{"slug":"besi","name":"BESI","name_en":"BESI","ticker":"BESI.AS","updated_at":"2026-06-20T16:08:53.052946+00:00","canonical":"https://valuechain.wiki/besi","kicker":"본딩 장비 · 하이브리드 본딩","kicker_en":"Bonding equipment · Hybrid bonding","lead":"네덜란드 상장 본딩 장비사. 차세대 HBM용 하이브리드 본딩 선도, HBM4+ 적용 확대 국면.","lead_en":"Netherlands-listed bonding-equipment maker. Leader in hybrid bonding for next-gen HBM, with HBM4+ adoption expanding.","segments":{"note":"Euronext 상장. 하이브리드 본딩 선도.","parts":[{"desc":"차세대 HBM 본딩","name":"하이브리드 본딩"}]},"segments_en":{"parts":[{"desc":"Next-gen HBM bonding","name":"Hybrid bonding"}]},"edges":[{"direction":"revenue","counterparty":"TSMC","counterparty_slug":"tsmc","confidence":"mid","metric":{"type":"revenue","unit":"USD","basis":"BESI 장기 매출목표 €1.5~1.9B","value":2000000000,"period":"장기목표","basis_en":"BESI long-term revenue target €1.5-1.9B","qualifier":"band"},"note":"TSMC에 하이브리드 본딩·다이 어태치 장비 공급(첨단 패키징).","note_en":"Supplies hybrid-bonding and die-attach tools to TSMC (advanced packaging).","sources":[{"stance":"confirms","publisher":"BESI 투자자관계","publisher_en":"BESI Investor Relations","kind":"filing","lang":"en","published_at":"2026-02-19","url":"https://www.besi.com/news-investors/reports-presentations/","title":"BESI 연차보고서·실적 (Euronext)","title_en":"BESI annual reports and results (Euronext)","excerpt":"BESI 장기 매출 목표 €1.5~1.9B, 신규 AI 고객 기대.","excerpt_en":"BESI long-term revenue target €1.5-1.9B, expecting new AI customers."},{"stance":"confirms","publisher":"Yole Group","publisher_en":"Yole Group","kind":"analysis","lang":"en","published_at":"2025-08-01","url":"https://www.yolegroup.com/press-release/advanced-packaging-fuels-transformation-in-back-end-equipment-tcb-and-hybrid-bonding-to-lead-1-3-billion-market-expansion-by-2030/","title":"첨단 패키징 장비, TCB·하이브리드 본딩 주도","title_en":"Advanced packaging back-end equipment: TCB and hybrid bonding lead","excerpt":"BESI가 TSMC 등에 하이브리드 본딩 장비 공급.","excerpt_en":"BESI supplies hybrid-bonding tools to TSMC and others."}]},{"direction":"revenue","counterparty":"SK하이닉스","counterparty_slug":"sk-hynix","confidence":"mid","metric":{"type":"supply_status","basis":"하이브리드 본딩(차세대)","period":"HBM4+","basis_en":"Hybrid bonding (next-gen)","qualifier":"emerging"},"note":"차세대 하이브리드 본딩(HBM4+).","note_en":"Next-gen hybrid bonding (HBM4+).","sources":[{"stance":"mentions","publisher":"TrendForce","publisher_en":null,"kind":"news","lang":"en","published_at":"2025-12-12","url":"https://www.trendforce.com/news/2025/12/12/news-sk-hynix-reportedly-places-hbm4-tc-bonder-order-with-asmpt-as-hanmi-hanwha-patent-clash-heats-up/","title":"SK hynix places HBM4 TC bonder order with ASMPT","title_en":null,"excerpt":"TrendForce: BESI 하이브리드 본딩 점유 확대 중.","excerpt_en":"TrendForce: BESI is expanding its hybrid-bonding share."},{"stance":"confirms","publisher":"ZDNet Korea","publisher_en":"ZDNet Korea","kind":"news","lang":"ko","published_at":"2025-07-25","url":"https://zdnet.co.kr/view/?no=20250725094205","title":"차세대 HBM용 하이브리드 본더 시장 커진다","title_en":"Market for next-gen HBM hybrid bonders is growing","excerpt":"차세대 HBM(HBM4+)용 하이브리드 본딩 시장 확대, BESI가 선도.","excerpt_en":"The hybrid-bonding market for next-gen HBM (HBM4+) is expanding, with BESI in the lead."}]},{"direction":"revenue","counterparty":"삼성전자","counterparty_slug":"samsung-electronics","confidence":"mid","metric":null,"note":"삼성전자가 BESI 하이브리드 본딩 적용 여부 평가 중.","note_en":"Samsung is evaluating whether to adopt BESI's hybrid bonding.","sources":[{"stance":"confirms","publisher":"디일렉","publisher_en":"The Elec","kind":"news","lang":"ko","published_at":"2026-04-10","url":"https://www.thelec.kr/news/articleView.html?idxno=56024","title":"네덜란드 베시, 삼성전자 하이브리드 본딩 적용 여부 조만간 나온다","title_en":"Netherlands' BESI: Samsung hybrid-bonding adoption decision coming soon","excerpt":"네덜란드 베시의 삼성전자 하이브리드 본딩 적용 여부가 곧 결정.","excerpt_en":"A decision on Samsung adopting Netherlands-based BESI's hybrid bonding is expected soon."}]},{"direction":"revenue","counterparty":"Intel","counterparty_slug":"intel","confidence":"mid","metric":null,"note":"인텔에 하이브리드 본딩·다이 어태치 장비 공급.","note_en":"Supplies hybrid-bonding and die-attach tools to Intel.","sources":[{"stance":"confirms","publisher":"Yole Group","publisher_en":"Yole Group","kind":"analysis","lang":"en","published_at":"2025-08-01","url":"https://www.yolegroup.com/press-release/advanced-packaging-fuels-transformation-in-back-end-equipment-tcb-and-hybrid-bonding-to-lead-1-3-billion-market-expansion-by-2030/","title":"첨단 패키징 장비, TCB·하이브리드 본딩 주도","title_en":"Advanced packaging back-end equipment: TCB and hybrid bonding lead","excerpt":"BESI 고객에 인텔 포함(하이브리드 본딩).","excerpt_en":"BESI customers include Intel (hybrid bonding)."}]},{"direction":"revenue","counterparty":"ASE테크놀로지","counterparty_slug":"ase","confidence":"mid","metric":null,"note":"ASE 등 OSAT에 다이 어태치·하이브리드 본딩 장비 공급.","note_en":"Supplies die-attach and hybrid-bonding tools to OSATs such as ASE.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-04-01","url":"https://www.sec.gov/Archives/edgar/data/0001122411/000119312526135585/d50802d20f.htm","title":"ASE Technology FY2025 Form 20-F","title_en":"ASE Technology FY2025 Form 20-F","excerpt":"ASE가 첨단 패키징 장비를 매입.","excerpt_en":"ASE buys advanced-packaging tools."}]},{"direction":"revenue","counterparty":"앰코테크놀로지","counterparty_slug":"amkor","confidence":"mid","metric":null,"note":"앰코 등 OSAT에 다이 어태치·하이브리드 본딩 장비 공급.","note_en":"Supplies die-attach and hybrid-bonding tools to OSATs such as Amkor.","sources":[{"stance":"confirms","publisher":"BESI 투자자관계","publisher_en":"BESI Investor Relations","kind":"filing","lang":"en","published_at":"2026-02-19","url":"https://www.besi.com/news-investors/reports-presentations/","title":"BESI 연차보고서·실적 (Euronext)","title_en":"BESI annual reports and results (Euronext)","excerpt":"BESI 연차보고서: OSAT(앰코·ASE)·파운드리에 장비 공급.","excerpt_en":"BESI annual report: supplies tools to OSATs (Amkor, ASE) and foundries."},{"stance":"mentions","publisher":"앰코테크놀로지 IR","publisher_en":"Amkor Technology IR","kind":"ir","lang":"en","published_at":null,"url":"https://ir.amkor.com/news-releases/news-release-details/amkor-technology-breaks-ground-new-semiconductor-advanced","title":"앰코, 애리조나 $7B 패키징 캠퍼스 착공 (애플 최대고객)","title_en":"Amkor breaks ground on $7B Arizona packaging campus (Apple largest customer)","excerpt":"앰코가 후공정 장비·기판을 매입하는 고객.","excerpt_en":"Amkor is a customer buying back-end equipment and substrates."}]},{"direction":"cost","counterparty":"정밀 부품·광학 (비공개)","counterparty_slug":null,"confidence":"low","metric":{"type":"qualifier","value":null,"qualifier":"confirmed_no_disclosed_value"},"note":"초정밀 모션·광학 부품 외주(공급사 비공개).","note_en":"Outsources ultra-precision motion and optics parts (suppliers undisclosed).","sources":[{"stance":"mentions","publisher":"BESI 투자자관계","publisher_en":"BESI Investor Relations","kind":"filing","lang":"en","published_at":"2026-02-19","url":"https://www.besi.com/news-investors/reports-presentations/","title":"BESI 연차보고서·실적 (Euronext)","title_en":"BESI annual reports and results (Euronext)","excerpt":"연차보고서: 정밀 부품 공급망 의존.","excerpt_en":"Annual report: depends on precision-parts supply."}]},{"direction":"cost","counterparty":"계측·모션 모듈 (비공개)","counterparty_slug":null,"confidence":"low","metric":{"type":"qualifier","value":null,"qualifier":"confirmed_no_disclosed_value"},"note":"계측·모션 제어 모듈 매입(비공개).","note_en":"Buys metrology and motion-control modules (undisclosed).","sources":[{"stance":"mentions","publisher":"BESI 투자자관계","publisher_en":"BESI Investor Relations","kind":"filing","lang":"en","published_at":"2026-02-19","url":"https://www.besi.com/news-investors/reports-presentations/","title":"BESI 연차보고서·실적 (Euronext)","title_en":"BESI annual reports and results (Euronext)","excerpt":"연차보고서: 부품·모듈 조달.","excerpt_en":"Annual report: sources parts and modules."}]}]}