{"slug":"sfa-semicon","name":"SFA반도체","name_en":"SFA Semicon","ticker":"036540.KQ","updated_at":"2026-06-21T12:37:01.802603+00:00","canonical":"https://valuechain.wiki/sfa-semicon","kicker":"메모리 후공정 패키징·테스트","kicker_en":"Memory back-end packaging and test","lead":"국내 메모리 반도체 후공정(패키징·테스트) OSAT. 삼성전자·SK하이닉스 메모리 조립·테스트를 담당한다.","lead_en":"A Korean OSAT for memory back-end packaging and test, handling memory assembly/test for Samsung and SK hynix.","segments":{"fy":2024,"parts":[{"name":"메모리 후공정 패키징·테스트"}],"total":"메모리 후공정 패키징·테스트","source":"https://www.sfas.co.kr/eng/"},"segments_en":{"parts":[{"name":"Memory back-end packaging and test"}],"total":"Memory back-end packaging and test"},"returns_yearly":{"2021":-5.8,"2022":-34.1,"2023":48.7,"2024":-48.7,"2025":139.8,"2026":-13.3},"return_asof":"2026-06-19","value_chain":{"leading":[{"slug":"coreweave","name":"CoreWeave","name_en":"CoreWeave","tier":3,"returns_yearly":{"2026":64.7}},{"slug":"arista","name":"Arista Networks","name_en":"Arista Networks","tier":3,"returns_yearly":{"2021":97.9,"2022":-15.6,"2023":94.1,"2024":87.7,"2025":18.5,"2026":29.5}},{"slug":"foxconn","name":"Foxconn","name_en":"Foxconn (Hon Hai)","tier":3,"returns_yearly":{"2021":-5.1,"2022":2.8,"2023":7.8,"2024":80.1,"2025":26.9,"2026":21.8}},{"slug":"alphabet","name":"알파벳 (구글)","name_en":"Alphabet (Google)","tier":3,"returns_yearly":{"2021":65.3,"2022":-39.1,"2023":58.3,"2024":35.8,"2025":66.1,"2026":17.8}},{"slug":"apple","name":"Apple","name_en":"Apple","tier":3,"returns_yearly":{"2021":34.6,"2022":-26.4,"2023":49,"2024":30.7,"2025":9.1,"2026":9.8}},{"slug":"amazon","name":"아마존","name_en":"Amazon","tier":3,"returns_yearly":{"2021":2.4,"2022":-49.6,"2023":80.9,"2024":44.4,"2025":5.2,"2026":5.9}},{"slug":"super-micro","name":"Super Micro","name_en":"Super Micro","tier":3,"returns_yearly":{"2021":38.8,"2022":86.8,"2023":246.2,"2024":7.2,"2025":-4,"2026":4.7}},{"slug":"meta","name":"메타 플랫폼스","name_en":"Meta Platforms","tier":3,"returns_yearly":{"2021":23.1,"2022":-64.2,"2023":194.1,"2024":65.9,"2025":13.1,"2026":-12.3}},{"slug":"microsoft","name":"마이크로소프트","name_en":"Microsoft","tier":3,"returns_yearly":{"2021":52.5,"2022":-28,"2023":58.2,"2024":12.9,"2025":15.6,"2026":-21.2}},{"slug":"anthropic","name":"Anthropic","name_en":"Anthropic","tier":3,"returns_yearly":null},{"slug":"openai","name":"OpenAI","name_en":"OpenAI","tier":3,"returns_yearly":null},{"slug":"marvell","name":"Marvell","name_en":"Marvell","tier":2,"returns_yearly":{"2021":84.9,"2022":-57.5,"2023":63.7,"2024":83.8,"2025":-22.8,"2026":265.9}},{"slug":"amd","name":"AMD","name_en":"AMD","tier":2,"returns_yearly":{"2021":56.9,"2022":-55,"2023":127.6,"2024":-18.1,"2025":77.3,"2026":150.9}},{"slug":"qualcomm","name":"Qualcomm","name_en":"Qualcomm","tier":2,"returns_yearly":{"2021":22.3,"2022":-38.4,"2023":35.1,"2024":7.7,"2025":13.9,"2026":34.2}},{"slug":"broadcom","name":"Broadcom","name_en":"Broadcom","tier":2,"returns_yearly":{"2021":56.8,"2022":-13.4,"2023":104.9,"2024":110.9,"2025":50.7,"2026":19.3}},{"slug":"nvidia","name":"NVIDIA","name_en":"NVIDIA","tier":2,"returns_yearly":{"2021":125.5,"2022":-50.3,"2023":239,"2024":171.3,"2025":38.9,"2026":13.1}},{"slug":"sk-hynix","name":"SK하이닉스","name_en":"SK hynix","tier":1,"returns_yearly":{"2021":-0.4,"2022":-25.6,"2023":53.9,"2024":48.6,"2025":361.1,"2026":204.7}},{"slug":"samsung-electronics","name":"삼성전자","name_en":"Samsung Electronics","tier":1,"returns_yearly":{"2021":-9,"2022":-14.2,"2023":20.9,"2024":-26.4,"2025":212.9,"2026":121}}],"benefiting":[{"slug":"advantest","name":"Advantest","name_en":"Advantest","tier":1,"returns_yearly":{"2021":17,"2022":-2.3,"2023":155.7,"2024":49.5,"2025":196,"2026":24.6}}],"analysis":null,"analysis_en":null,"analysis_asof":null},"edges":[{"direction":"revenue","counterparty":"삼성전자","counterparty_slug":"samsung-electronics","confidence":"high","metric":null,"note":"삼성전자에 메모리 후공정 패키징·테스트 공급/제공.","note_en":"Provides memory back-end packaging and test to 삼성전자.","sources":[{"stance":"confirms","publisher":"다음/뉴스","publisher_en":"Daum News","kind":"news","lang":"ko","published_at":"2026-06-17","url":"https://v.daum.net/v/20260617203416105","title":"메모리 후공정 훈풍","title_en":"Memory back-end packaging upturn","excerpt":"삼성전자에 메모리 후공정 패키징·테스트 공급/제공.","excerpt_en":"Provides memory back-end packaging and test to 삼성전자."},{"stance":"confirms","publisher":"SFA반도체","publisher_en":"SFA Semicon","kind":"ir","lang":"en","published_at":"2025-05-01","url":"https://www.sfas.co.kr/eng/","title":"SFA Semicon IR","title_en":"SFA Semicon IR","excerpt":"삼성전자에 메모리 후공정 패키징·테스트 공급/제공.","excerpt_en":"Provides memory back-end packaging and test to 삼성전자."}]},{"direction":"revenue","counterparty":"SK하이닉스","counterparty_slug":"sk-hynix","confidence":"mid","metric":null,"note":"SK하이닉스에 메모리 후공정 패키징·테스트 공급/제공.","note_en":"Provides memory back-end packaging and test to SK하이닉스.","sources":[{"stance":"confirms","publisher":"다음/뉴스","publisher_en":"Daum News","kind":"news","lang":"ko","published_at":"2026-06-17","url":"https://v.daum.net/v/20260617203416105","title":"메모리 후공정 훈풍","title_en":"Memory back-end packaging upturn","excerpt":"SK하이닉스에 메모리 후공정 패키징·테스트 공급/제공.","excerpt_en":"Provides memory back-end packaging and test to SK하이닉스."},{"stance":"confirms","publisher":"DART(금융감독원 전자공시)","publisher_en":"DART (FSS)","kind":"filing","lang":"ko","published_at":"2026-03-23","url":"https://dart.fss.or.kr/dsaf001/main.do?rcpNo=20260323000826","title":"sfa-semicon 사업보고서 (DART)","title_en":"Annual business report (DART)","excerpt":"DART 사업보고서: 매출·고객·사업 내용.","excerpt_en":"DART annual report: revenue, customers and business."},{"stance":"confirms","publisher":"SFA반도체","publisher_en":"SFA Semicon","kind":"ir","lang":"en","published_at":"2025-05-01","url":"https://www.sfas.co.kr/eng/","title":"SFA Semicon IR","title_en":"SFA Semicon IR","excerpt":"SK하이닉스에 메모리 후공정 패키징·테스트 공급/제공.","excerpt_en":"Provides memory back-end packaging and test to SK하이닉스."}]},{"direction":"cost","counterparty":"본딩·소재 (비공개)","counterparty_slug":null,"confidence":"low","metric":{"type":"qualifier","value":null,"qualifier":"confirmed_no_disclosed_value"},"note":"제조용 원재료·소재·R&D(비공개).","note_en":"Materials and R&D (undisclosed).","sources":[{"stance":"confirms","publisher":"SFA반도체","publisher_en":"SFA Semicon","kind":"ir","lang":"en","published_at":"2025-05-01","url":"https://www.sfas.co.kr/eng/","title":"SFA Semicon IR","title_en":"SFA Semicon IR","excerpt":"제조용 원재료·소재·R&D(비공개).","excerpt_en":"Materials and R&D (undisclosed)."}]},{"direction":"cost","counterparty":"Advantest","counterparty_slug":"advantest","confidence":"low","metric":null,"note":"Advantest에서 테스트 장비 매입.","note_en":"Buys test equipment from Advantest.","sources":[{"stance":"confirms","publisher":"다음/뉴스","publisher_en":"Daum News","kind":"news","lang":"ko","published_at":"2026-06-17","url":"https://v.daum.net/v/20260617203416105","title":"메모리 후공정 훈풍","title_en":"Memory back-end packaging upturn","excerpt":"Advantest에서 테스트 장비 매입.","excerpt_en":"Buys test equipment from Advantest."},{"stance":"confirms","publisher":"SFA반도체","publisher_en":"SFA Semicon","kind":"ir","lang":"en","published_at":"2025-05-01","url":"https://www.sfas.co.kr/eng/","title":"SFA Semicon IR","title_en":"SFA Semicon IR","excerpt":"Advantest에서 테스트 장비 매입.","excerpt_en":"Buys test equipment from Advantest."}]}]}