{"slug":"samsung-electronics","name":"삼성전자","name_en":"Samsung Electronics","ticker":"005930.KS","updated_at":"2026-06-21T08:52:26.555809+00:00","canonical":"https://valuechain.wiki/samsung-electronics","kicker":"반도체 · 메모리 · 파운드리","kicker_en":"Semiconductors · Memory · Foundry","lead":"메모리·파운드리·세트를 아우르는 종합 반도체 기업. AI 사이클에서는 HBM을 AMD·NVIDIA에 공급하고, 파운드리로 Tesla·Apple·Qualcomm의 칩을 위탁생산한다.","lead_en":"A diversified semiconductor company spanning memory, foundry, and finished products. In the AI cycle it supplies HBM to AMD and NVIDIA and builds chips for Tesla, Apple, and Qualcomm through its foundry.","segments":{"fy":2025,"parts":[{"desc":"메모리(DRAM·NAND·HBM)·파운드리·시스템LSI (HBM/파운드리 엣지의 출처 부문)","name":"DS(반도체)"},{"desc":"모바일(MX)·영상가전·생활가전","name":"DX"},{"desc":"디스플레이(삼성디스플레이)","name":"SDC"},{"desc":"전장·오디오","name":"Harman"}],"total":"333.6조원 (FY2025 연결)","source":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20260310002820","total_krw":333605938000000,"fin_source":"OpenDART fnlttSinglAcntAll 2025 CFS","op_profit_krw":43601051000000,"net_income_krw":45206805000000},"segments_en":{"parts":[{"desc":"Memory (DRAM, NAND, HBM), foundry, System LSI (the segment behind the HBM/foundry edges)","name":"DS (Semiconductors)"},{"desc":"Mobile (MX), visual display, home appliances","name":"DX"},{"desc":"Displays (Samsung Display)","name":"SDC"},{"desc":"Automotive electronics and audio","name":"Harman"}],"total":"₩333.6T (FY2025 consolidated)"},"edges":[{"direction":"revenue","counterparty":"Tesla","counterparty_slug":null,"confidence":"high","metric":{"type":"contract_value","unit":"USD","as_of":"2025-11-13","value":16000000000,"period":"multi_year","qualifier":"exact"},"note":"파운드리(Taylor팹 AI칩).","note_en":"Foundry (Taylor fab AI chip).","sources":[{"stance":"mentions","publisher":"DART 전자공시 (금융감독원)","publisher_en":"DART (FSS Electronic Disclosure)","kind":"filing","lang":"ko","published_at":"2026-03-10","url":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20260310002820","title":"삼성전자 사업보고서 (2025.12)","title_en":"Samsung Electronics business report (2025.12)","excerpt":"삼성전자 사업보고서: 해당 매출은 DS(반도체)/파운드리 부문에서 발생. FY2025 연결 매출 333.6조, 영업이익 43.6조. 사업보고서는 개별 고객명을 공개하지 않음(부문 단위).","excerpt_en":"Samsung business report: this revenue arises in the DS (semiconductor)/foundry segment. FY2025 consolidated revenue ₩333.6T, operating profit ₩43.6T. The filing does not disclose individual customer names (segment level)."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":null,"kind":"filing","lang":"en","published_at":"2026-01-29","url":"https://www.sec.gov/Archives/edgar/data/1318605/000162828026003952/tsla-20251231.htm","title":"Tesla Form 10-K (2026-01-29)","title_en":null,"excerpt":"Tesla 10-K: \"a new collaboration with Samsung to manufacture advanced semiconductors for AI inference and training in the U.S.\" 삼성→Tesla 파운드리($16B)를 매입자(Tesla) 측 1차 공시로 확인.","excerpt_en":"Tesla 10-K: \"a new collaboration with Samsung to manufacture advanced semiconductors for AI inference and training in the U.S.\" Buyer-side (Tesla) primary filing confirming Samsung to Tesla foundry ($16B)."},{"stance":"confirms","publisher":"TrendForce","publisher_en":null,"kind":"news","lang":"en","published_at":"2025-11-13","url":"https://www.trendforce.com/news/2025/11/13/news-samsung-reportedly-eyes-foundry-profitability-by-2027-with-20-market-share/","title":"Samsung eyes foundry profitability by 2027","title_en":null,"excerpt":"삼성-Tesla, Taylor팹 AI칩 위탁생산 $16B 계약.","excerpt_en":"Samsung and Tesla signed a $16B contract to make AI chips at the Taylor fab."}]},{"direction":"cost","counterparty":"삼성전기","counterparty_slug":"samsung-electro-mechanics","confidence":"high","metric":null,"note":"삼성전자에 MLCC·반도체 기판(FC-BGA)·카메라모듈 공급(계열). 삼성전자는 삼성전기의 최대 고객(매출 비중 ~29%, AI·전장으로 다변화 중).","note_en":"Buys MLCCs, IC substrates (FC-BGA) and camera modules from affiliate Samsung Electro-Mechanics — its largest customer (~29% of its revenue, diversifying into AI/auto).","sources":[{"stance":"confirms","publisher":"CEO스코어데일리","publisher_en":"CEO Score Daily","kind":"news","lang":"ko","published_at":"2026-03-11","url":"https://m.ceoscoredaily.com/page/view/2026031117140460520","title":"삼성전기, 삼성전자 매출 의존도 역대 최저…AI·전장으로 거래선 확장","title_en":"Samsung Electro-Mechanics cuts reliance on Samsung Electronics, expands to AI/auto","excerpt":"삼성전기 매출 중 삼성전자 비중 ~29%(2021), 의존도 낮추는 중.","excerpt_en":"Samsung is ~29% (2021) of Samsung Electro-Mechanics revenue, declining."},{"stance":"mentions","publisher":"Blackridge Research","publisher_en":null,"kind":"research","lang":"en","published_at":null,"url":"https://www.blackridgeresearch.com/blog/list-of-largest-biggest-semiconductor-chip-companies-manufacturers-makers-suppliers-south-korea","title":"Top semiconductor companies in South Korea","title_en":null,"excerpt":"삼성전기 등 부품 계열사.","excerpt_en":"Component affiliates such as Samsung Electro-Mechanics."}]},{"direction":"revenue","counterparty":"NVIDIA","counterparty_slug":"nvidia","confidence":"high","metric":{"type":"supply_relationship","unit":null,"basis":"HBM3E 공급(NVIDIA 10-K 매입 확인)","period":"2025-2026","basis_en":"HBM3E supply (confirmed in NVIDIA 10-K)","qualifier":"confirmed_no_disclosed_value"},"note":"HBM3E를 2025 3분기부터 공급 개시.","note_en":"Began supplying HBM3E from Q3 2025.","sources":[{"stance":"mentions","publisher":"DART 전자공시 (금융감독원)","publisher_en":"DART (FSS Electronic Disclosure)","kind":"filing","lang":"ko","published_at":"2026-03-10","url":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20260310002820","title":"삼성전자 사업보고서 (2025.12)","title_en":"Samsung Electronics business report (2025.12)","excerpt":"삼성전자 사업보고서: 해당 매출은 DS(반도체)/파운드리 부문에서 발생. FY2025 연결 매출 333.6조, 영업이익 43.6조. 사업보고서는 개별 고객명을 공개하지 않음(부문 단위).","excerpt_en":"Samsung business report: this revenue arises in the DS (semiconductor)/foundry segment. FY2025 consolidated revenue ₩333.6T, operating profit ₩43.6T. The filing does not disclose individual customer names (segment level)."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":null,"kind":"filing","lang":"en","published_at":"2026-02-26","url":"https://www.sec.gov/Archives/edgar/data/1045810/000104581026000021/nvda-20260125.htm","title":"NVIDIA Form 10-K (FY2026, 2026-01-25)","title_en":null,"excerpt":"NVIDIA 10-K(FY2026): \"We purchase memory from ... Samsung\" 및 \"We utilize foundries, such as TSMC and Samsung, to produce our semiconductor wafers.\" — NVIDIA의 삼성 메모리 매입 + 삼성 파운드리 이용 확인.","excerpt_en":"NVIDIA 10-K (FY2026): \"We purchase memory from ... Samsung\" and \"We utilize foundries, such as TSMC and Samsung, to produce our semiconductor wafers.\" Confirms NVIDIA's Samsung memory purchases and foundry use."},{"stance":"confirms","publisher":"KED Global","publisher_en":null,"kind":"news","lang":"en","published_at":"2025-10-30","url":"https://www.kedglobal.com/earnings/newsView/ked202510300005","title":"Samsung sells out 2026 HBM after Nvidia shipments","title_en":null,"excerpt":"삼성이 3분기 NVIDIA향 HBM 출하 시작 후 2026 물량 완판.","excerpt_en":"After starting HBM shipments to NVIDIA in Q3, Samsung sold out its 2026 volume."}]},{"direction":"revenue","counterparty":"AMD","counterparty_slug":"amd","confidence":"high","metric":{"type":"supply_relationship","basis":"파운드리(AMD 10-K: utilize Samsung) + HBM","period":"2025-2026","basis_en":"Foundry (AMD 10-K: utilize Samsung) + HBM","qualifier":"confirmed_no_disclosed_value"},"note":"HBM3E 12단(MI350 가속기) 공급, HBM4 우위 평가.","note_en":"Supplies 12-high HBM3E (MI350 accelerator); seen as ahead on HBM4.","sources":[{"stance":"mentions","publisher":"DART 전자공시 (금융감독원)","publisher_en":"DART (FSS Electronic Disclosure)","kind":"filing","lang":"ko","published_at":"2026-03-10","url":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20260310002820","title":"삼성전자 사업보고서 (2025.12)","title_en":"Samsung Electronics business report (2025.12)","excerpt":"삼성전자 사업보고서: 해당 매출은 DS(반도체)/파운드리 부문에서 발생. FY2025 연결 매출 333.6조, 영업이익 43.6조. 사업보고서는 개별 고객명을 공개하지 않음(부문 단위).","excerpt_en":"Samsung business report: this revenue arises in the DS (semiconductor)/foundry segment. FY2025 consolidated revenue ₩333.6T, operating profit ₩43.6T. The filing does not disclose individual customer names (segment level)."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-02-04","url":"https://www.sec.gov/Archives/edgar/data/2488/000000248826000018/amd-20251227.htm","title":"AMD Form 10-K (FY2025, 2025-12-27)","title_en":"AMD Form 10-K (FY2025, 2025-12-27)","excerpt":"AMD 10-K: \"we utilize TSMC, UMC and Samsung Electronics\" (파운드리). 삼성→AMD 공급을 매입자(AMD) 측 1차 공시로 확인.","excerpt_en":"AMD 10-K: \"we utilize TSMC, UMC and Samsung Electronics\" (foundry). Buyer-side (AMD) primary filing confirming Samsung to AMD supply."},{"stance":"mentions","publisher":"KED Global","publisher_en":null,"kind":"news","lang":"en","published_at":"2025-10-30","url":"https://www.kedglobal.com/earnings/newsView/ked202510300005","title":"Samsung sells out 2026 HBM after Nvidia shipments","title_en":null,"excerpt":"삼성이 AMD와 HBM 파트너십 구축.","excerpt_en":"Samsung built an HBM partnership with AMD."}]},{"direction":"cost","counterparty":"동진쎄미켐","counterparty_slug":"dongjin-semichem","confidence":"high","metric":null,"note":"동진쎄미켐에서 포토레지스트(EUV 포함)·반도체 소재 매입. 동진 매출의 ~59%(2025 3Q)가 삼성으로, 일본 의존도 축소의 핵심 국산 대안.","note_en":"Buys photoresist (incl. EUV) and process chemicals from Dongjin Semichem; Samsung is ~59% (Q3 2025) of Dongjin revenue — a key domestic alternative reducing reliance on Japan.","sources":[{"stance":"confirms","publisher":"한국경제TV","publisher_en":"Korea Economic TV","kind":"news","lang":"ko","published_at":"2025-12-02","url":"https://www.wowtv.co.kr/NewsCenter/News/Read?articleId=A202512020405","title":"동진쎄미켐, 삼성전자 매출 비중 59% (포토레지스트 양산 대안)","title_en":"Dongjin Semichem: Samsung is 59% of revenue (photoresist)","excerpt":"동진 매출 중 삼성 비중 59%(2025 3Q), 작년 5,528억원(37.9%).","excerpt_en":"Samsung is 59% of Dongjin revenue (Q3 2025); KRW 552.8bn (37.9%) last year."},{"stance":"mentions","publisher":"Blackridge Research","publisher_en":null,"kind":"research","lang":"en","published_at":null,"url":"https://www.blackridgeresearch.com/blog/list-of-largest-biggest-semiconductor-chip-companies-manufacturers-makers-suppliers-south-korea","title":"Top semiconductor companies in South Korea","title_en":null,"excerpt":"동진쎄미켐 등 한국 소재/패키징 공급사.","excerpt_en":"Korean materials and packaging suppliers such as Dongjin Semichem."}]},{"direction":"cost","counterparty":"ASML","counterparty_slug":"asml","confidence":"high","metric":null,"note":"EUV 노광장비를 ASML에서 매입(최대 고객).","note_en":"Buys EUV lithography from ASML (its largest customer).","sources":[{"stance":"confirms","publisher":"Seoul Economic Daily","publisher_en":"Seoul Economic Daily","kind":"news","lang":"en","published_at":"2026-04-17","url":"https://en.sedaily.com/finance/2026/04/17/samsung-sk-secure-two-thirds-of-asmls-annual-euv-shipments","title":"Samsung, SK Secure Two-Thirds of ASML's Annual EUV Shipments","title_en":"Samsung, SK Secure Two-Thirds of ASML's Annual EUV Shipments","excerpt":"삼성·SK가 2025 ASML EUV 출하의 2/3(약 40대, $14B 투자) 확보.","excerpt_en":"Samsung and SK secured two-thirds of ASML's 2025 EUV shipments (~40 units, $14B)."}]},{"direction":"cost","counterparty":"어플라이드 머티어리얼즈","counterparty_slug":"applied-materials","confidence":"high","metric":null,"note":"어플라이드의 전공정 장비 매입.","note_en":"Buys Applied Materials wafer-fab tools.","sources":[{"stance":"confirms","publisher":"아시아경제","publisher_en":"Asia Business Daily","kind":"news","lang":"ko","published_at":"2026-04-28","url":"https://www.asiae.co.kr/article/2026042808535291137","title":"삼성·SK가 견인…반도체 장비 시장 12% 성장","title_en":"Fueled by Samsung and SK hynix, semiconductor equipment market rises 12%","excerpt":"삼성의 메모리·파운드리 투자로 장비 매입 확대.","excerpt_en":"Samsung expands tool purchases with memory and foundry capex."}]},{"direction":"cost","counterparty":"KLA","counterparty_slug":"kla","confidence":"high","metric":null,"note":"KLA의 검사·계측 장비 매입.","note_en":"Buys KLA inspection and metrology tools.","sources":[{"stance":"confirms","publisher":"KIPOST","publisher_en":"KIPOST","kind":"news","lang":"ko","published_at":null,"url":"https://www.kipost.net/news/articleView.html?idxno=201410","title":"KLA, EUV 공정용 결함 검사 장비 발표 (인텔·삼성·SK 공급)","title_en":"KLA unveils EUV defect-inspection tools (supplies Intel, Samsung, SK)","excerpt":"KLA가 삼성에 검사장비 공급.","excerpt_en":"KLA supplies Samsung with inspection tools."}]},{"direction":"cost","counterparty":"램리서치","counterparty_slug":"lam-research","confidence":"high","metric":null,"note":"램리서치의 식각·증착 장비 매입(메모리·로직).","note_en":"Buys Lam Research etch and deposition tools (memory/logic).","sources":[{"stance":"confirms","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2025-08-11","url":"https://www.sec.gov/Archives/edgar/data/0000707549/000070754925000075/lrcx-20250629.htm","title":"Lam Research FY2025 Form 10-K","title_en":"Lam Research FY2025 Form 10-K","excerpt":"10-K가 삼성을 최대 고객급으로 명시.","excerpt_en":"10-K names Samsung among its largest customers."}]},{"direction":"cost","counterparty":"솔브레인","counterparty_slug":"soulbrain","confidence":"high","metric":null,"note":"솔브레인에서 식각액·세정액·CMP 슬러리 매입(3nm GAA 식각액 포함).","note_en":"Buys etchants, cleaners and CMP slurry from Soulbrain (incl. 3nm GAA etchant).","sources":[{"stance":"confirms","publisher":"블로터","publisher_en":"Bloter","kind":"news","lang":"ko","published_at":null,"url":"https://www.bloter.net/news/articleView.html?idxno=47292","title":"솔브레인, 삼성·SK 첨단 공정에 거는 기대감","title_en":"Soulbrain pins hopes on Samsung and SK advanced processes","excerpt":"삼성 3나노 GAA에 솔브레인 식각액 사용.","excerpt_en":"Soulbrain etchant used in Samsung 3nm GAA."}]},{"direction":"cost","counterparty":"HPSP","counterparty_slug":"hpsp","confidence":"high","metric":null,"note":"HPSP에서 고압 수소 어닐링 장비 매입(세계 유일).","note_en":"Buys high-pressure hydrogen annealing tools from HPSP (sole supplier).","sources":[{"stance":"confirms","publisher":"한국경제","publisher_en":"Korea Economic Daily","kind":"news","lang":"ko","published_at":"2025-07-13","url":"https://www.hankyung.com/article/2025071351421","title":"초미세 공정 판 바꾼 K기술…HPSP 고압수소장비 독점","title_en":"HPSP holds a monopoly in high-pressure hydrogen annealing","excerpt":"Samsung Electronics가 HPSP 고압 어닐링 장비를 채용.","excerpt_en":"Samsung Electronics adopts HPSP high-pressure annealing tools."}]},{"direction":"cost","counterparty":"원익IPS","counterparty_slug":"wonik-ips","confidence":"high","metric":null,"note":"원익IPS에서 PECVD·ALD 증착 장비 매입(최선단 파운드리 포함).","note_en":"Buys PECVD/ALD deposition tools from Wonik IPS (incl. leading-edge foundry).","sources":[{"stance":"confirms","publisher":"한국경제(다음)","publisher_en":"Hankyung (Daum)","kind":"news","lang":"ko","published_at":"2025-11-04","url":"https://v.daum.net/v/20251104143228301","title":"삼성 덕보는 원익IPS…생산능력 3배 확보","title_en":"Wonik IPS benefits from Samsung, triples capacity","excerpt":"삼성이 원익IPS 증착 장비를 대량 도입.","excerpt_en":"Samsung adopts Wonik IPS deposition tools at scale."}]},{"direction":"cost","counterparty":"후성","counterparty_slug":"foosung","confidence":"high","metric":null,"note":"후성에서 에칭용 C4F6·배선용 WF6 특수가스 매입.","note_en":"Buys C4F6 (etch) and WF6 (interconnect) specialty gases from Foosung.","sources":[{"stance":"confirms","publisher":"허프포스트코리아","publisher_en":"HuffPost Korea","kind":"news","lang":"ko","published_at":null,"url":"https://www.huffingtonpost.kr/article/239927","title":"후성, 국내 유일 C4F6·WF6 제조…삼성·SK 고객","title_en":"Foosung, Korea’s only C4F6/WF6 maker, supplies Samsung and SK","excerpt":"삼성이 후성 국산 특수가스를 채용.","excerpt_en":"Samsung uses Foosung’s domestic specialty gases."}]},{"direction":"cost","counterparty":"도쿄일렉트론","counterparty_slug":"tokyo-electron","confidence":"high","metric":null,"note":"도쿄일렉트론에서 코터·식각·증착·세정 장비 매입.","note_en":"Buys coater, etch, deposition and clean tools from Tokyo Electron.","sources":[{"stance":"confirms","publisher":"시사저널e","publisher_en":"Sisa Journal e","kind":"news","lang":"ko","published_at":null,"url":"https://www.sisajournal-e.com/news/articleView.html?idxno=406466","title":"해외 장비社 삼성·SK 공략 강화 (TEL 등 국내투자 봇물)","title_en":"Foreign toolmakers including TEL ramp investment to court Samsung and SK","excerpt":"Samsung Electronics가 TEL 전공정 장비 도입.","excerpt_en":"Samsung Electronics adopts TEL wafer-fab tools."}]},{"direction":"cost","counterparty":"신에쓰화학","counterparty_slug":"shin-etsu","confidence":"high","metric":null,"note":"Shin-Etsu Chemical에서 300mm 실리콘 웨이퍼 매입(LTA).","note_en":"Buys 300mm silicon wafers from Shin-Etsu Chemical under LTA.","sources":[{"stance":"confirms","publisher":"아이씨엔매거진","publisher_en":"ICN Magazine","kind":"news","lang":"ko","published_at":"2026-01-15","url":"https://icnweb.kr/2026/79720/","title":"HBM4 시대의 보이지 않는 병목—특수 폴리시드 웨이퍼","title_en":"HBM4’s hidden bottleneck — special polished wafers","excerpt":"Samsung Electronics 웨이퍼 수급에 Shin-Etsu Chemical 의존.","excerpt_en":"Samsung Electronics depends on Shin-Etsu Chemical for wafer supply."}]},{"direction":"cost","counterparty":"섬코","counterparty_slug":"sumco","confidence":"high","metric":null,"note":"SUMCO Corporation에서 300mm 실리콘 웨이퍼 매입(LTA).","note_en":"Buys 300mm silicon wafers from SUMCO Corporation under LTA.","sources":[{"stance":"confirms","publisher":"아이씨엔매거진","publisher_en":"ICN Magazine","kind":"news","lang":"ko","published_at":"2026-01-15","url":"https://icnweb.kr/2026/79720/","title":"HBM4 시대의 보이지 않는 병목—특수 폴리시드 웨이퍼","title_en":"HBM4’s hidden bottleneck — special polished wafers","excerpt":"Samsung Electronics 웨이퍼 수급에 SUMCO Corporation 의존.","excerpt_en":"Samsung Electronics depends on SUMCO Corporation for wafer supply."}]},{"direction":"cost","counterparty":"GlobalWafers","counterparty_slug":"globalwafers","confidence":"high","metric":null,"note":"GlobalWafers에서 300mm 실리콘 웨이퍼 매입/사용.","note_en":"Uses/buys 300mm silicon wafers from GlobalWafers.","sources":[{"stance":"confirms","publisher":"GlobalWafers","publisher_en":"GlobalWafers","kind":"ir","lang":"en","published_at":"2025-03-01","url":"https://www.globalwafers.com/en/investors","title":"글로벌웨이퍼스 IR","title_en":"GlobalWafers Investor Relations","excerpt":"IR: 실리콘 웨이퍼 매출·고객.","excerpt_en":"IR: silicon-wafer revenue and customers."},{"stance":"confirms","publisher":"Mordor Intelligence","publisher_en":"Mordor Intelligence","kind":"analysis","lang":"en","published_at":"2025-01-01","url":"https://www.mordorintelligence.com/industry-reports/semiconductor-silicon-wafer-market","title":"실리콘 웨이퍼 시장 (상위 5사 과점)","title_en":"Silicon Wafer Market (top-five oligopoly)","excerpt":"300mm 상위 5사 과점, 글로벌웨이퍼스 ~15%.","excerpt_en":"Top-five 300mm oligopoly; GlobalWafers ~15%."},{"stance":"confirms","publisher":"디일렉","publisher_en":"THE ELEC","kind":"news","lang":"ko","published_at":"2024-06-01","url":"https://www.thelec.kr/news/articleView.html?idxno=9435","title":"글로벌웨이퍼스, 실트로닉 인수 시도(獨 불허로 무산)","title_en":"GlobalWafers’ Siltronic bid (blocked by Germany)","excerpt":"TSMC·UMC·삼성 등에 웨이퍼 공급.","excerpt_en":"Supplies wafers to TSMC, UMC, Samsung."}]},{"direction":"cost","counterparty":"Advantest","counterparty_slug":"advantest","confidence":"high","metric":null,"note":"Advantest에서 반도체 테스트 장비(ATE) 매입.","note_en":"Buys test equipment (ATE) from Advantest.","sources":[{"stance":"confirms","publisher":"알파비즈","publisher_en":"AlphaBiz","kind":"news","lang":"ko","published_at":"2025-09-01","url":"https://alphabiz.co.kr/news/view/1065571888915355","title":"어드밴테스트, HBM 테스터 시장 압도적 기술력","title_en":"Advantest dominates the HBM tester market","excerpt":"HBM 테스터 압도적 기술력, SK하이닉스 등.","excerpt_en":"Dominant HBM tester tech; SK hynix and others."},{"stance":"confirms","publisher":"어드밴테스트","publisher_en":"Advantest","kind":"ir","lang":"en","published_at":"2025-06-01","url":"https://www.advantest.com/document/en/investors/ir-library/annual/E_02_IAR2025.pdf","title":"어드밴테스트 통합연차보고서 2025","title_en":"Advantest Integrated Annual Report 2025","excerpt":"연차보고서: ATE 매출·고객.","excerpt_en":"Annual report: ATE revenue and customers."},{"stance":"confirms","publisher":"Mordor Intelligence","publisher_en":"Mordor Intelligence","kind":"analysis","lang":"en","published_at":"2025-01-01","url":"https://www.mordorintelligence.com/industry-reports/semiconductor-test-equipment-market","title":"반도체 테스트 장비 시장 (어드밴테스트 ~58%)","title_en":"Semiconductor Test Equipment Market (Advantest ~58%)","excerpt":"테스트 장비 세계 ~58% 1위.","excerpt_en":"No.1 in test equipment at ~58%."}]},{"direction":"cost","counterparty":"Teradyne","counterparty_slug":"teradyne","confidence":"high","metric":null,"note":"Teradyne에서 반도체 테스트 장비(ATE) 매입.","note_en":"Buys test equipment (ATE) from Teradyne.","sources":[{"stance":"confirms","publisher":"한국경제","publisher_en":"Korea Economic Daily","kind":"news","lang":"ko","published_at":"2026-02-24","url":"https://www.hankyung.com/article/2026022418631","title":"테라다인 질주…반도체 호황·로봇 붐 올라탔다","title_en":"Teradyne surges on the chip upturn and robotics boom","excerpt":"테라다인, 반도체 호황에 질주.","excerpt_en":"Teradyne surges on the chip upturn."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2025-02-26","url":"https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=TER&type=10-K","title":"Teradyne 연례보고서 (10-K)","title_en":"Teradyne Form 10-K","excerpt":"10-K: 반도체 테스트 매출.","excerpt_en":"10-K: semiconductor-test revenue."},{"stance":"confirms","publisher":"Teradyne","publisher_en":"Teradyne","kind":"ir","lang":"en","published_at":"2025-01-01","url":"https://www.teradyne.com/semiconductor-testing/","title":"Teradyne 반도체 테스트","title_en":"Teradyne semiconductor testing","excerpt":"메모리·SoC·컴퓨팅 테스트.","excerpt_en":"Memory, SoC and computing test."}]},{"direction":"cost","counterparty":"피에스케이","counterparty_slug":"psk-inc","confidence":"high","metric":null,"note":"PSK에서 드라이 스트립(PR 제거) 장비 매입(세계 1위).","note_en":"Buys dry-strip (PR removal) tools from PSK (global No.1).","sources":[{"stance":"confirms","publisher":"디일렉","publisher_en":"THE ELEC","kind":"news","lang":"ko","published_at":null,"url":"https://www.thelec.kr/news/articleView.html?idxno=37929","title":"PSK, 메탈 에처 출시…삼성·SK·인텔 고객","title_en":"PSK launches metal etcher; customers Samsung, SK, Intel","excerpt":"삼성이 PSK 드라이 스트립 장비 채용.","excerpt_en":"Samsung adopts PSK dry-strip tools."}]},{"direction":"revenue","counterparty":"알파벳 (구글)","counterparty_slug":"alphabet","confidence":"mid","metric":{"type":"share","unit":"%","basis":"구글 TPU HBM 중 삼성 공급 비중","value":60,"period":"2024","basis_en":"Samsung’s share of HBM in Google TPUs","qualifier":"band"},"note":"구글 TPU·데이터센터에 HBM·DRAM 공급(2024년 구글 TPU HBM의 60%+). 차세대 TPU(아이스피시) I/O 다이 2나노 파운드리도 협상 중(2028 양산 목표·미확정).","note_en":"Supplies HBM/DRAM to Google’s TPUs and datacenters (60%+ of Google TPU HBM in 2024); also in talks to make the next-gen TPU I/O die on Samsung 2nm foundry (≈2028, not finalized).","sources":[{"stance":"mentions","publisher":"파이낸셜포스트","publisher_en":"Financial Post","kind":"news","lang":"ko","published_at":"2026-01-15","url":"https://www.financialpost.co.kr/news/articleView.html?idxno=262331","title":"삼성 파운드리, 구글 10세대 TPU 2나노 생산 유력","title_en":"Samsung Foundry favored for Google’s 10th-gen TPU on 2nm","excerpt":"구글 10세대 TPU 삼성 2나노 파운드리 협상.","excerpt_en":"Talks for Google 10th-gen TPU on Samsung 2nm."},{"stance":"confirms","publisher":"서울경제","publisher_en":"Seoul Economic Daily","kind":"news","lang":"ko","published_at":"2026-01-10","url":"https://m.sedaily.com/amparticle/20055221","title":"삼성 파운드리, 구글 차세대 TPU 수주 유력 (TPU HBM 60%+ 삼성)","title_en":"Samsung favored for Google next-gen TPU; supplies 60%+ of TPU HBM","excerpt":"지난해 구글 TPU에 HBM 60%+ 공급.","excerpt_en":"Supplied 60%+ of HBM in Google TPUs last year."},{"stance":"mentions","publisher":"디일렉","publisher_en":"THE ELEC","kind":"news","lang":"ko","published_at":null,"url":"https://www.thelec.kr/news/articleView.html?idxno=58018","title":"구글 차세대 TPU, 삼성도 만든다","title_en":"Samsung to make some of Google’s next-gen TPU","excerpt":"구글이 차세대 TPU 핵심 부품 생산을 삼성 파운드리에 검토.","excerpt_en":"Google is considering Samsung’s foundry for some next-gen TPU components."}]},{"direction":"cost","counterparty":"ASMPT","counterparty_slug":"asmpt","confidence":"mid","metric":null,"note":"HBM TC본더.","note_en":"HBM TC bonder.","sources":[]},{"direction":"cost","counterparty":"한미반도체","counterparty_slug":"hanmi-semiconductor","confidence":"mid","metric":null,"note":"HBM 본딩 장비(TC본더). SK하이닉스와 공급사 공유.","note_en":"HBM bonding equipment (TC bonder). Shares this supplier with SK hynix.","sources":[]},{"direction":"revenue","counterparty":"Qualcomm","counterparty_slug":"qualcomm","confidence":"mid","metric":null,"note":"Qualcomm에 파운드리 위탁생산(일부·2나노 논의) 공급.","note_en":"Supplies foundry (partial, 2nm talks) to Qualcomm.","sources":[{"stance":"confirms","publisher":"한국경제","publisher_en":"Korea Economic Daily","kind":"news","lang":"ko","published_at":"2026-01-07","url":"https://www.hankyung.com/article/2026010776221","title":"삼성 파운드리, 퀄컴 물량 따내고 TSMC 추격","title_en":"Samsung Foundry wins Qualcomm orders, chases TSMC","excerpt":"삼성과 2나노 파운드리 재논의.","excerpt_en":"Samsung in talks for 2nm foundry."},{"stance":"mentions","publisher":"TrendForce","publisher_en":null,"kind":"news","lang":"en","published_at":"2025-11-13","url":"https://www.trendforce.com/news/2025/11/13/news-samsung-reportedly-eyes-foundry-profitability-by-2027-with-20-market-share/","title":"Samsung eyes foundry profitability by 2027","title_en":null,"excerpt":"오스틴팹 고객에 Qualcomm 추가.","excerpt_en":"Qualcomm added to the Austin fab's customers."},{"stance":"confirms","publisher":"TrendForce","publisher_en":"TrendForce","kind":"news","lang":"en","published_at":"2025-03-26","url":"https://www.trendforce.com/news/2025/03/26/news-qualcomm-reportedly-skips-samsung-taps-tsmcs-4nm-for-latest-snapdragon-8s-gen-4/","title":"퀄컴, 스냅드래곤 8s Gen4를 TSMC 4nm로","title_en":"Qualcomm taps TSMC 4nm for Snapdragon 8s Gen 4","excerpt":"스냅드래곤 최첨단 물량 TSMC로.","excerpt_en":"Leading-edge Snapdragon volume moved to TSMC."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2024-11-06","url":"https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=QCOM&type=10-K","title":"Qualcomm 연례보고서 (10-K)","title_en":"Qualcomm Form 10-K","excerpt":"10-K: QCT 칩셋·QTL 라이선스.","excerpt_en":"10-K: QCT chipsets and QTL licensing."}]},{"direction":"cost","counterparty":"한화세미텍","counterparty_slug":"hanwha-semitech","confidence":"mid","metric":null,"note":"HBM TC본더.","note_en":"HBM TC bonder.","sources":[]},{"direction":"cost","counterparty":"BESI","counterparty_slug":"besi","confidence":"mid","metric":null,"note":"HBM 본더.","note_en":"HBM bonder.","sources":[]},{"direction":"revenue","counterparty":"Apple","counterparty_slug":"apple","confidence":"mid","metric":null,"note":"파운드리 위탁생산.","note_en":"Foundry contract manufacturing.","sources":[{"stance":"mentions","publisher":"TrendForce","publisher_en":null,"kind":"news","lang":"en","published_at":"2025-11-13","url":"https://www.trendforce.com/news/2025/11/13/news-samsung-reportedly-eyes-foundry-profitability-by-2027-with-20-market-share/","title":"Samsung eyes foundry profitability by 2027","title_en":null,"excerpt":"2025년 삼성이 Tesla·Apple 등 북미 대형사 파운드리 계약 확보.","excerpt_en":"In 2025 Samsung secured foundry contracts with major North American firms including Tesla and Apple."}]},{"direction":"revenue","counterparty":"Marvell","counterparty_slug":"marvell","confidence":"mid","metric":null,"note":"마벨 커스텀 AI칩용 맞춤형 HBM 협력.","note_en":"Custom HBM collaboration for Marvell's custom AI chips.","sources":[{"stance":"confirms","publisher":"한국경제","publisher_en":"Korea Economic Daily","kind":"news","lang":"ko","published_at":"2024-12-11","url":"https://www.hankyung.com/article/202412110524i","title":"美 마벨, 삼성·SK하이닉스와 협력…맞춤형 HBM 탑재","title_en":"Marvell partners with Samsung and SK hynix on custom HBM","excerpt":"마벨이 삼성·SK하이닉스와 맞춤형 HBM 협력.","excerpt_en":"Marvell works with Samsung and SK hynix on custom HBM."}]},{"direction":"revenue","counterparty":"Broadcom","counterparty_slug":"broadcom","confidence":"mid","metric":null,"note":"브로드컴 AI 가속기용 HBM 공급사.","note_en":"Supplies HBM for Broadcom's AI accelerators.","sources":[{"stance":"confirms","publisher":"서울경제","publisher_en":"Seoul Economic Daily","kind":"news","lang":"ko","published_at":"2026-03-06","url":"https://www.sedaily.com/article/14157561","title":"브로드컴 실적 뜯어보니…AI 매출 급증, 삼성 HBM '역전의 문'","title_en":"Broadcom results: AI revenue surges, opening a door for Samsung HBM","excerpt":"브로드컴 AI 매출 급증이 삼성 HBM '역전의 문'을 연다.","excerpt_en":"Broadcom's AI revenue surge opens a door for Samsung HBM."}]},{"direction":"cost","counterparty":"이엔에프테크놀로지","counterparty_slug":"enf-technology","confidence":"mid","metric":null,"note":"이엔에프에서 박리액·식각액·전구체 매입.","note_en":"Buys stripper, etchant and precursors from ENF.","sources":[{"stance":"confirms","publisher":"금융감독원 전자공시(DART)","publisher_en":"DART (Korea FSS)","kind":"filing","lang":"ko","published_at":"2026-03-20","url":"https://dart.fss.or.kr/dsae001/selectPopup.do?selectKey=00530185","title":"이엔에프테크놀로지 사업보고서 (DART, 2025)","title_en":"ENF Technology annual report (DART, 2025)","excerpt":"삼성전자가 이엔에프 공정 소재 매입.","excerpt_en":"Samsung buys ENF process materials."}]},{"direction":"cost","counterparty":"주성엔지니어링","counterparty_slug":"jusung-engineering","confidence":"mid","metric":null,"note":"주성엔지니어링에서 ALD 등 증착 장비 매입.","note_en":"Buys ALD and other deposition tools from Jusung Engineering.","sources":[{"stance":"confirms","publisher":"시사저널e","publisher_en":"Sisa Journal e","kind":"news","lang":"ko","published_at":null,"url":"https://www.sisajournal-e.com/news/articleView.html?idxno=420473","title":"삼성·SK ALD 비중 늘자 주성엔지니어링 방긋","title_en":"Jusung gains as Samsung and SK raise ALD share","excerpt":"삼성이 ALD 비중을 늘리며 주성 장비 채용.","excerpt_en":"Samsung adopts Jusung ALD tools as it raises ALD share."}]},{"direction":"cost","counterparty":"Synopsys","counterparty_slug":"synopsys","confidence":"mid","metric":null,"note":"Synopsys에서 EDA 설계 툴·IP 매입/사용.","note_en":"Uses/buys EDA tools and IP from Synopsys.","sources":[{"stance":"confirms","publisher":"서울경제","publisher_en":"Seoul Economic Daily","kind":"news","lang":"ko","published_at":"2025-07-01","url":"https://www.sedaily.com/NewsView/2GVCJ4DVZD","title":"中, 시높시스-앤시스 합병 조건부 승인","title_en":"China conditionally approves Synopsys-Ansys merger","excerpt":"삼성 등 시높시스 EDA 활용.","excerpt_en":"Samsung and others use Synopsys EDA."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2024-12-18","url":"https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=SNPS&type=10-K","title":"Synopsys 연례보고서 (10-K)","title_en":"Synopsys Form 10-K","excerpt":"10-K: EDA 툴·IP 매출, 주요 반도체 고객.","excerpt_en":"10-K: EDA tools/IP revenue and major chip customers."},{"stance":"confirms","publisher":"SemiAnalysis","publisher_en":"SemiAnalysis","kind":"analysis","lang":"en","published_at":"2024-06-01","url":"https://newsletter.semianalysis.com/p/eda-market-primer","title":"EDA 시장 입문 (시높시스 31%·케이던스 30%)","title_en":"EDA Market Primer (Synopsys 31%, Cadence 30%)","excerpt":"시높시스 EDA 세계 ~31% 1위.","excerpt_en":"Synopsys leads EDA at ~31%."}]},{"direction":"cost","counterparty":"SK실트론","counterparty_slug":"sk-siltron","confidence":"mid","metric":null,"note":"SK실트론에서 300mm 실리콘 웨이퍼 매입.","note_en":"Buys 300mm silicon wafers from SK Siltron.","sources":[{"stance":"confirms","publisher":"비즈워치","publisher_en":"BizWatch","kind":"news","lang":"ko","published_at":"2025-05-23","url":"https://news.bizwatch.co.kr/article/industry/2025/05/23/0043","title":"'웨이퍼 숨은 강자' SK실트론, 日 아성 깰까","title_en":"SK Siltron, the hidden wafer champion, takes on Japan’s lead","excerpt":"삼성전자 웨이퍼 공급사로 SK실트론 포함.","excerpt_en":"SK Siltron is among Samsung’s wafer suppliers."}]},{"direction":"cost","counterparty":"Arm Holdings","counterparty_slug":"arm","confidence":"mid","metric":null,"note":"Arm Holdings에서 CPU 아키텍처 IP(라이선스·로열티) 매입/사용.","note_en":"Uses/buys CPU-architecture IP (license and royalty) from Arm Holdings.","sources":[{"stance":"confirms","publisher":"이코노미6","publisher_en":"Economy6","kind":"news","lang":"ko","published_at":"2026-01-15","url":"https://www.economy6.com/2026/01/arm-stock.html","title":"ARM 홀딩스 실적·엔비디아 관계 정리","title_en":"Arm Holdings results and the NVIDIA relationship","excerpt":"애플·퀄컴·삼성·엔비디아가 ARM IP 사용.","excerpt_en":"Apple, Qualcomm, Samsung, NVIDIA use ARM IP."},{"stance":"confirms","publisher":"Arm IR","publisher_en":"Arm IR","kind":"ir","lang":"en","published_at":"2024-07-01","url":"https://investors.arm.com/static-files/219a3b28-f209-4d74-8bc6-f9e026d55a95","title":"Arm 연차보고서 FY2024","title_en":"Arm Annual Report FY2024","excerpt":"FY2024 매출 $3.23B.","excerpt_en":"FY2024 revenue $3.23B."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2024-05-22","url":"https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=ARM&type=20-F","title":"Arm 연례보고서 (20-F)","title_en":"Arm Holdings Form 20-F","excerpt":"20-F: 라이선스·로열티 매출.","excerpt_en":"20-F: licensing and royalty revenue."}]},{"direction":"cost","counterparty":"Cadence Design Systems","counterparty_slug":"cadence","confidence":"mid","metric":null,"note":"Cadence Design Systems에서 EDA 설계 툴·IP 매입/사용.","note_en":"Uses/buys EDA tools and IP from Cadence Design Systems.","sources":[{"stance":"confirms","publisher":"서울경제","publisher_en":"Seoul Economic Daily","kind":"news","lang":"ko","published_at":"2025-03-01","url":"https://www.sedaily.com/article/14136879","title":"AI 반도체 설계 강자 케이던스, 성장엔진 재점화","title_en":"Cadence, an AI chip-design leader, reignites growth","excerpt":"AI 칩 설계로 케이던스 성장.","excerpt_en":"Cadence grows on AI-chip design."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2025-02-24","url":"https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=CDNS&type=10-K","title":"Cadence 연례보고서 (10-K)","title_en":"Cadence Form 10-K","excerpt":"10-K: EDA 툴·IP 매출.","excerpt_en":"10-K: EDA tools/IP revenue."},{"stance":"confirms","publisher":"SemiAnalysis","publisher_en":"SemiAnalysis","kind":"analysis","lang":"en","published_at":"2024-06-01","url":"https://newsletter.semianalysis.com/p/eda-market-primer","title":"EDA 시장 입문 (시높시스 31%·케이던스 30%)","title_en":"EDA Market Primer (Synopsys 31%, Cadence 30%)","excerpt":"케이던스 EDA 세계 ~30% 2위.","excerpt_en":"Cadence is No.2 in EDA at ~30%."}]},{"direction":"cost","counterparty":"심텍","counterparty_slug":null,"confidence":"low","metric":null,"note":"패키지 기판. 공급관계 추정.","note_en":"Package substrates. Supply relationship inferred.","sources":[{"stance":"mentions","publisher":"Blackridge Research","publisher_en":null,"kind":"research","lang":"en","published_at":null,"url":"https://www.blackridgeresearch.com/blog/list-of-largest-biggest-semiconductor-chip-companies-manufacturers-makers-suppliers-south-korea","title":"Top semiconductor companies in South Korea","title_en":null,"excerpt":"심텍 등 기판 공급사.","excerpt_en":"Substrate suppliers such as Simmtech."}]},{"direction":"cost","counterparty":"LG이노텍","counterparty_slug":null,"confidence":"low","metric":null,"note":"기판·부품. 공급관계 추정.","note_en":"Substrates and components. Supply relationship inferred.","sources":[{"stance":"mentions","publisher":"Blackridge Research","publisher_en":null,"kind":"research","lang":"en","published_at":null,"url":"https://www.blackridgeresearch.com/blog/list-of-largest-biggest-semiconductor-chip-companies-manufacturers-makers-suppliers-south-korea","title":"Top semiconductor companies in South Korea","title_en":null,"excerpt":"LG이노텍 등 부품/기판.","excerpt_en":"Components and substrates from suppliers such as LG Innotek."}]}]}