{"slug":"umc","name":"UMC","name_en":"United Microelectronics (UMC)","ticker":"UMC","updated_at":"2026-06-21T08:11:16.801829+00:00","canonical":"https://valuechain.wiki/umc","kicker":"성숙·특화 공정 파운드리 (대만)","kicker_en":"Mature & specialty foundry (Taiwan)","lead":"대만의 성숙·특화 노드 파운드리(28/22/40/55nm). FY2025 매출 약 $7.6B(+5%). 퀄컴·미디어텍·브로드컴·TI 등 팹리스에 통신·디스플레이·자동차용 칩을 위탁생산하고, 인텔과 12nm 공정을 공동개발한다. 장비는 ASML·어플라이드·램·KLA에 의존.","lead_en":"A Taiwanese mature/specialty-node foundry (28/22/40/55nm). FY2025 revenue about $7.6B (+5%). Fabricates communications, display and automotive chips for fabless customers such as Qualcomm, MediaTek, Broadcom and TI, and co-develops a 12nm process with Intel. Depends on ASML, Applied Materials, Lam and KLA for equipment.","segments":{"fy":2025,"parts":[{"desc":"28/22/40/55nm 성숙·특화 (22nm 최고치)","name":"파운드리"},{"desc":"RF·BCD·임베디드","name":"특화공정"}],"total":"FY2025 매출 약 $7.6B (+5%)","source":"https://www.sec.gov/Archives/edgar/data/0001033767/000119312526025557/umc-ex99_1.htm","concentration":"성숙·특화 노드. 고객 퀄컴·미디어텍·브로드컴·TI·리얼텍. 인텔과 12nm 공동개발."},"segments_en":{"parts":[{"desc":"28/22/40/55nm mature/specialty (22nm at record)","name":"Foundry"},{"desc":"RF, BCD, embedded","name":"Specialty"}],"total":"FY2025 revenue about $7.6B (+5%)","concentration":"Mature/specialty nodes. Customers Qualcomm, MediaTek, Broadcom, TI, Realtek. 12nm co-development with Intel."},"edges":[{"direction":"revenue","counterparty":"팹리스 고객 (퀄컴·미디어텍·TI 등)","counterparty_slug":null,"confidence":"high","metric":{"type":"revenue","unit":"USD","basis":"연간 총매출(추정)","value":7600000000,"period":"FY2025","basis_en":"annual total revenue (approx)","qualifier":"approx"},"note":"퀄컴·미디어텍·TI·리얼텍 등 팹리스에 통신·디스플레이·자동차용 칩 공급. 퀄컴 패키징 수주.","note_en":"Supplies comms/display/automotive chips to fabless such as Qualcomm, MediaTek, TI, Realtek; won a Qualcomm packaging deal.","sources":[{"stance":"confirms","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-01-28","url":"https://www.sec.gov/Archives/edgar/data/0001033767/000119312526025557/umc-ex99_1.htm","title":"UMC FY2025 실적 (6-K)","title_en":"UMC FY2025 results (6-K)","excerpt":"FY2025 매출 약 $7.6B, 출하 +12%.","excerpt_en":"FY2025 revenue about $7.6B, shipments +12%."},{"stance":"confirms","publisher":"지디넷코리아","publisher_en":"ZDNet Korea","kind":"news","lang":"ko","published_at":"2024-01-30","url":"https://zdnet.co.kr/view/?no=20240130165149","title":"인텔·대만 UMC 파운드리 동맹","title_en":"Intel and UMC announce foundry collaboration","excerpt":"UMC는 22/28nm 성숙공정 주력, 인텔과 12nm 협력으로 핀펫 확보.","excerpt_en":"UMC focuses on 22/28nm mature nodes and gains FinFET via its 12nm collaboration with Intel."},{"stance":"confirms","publisher":"SMBOM","publisher_en":"SMBOM","kind":"news","lang":"en","published_at":null,"url":"https://www.smbom.com/news/40403","title":"UMC, 퀄컴 패키징 수주…파운드리 기술 확대","title_en":"UMC wins Qualcomm packaging deal, advances foundry tech","excerpt":"UMC가 퀄컴 패키징 수주.","excerpt_en":"UMC wins a Qualcomm packaging deal."}]},{"direction":"cost","counterparty":"GlobalWafers","counterparty_slug":"globalwafers","confidence":"high","metric":null,"note":"GlobalWafers에서 300mm 실리콘 웨이퍼 매입/사용.","note_en":"Uses/buys 300mm silicon wafers from GlobalWafers.","sources":[{"stance":"confirms","publisher":"GlobalWafers","publisher_en":"GlobalWafers","kind":"ir","lang":"en","published_at":"2025-03-01","url":"https://www.globalwafers.com/en/investors","title":"글로벌웨이퍼스 IR","title_en":"GlobalWafers Investor Relations","excerpt":"IR: 실리콘 웨이퍼 매출·고객.","excerpt_en":"IR: silicon-wafer revenue and customers."},{"stance":"confirms","publisher":"Mordor Intelligence","publisher_en":"Mordor Intelligence","kind":"analysis","lang":"en","published_at":"2025-01-01","url":"https://www.mordorintelligence.com/industry-reports/semiconductor-silicon-wafer-market","title":"실리콘 웨이퍼 시장 (상위 5사 과점)","title_en":"Silicon Wafer Market (top-five oligopoly)","excerpt":"300mm 상위 5사 과점, 글로벌웨이퍼스 ~15%.","excerpt_en":"Top-five 300mm oligopoly; GlobalWafers ~15%."},{"stance":"confirms","publisher":"디일렉","publisher_en":"THE ELEC","kind":"news","lang":"ko","published_at":"2024-06-01","url":"https://www.thelec.kr/news/articleView.html?idxno=9435","title":"글로벌웨이퍼스, 실트로닉 인수 시도(獨 불허로 무산)","title_en":"GlobalWafers’ Siltronic bid (blocked by Germany)","excerpt":"TSMC·UMC·삼성 등에 웨이퍼 공급.","excerpt_en":"Supplies wafers to TSMC, UMC, Samsung."}]},{"direction":"revenue","counterparty":"Broadcom","counterparty_slug":"broadcom","confidence":"mid","metric":null,"note":"브로드컴의 일부 칩(통신·특화)을 성숙·특화 노드로 위탁생산.","note_en":"Fabricates some of Broadcom’s communications/specialty chips on mature nodes.","sources":[{"stance":"confirms","publisher":"SMBOM","publisher_en":"SMBOM","kind":"news","lang":"en","published_at":null,"url":"https://www.smbom.com/news/40403","title":"UMC, 퀄컴 패키징 수주…파운드리 기술 확대","title_en":"UMC wins Qualcomm packaging deal, advances foundry tech","excerpt":"UMC 주요 고객에 브로드컴 포함.","excerpt_en":"UMC’s key customers include Broadcom."},{"stance":"mentions","publisher":"AIChipLink","publisher_en":"AIChipLink","kind":"analysis","lang":"en","published_at":null,"url":"https://aichiplink.com/blog/2025-Top-10-Semiconductor-Foundries-in-the-World_211","title":"2025 세계 파운드리 톱10","title_en":"2025 Top 10 Semiconductor Foundries","excerpt":"UMC가 팹리스·IDM에 성숙공정 파운드리 제공.","excerpt_en":"UMC provides mature-node foundry to fabless and IDMs."}]},{"direction":"cost","counterparty":"ASML","counterparty_slug":"asml","confidence":"mid","metric":null,"note":"EUV/DUV 노광장비를 ASML에서 매입.","note_en":"Buys lithography from ASML.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-01-28","url":"https://www.sec.gov/Archives/edgar/data/0001033767/000119312526025557/umc-ex99_1.htm","title":"UMC FY2025 실적 (6-K)","title_en":"UMC FY2025 results (6-K)","excerpt":"6-K: 전공정 장비를 주요 장비사에서 매입.","excerpt_en":"6-K: buys wafer-fab equipment from major toolmakers."}]},{"direction":"cost","counterparty":"KLA","counterparty_slug":"kla","confidence":"mid","metric":null,"note":"검사·계측 장비를 KLA에서 매입.","note_en":"Buys inspection/metrology tools from KLA.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-01-28","url":"https://www.sec.gov/Archives/edgar/data/0001033767/000119312526025557/umc-ex99_1.htm","title":"UMC FY2025 실적 (6-K)","title_en":"UMC FY2025 results (6-K)","excerpt":"6-K: 전공정 장비를 주요 장비사에서 매입.","excerpt_en":"6-K: buys wafer-fab equipment from major toolmakers."}]},{"direction":"cost","counterparty":"어플라이드 머티어리얼즈","counterparty_slug":"applied-materials","confidence":"mid","metric":null,"note":"전공정 장비를 어플라이드에서 매입.","note_en":"Buys wafer-fab tools from Applied Materials.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-01-28","url":"https://www.sec.gov/Archives/edgar/data/0001033767/000119312526025557/umc-ex99_1.htm","title":"UMC FY2025 실적 (6-K)","title_en":"UMC FY2025 results (6-K)","excerpt":"6-K: 전공정 장비를 주요 장비사에서 매입.","excerpt_en":"6-K: buys wafer-fab equipment from major toolmakers."}]},{"direction":"cost","counterparty":"램리서치","counterparty_slug":"lam-research","confidence":"mid","metric":null,"note":"식각·증착 장비를 램에서 매입.","note_en":"Buys etch/deposition tools from Lam Research.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-01-28","url":"https://www.sec.gov/Archives/edgar/data/0001033767/000119312526025557/umc-ex99_1.htm","title":"UMC FY2025 실적 (6-K)","title_en":"UMC FY2025 results (6-K)","excerpt":"6-K: 전공정 장비를 주요 장비사에서 매입.","excerpt_en":"6-K: buys wafer-fab equipment from major toolmakers."}]},{"direction":"cost","counterparty":"웨이퍼·소재 (비공개)","counterparty_slug":null,"confidence":"low","metric":{"type":"qualifier","value":null,"qualifier":"confirmed_no_disclosed_value"},"note":"실리콘 웨이퍼·공정 소재 매입(공급사 비공개).","note_en":"Buys silicon wafers and process materials (suppliers undisclosed).","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-01-28","url":"https://www.sec.gov/Archives/edgar/data/0001033767/000119312526025557/umc-ex99_1.htm","title":"UMC FY2025 실적 (6-K)","title_en":"UMC FY2025 results (6-K)","excerpt":"6-K: 웨이퍼·소재 공급망.","excerpt_en":"6-K: wafer and materials supply chain."}]}]}