025-12-12","url":"https://www.trendforce.com/news/2025/12/12/news-sk-hynix-reportedly-places-hbm4-tc-bonder-order-with-asmpt-as-hanmi-hanwha-patent-clash-heats-up/","title":"SK hynix places HBM4 TC bonder order with ASMPT","title_en":null,"excerpt":"TrendForce: SK하이닉스 HBM4 TC본더 ASMPT 발주, 한미와 분할.","excerpt_en":"TrendForce: SK hynix ordered HBM4 TC bonders from ASMPT, split with Hanmi."},{"stance":"confirms","publisher":"디일렉","publisher_en":"The Elec","kind":"news","lang":"ko","published_at":"2025-09-10","url":"https://www.thelec.kr/news/articleView.html?idxno=45188","title":"SK하이닉스, ASMPT에 HBM4용 TC본더 신규 발주","title_en":"SK hynix places new HBM4 TC bonder order with ASMPT","excerpt":"SK하이닉스가 ASMPT에 HBM4용 TC본더 7대(약 3000억원) 신규 발주.","excerpt_en":"SK hynix placed a new order with ASMPT for 7 HBM4 TC bonders (about ₩300B)."},{"stance":"confirms","publisher":"ASMPT / HKEX","publisher_en":"ASMPT / HKEX","kind":"filing","lang":"en","published_at":"2025-02-28","url":"https://www.asmpt.com/site/assets/files/76526/e0522_results_announcement_2024_q4.pdf","title":"ASMPT 2024 연간 감사 실적공고 (HKEX 0522)","title_en":"ASMPT 2024 audited annual results announcement (HKEX 0522)","excerpt":"2024 실적: TCB(열압착본더) 사상 최대 매출·수주, HBM 진입(4분기 대량수주). AP 매출 +23% ~$505M.","excerpt_en":"2024 results: record TCB revenue and bookings, HBM breakthrough (Q4 bulk order); AP revenue +23% to ~$505M."}]},{"direction":"revenue","counterparty":"삼성전자","counterparty_slug":"samsung-electronics","confidence":"mid","metric":null,"note":"삼성전자 HBM 라인에 TC본더 공급.","note_en":"Supplies TC bonders for Samsung's HBM lines.","sources":[]},{"direction":"revenue","counterparty":"앰코테크놀로지","counterparty_slug":"amkor","confidence":"mid","metric":null,"note":"앰코 등 OSAT에 후공정 패키징 장비 공급.","note_en":"Supplies back-end packaging tools to OSATs such as Amkor.","sources":[{"stance":"mentions","publisher":"앰코테크놀로지 IR","publisher_en":"Amkor Technology IR","kind":"ir","lang":"en","published_at":null,"url":"https://ir.amkor.com/news-releases/news-release-details/amkor-technology-breaks-ground-new-semiconductor-advanced","title":"앰코, 애리조나 $7B 패키징 캠퍼스 착공 (애플 최대고객)","title_en":"Amkor breaks ground on $7B Arizona packaging campus (Apple largest customer)","excerpt":"앰코가 후공정 장비·기판을 매입하는 고객.","excerpt_en":"Amkor is a customer buying back-end equipment and substrates."}]},{"direction":"revenue","counterparty":"ASE테크놀로지","counterparty_slug":"ase","confidence":"mid","metric":null,"note":"ASE 등 OSAT에 후공정 패키징 장비 공급.","note_en":"Supplies back-end packaging tools to OSATs such as ASE.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-04-01","url":"https://www.sec.gov/Archives/edgar/data/0001122411/000119312526135585/d50802d20f.htm","title":"ASE Technology FY2025 Form 20-F","title_en":"ASE Technology FY2025 Form 20-F","excerpt":"ASE가 후공정 장비를 매입하는 고객.","excerpt_en":"ASE is a customer buying back-end equipment."}]},{"direction":"cost","counterparty":"정밀 모션·광학·정렬 모듈 (비공개)","counterparty_slug":null,"confidence":"low","metric":{"type":"qualifier","value":null,"qualifier":"confirmed_no_disclosed_value"},"note":"본더용 정밀 모션·광학·정렬 모듈 매입(비공개).","note_en":"Buys precision motion, optics and alignment modules for bonders (undisclosed).","sources":[{"stance":"mentions","publisher":"ASMPT / HKEX","publisher_en":"ASMPT / HKEX","kind":"filing","lang":"en","published_at":"2025-02-28","url":"https://www.asmpt.com/site/assets/files/76526/e0522_results_announcement_2024_q4.pdf","title":"ASMPT 2024 연간 감사 실적공고 (HKEX 0522)","title_en":"ASMPT 2024 audited annual results announcement (HKEX 0522)","excerpt":"실적공고: 부품·모듈 원가.","excerpt_en":"Results: component and module costs."}]},{"direction":"cost","counterparty":"본더 서브시스템·제어 (비공개)","counterparty_slug":null,"confidence":"low","metric":{"type":"qualifier","value":null,"qualifier":"confirmed_no_disclosed_value"},"note":"열압착 헤드·제어 서브시스템 외주(비공개).","note_en":"Outsources thermocompression heads and control subsystems (undisclosed).","sources":[{"stance":"mentions","publisher":"ASMPT / HKEX","publisher_en":"ASMPT / HKEX","kind":"filing","lang":"en","published_at":"2025-02-28","url":"https://www.asmpt.com/site/assets/files/76526/e0522_results_announcement_2024_q4.pdf","title":"ASMPT 2024 연간 감사 실적공고 (HKEX 0522)","title_en":"ASMPT 2024 audited annual results announcement (HKEX 0522)","excerpt":"실적공고: 외주 서브시스템.","excerpt_en":"Results: outsourced subsystems."}]}]}