Semiconductor equipment · HBM4 TC bonder

Hanwha Semitech

Hanwha Group's semiconductor-equipment affiliate (private). New entrant in HBM4 TC bonders, in a patent dispute with Hanmi Semiconductor.

Hanwha Semitech

▸ Money out정밀 모션·정렬 광학 모듈 (비공개)○본딩 헤드·열압착 부품 (비공개)○

Financials & Segments

SK hynix High confidence· Units 14 · 2025 · HBM TC bonders supplied to SK
Supplied 14 HBM TC bonders to SK hynix (first entry). Second-gen hybrid bonder SHB2 Nano due to SK hynix in 1H 2026.
Confirms KO The Elec Published Mar 20, 2026: "Hanwha Semitech is close to supplying its second-gen SHB2 Nano hybrid bonder to SK hynix in 1H 2026."
Mentions EN TrendForce Published Dec 12, 2025: "TrendForce: Hanwha Semitech entered HBM4 TC bonders, in a patent dispute with Hanmi."
Confirms KO The Elec Published Apr 15, 2025: "Hanwha Semitech supplied 14 HBM TC bonders to SK hynix, ending Hanmi's monopoly."
Samsung Electronics Medium confidence
Supplies HBM TC bonders to Samsung.

정밀 모션·정렬 광학 모듈 (비공개) Low confidence
Buys precision motion stages and alignment optics for TC bonders (undisclosed).
Mentions KO The Elec Published Mar 20, 2026: "Depends on key bonder components."
본딩 헤드·열압착 부품 (비공개) Low confidence
Outsources bonding heads and thermocompression heating/pressing parts (undisclosed).
Mentions KO The Elec Published Mar 20, 2026: "Outsources thermocompression parts."

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