# 유니마이크론 (3037.TW)
> 대만 IC 패키지 기판 매출 세계 1위(점유율 약 15%). 가장 넓은 고객 기반으로 엔비디아·AMD·인텔 등 AI·HPC 칩 기판 공급. AI 병목 대응 증설.
Canonical: https://valuechain.wiki/unimicron · Updated: 2026-06-21T12:43:34.349446+00:00 · Source: ValueChain.wiki (refined facts, cited)

## Financials & segments
- 총매출: IC 패키지 기판 매출 세계 1위
- 사업부문: IC 패키지 기판 매출 세계 1위

## Annual stock return (as of 2026-06-18)
- 2021: +133.5%
- 2022: -30.2%
- 2023: +35.2%
- 2024: -19.7%
- 2025: +175.7%
- 2026 YTD: +155.7%

## Value-chain annual returns (top→bottom: demand → node → supply; YTD as of 2026-06-18)
| Company | Chain | 2021 | 2022 | 2023 | 2024 | 2025 | YTD |
| --- | --- | --- | --- | --- | --- | --- | --- |
| Apple | lead3 | +34.6% | -26.4% | +49% | +30.7% | +9.1% | +9.8% |
| CoreWeave | lead2 | · | · | · | · | · | +64.7% |
| Foxconn | lead2 | -5.1% | +2.8% | +7.8% | +80.1% | +26.9% | +21.8% |
| 알파벳 (구글) | lead2 | +65.3% | -39.1% | +58.3% | +35.8% | +66.1% | +17.8% |
| 아마존 | lead2 | +2.4% | -49.6% | +80.9% | +44.4% | +5.2% | +5.9% |
| Super Micro | lead2 | +38.8% | +86.8% | +246.2% | +7.2% | -4% | +4.7% |
| 메타 플랫폼스 | lead2 | +23.1% | -64.2% | +194.1% | +65.9% | +13.1% | -12.3% |
| 마이크로소프트 | lead2 | +52.5% | -28% | +58.2% | +12.9% | +15.6% | -21.2% |
| Intel | lead1 | +6.1% | -46.6% | +94.6% | -59.6% | +84% | +263.1% |
| AMD | lead1 | +56.9% | -55% | +127.6% | -18.1% | +77.3% | +150.9% |
| NVIDIA | lead1 | +125.5% | -50.3% | +239% | +171.3% | +38.9% | +13.1% |
| 유니마이크론 | node | +133.5% | -30.2% | +35.2% | -19.7% | +175.7% | +155.7% |
| Resonac | benef1 | -2.6% | -4% | +37.5% | +30.3% | +137.9% | +105.5% |

## Money in · revenue from (3)
### NVIDIA (high)  → /nvidia.md
- metric: 점유율 15 · 2024 · IC 기판 매출 세계 점유율
- note: NVIDIA에 FC-BGA·IC 패키지 기판 공급/제공.
- [confirms] 유니마이크론 (EN, ir, published 2025-05-01) https://www.unimicron.com/en/: "NVIDIA에 FC-BGA·IC 패키지 기판 공급/제공."
- [confirms] Market Growth Reports (EN, analysis, published 2025-01-01) https://www.marketgrowthreports.com/market-reports/abf-substrate-fc-bga-market-107527: "NVIDIA에 FC-BGA·IC 패키지 기판 공급/제공."

### AMD (mid)  → /amd.md
- note: AMD에 FC-BGA·IC 패키지 기판 공급/제공.
- [confirms] 유니마이크론 (EN, ir, published 2025-05-01) https://www.unimicron.com/en/: "AMD에 FC-BGA·IC 패키지 기판 공급/제공."
- [confirms] Market Growth Reports (EN, analysis, published 2025-01-01) https://www.marketgrowthreports.com/market-reports/abf-substrate-fc-bga-market-107527: "AMD에 FC-BGA·IC 패키지 기판 공급/제공."

### Intel (mid)  → /intel.md
- note: Intel에 FC-BGA·IC 패키지 기판 공급/제공.
- [confirms] 시사저널e (KO, news, published 2025-06-01) https://www.sisajournal-e.com/news/articleView.html?idxno=295754: "반도체 기판 업황(유니마이크론 등)"
- [confirms] 유니마이크론 (EN, ir, published 2025-05-01) https://www.unimicron.com/en/: "Intel에 FC-BGA·IC 패키지 기판 공급/제공."
- [confirms] 회사 IR/거래소 공시 (EN, filing, published 2025-04-01) https://www.unimicron.com/en/investors: "연차보고서: 매출·고객·사업."
- [confirms] Market Growth Reports (EN, analysis, published 2025-01-01) https://www.marketgrowthreports.com/market-reports/abf-substrate-fc-bga-market-107527: "Intel에 FC-BGA·IC 패키지 기판 공급/제공."

## Money out · pays to (2)
### Resonac (mid)  → /resonac.md
- note: Resonac에서 ABF·기판 소재 매입.
- [confirms] 유니마이크론 (EN, ir, published 2025-05-01) https://www.unimicron.com/en/: "Resonac에서 ABF·기판 소재 매입."
- [confirms] Market Growth Reports (EN, analysis, published 2025-01-01) https://www.marketgrowthreports.com/market-reports/abf-substrate-fc-bga-market-107527: "Resonac에서 ABF·기판 소재 매입."

### 동박·빌드업 소재 (비공개) (low)
- note: 제조용 원재료·소재·R&D(비공개).
- [confirms] 유니마이크론 (EN, ir, published 2025-05-01) https://www.unimicron.com/en/: "제조용 원재료·소재·R&D(비공개)."

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