# 난야PCB (8046.TW)
> 대만 BT·FC-BGA 패키지 기판 제조사. 5G·AI·HPC용 빌드업 BT 기판에 강점이며 AI·HPC로 확장 증설 중.
Canonical: https://valuechain.wiki/nanya-pcb · Updated: 2026-06-21T12:43:36.156156+00:00 · Source: ValueChain.wiki (refined facts, cited)

## Financials & segments
- 총매출: BT·FC-BGA 패키지 기판
- 사업부문: BT·FC-BGA 패키지 기판

## Annual stock return (as of 2026-06-18)
- 2021: +110.6%
- 2022: -46.7%
- 2023: -0.5%
- 2024: -38.3%
- 2025: +188.2%
- 2026 YTD: +125%

## Value-chain annual returns (top→bottom: demand → node → supply; YTD as of 2026-06-18)
| Company | Chain | 2021 | 2022 | 2023 | 2024 | 2025 | YTD |
| --- | --- | --- | --- | --- | --- | --- | --- |
| Marvell | lead3 | +84.9% | -57.5% | +63.7% | +83.8% | -22.8% | +265.9% |
| AMD | lead3 | +56.9% | -55% | +127.6% | -18.1% | +77.3% | +150.9% |
| Qualcomm | lead3 | +22.3% | -38.4% | +35.1% | +7.7% | +13.9% | +34.2% |
| Broadcom | lead3 | +56.8% | -13.4% | +104.9% | +110.9% | +50.7% | +19.3% |
| 알파벳 (구글) | lead3 | +65.3% | -39.1% | +58.3% | +35.8% | +66.1% | +17.8% |
| NVIDIA | lead3 | +125.5% | -50.3% | +239% | +171.3% | +38.9% | +13.1% |
| Apple | lead3 | +34.6% | -26.4% | +49% | +30.7% | +9.1% | +9.8% |
| 삼성전자 | lead2 | -9% | -14.2% | +20.9% | -26.4% | +212.9% | +121% |
| 미디어텍 | lead1 | +27.8% | -26.6% | +49% | +59.1% | +25.1% | +154.3% |
| 난야PCB | node | +110.6% | -46.7% | -0.5% | -38.3% | +188.2% | +125% |
| Resonac | benef1 | -2.6% | -4% | +37.5% | +30.3% | +137.9% | +105.5% |

## Money in · revenue from (2)
### 미디어텍 (mid)  → /mediatek.md
- note: 미디어텍에 BT·패키지 기판 공급/제공.
- [confirms] 난야PCB (EN, ir, published 2025-05-01) https://www.npc.com.tw/npceb2b/en/: "미디어텍에 BT·패키지 기판 공급/제공."
- [confirms] MatrixBCG (EN, analysis, published 2025-01-01) https://matrixbcg.com/blogs/growth-strategy/nanyapcb: "미디어텍에 BT·패키지 기판 공급/제공."

### NVIDIA (mid)  → /nvidia.md
- note: NVIDIA에 BT·패키지 기판 공급/제공.
- [confirms] 시사저널e (KO, news, published 2025-06-01) https://www.sisajournal-e.com/news/articleView.html?idxno=295754: "반도체 기판 업황(난야PCB 등)"
- [confirms] 난야PCB (EN, ir, published 2025-05-01) https://www.npc.com.tw/npceb2b/en/: "NVIDIA에 BT·패키지 기판 공급/제공."
- [confirms] 회사 IR/거래소 공시 (EN, filing, published 2025-04-01) https://www.npc.com.tw/npceb2b/en/Investor.html: "연차보고서: 매출·고객·사업."
- [confirms] MatrixBCG (EN, analysis, published 2025-01-01) https://matrixbcg.com/blogs/growth-strategy/nanyapcb: "NVIDIA에 BT·패키지 기판 공급/제공."

## Money out · pays to (2)
### 동박·빌드업 소재 (비공개) (low)
- note: 제조용 원재료·소재·R&D(비공개).
- [confirms] 난야PCB (EN, ir, published 2025-05-01) https://www.npc.com.tw/npceb2b/en/: "제조용 원재료·소재·R&D(비공개)."

### Resonac (low)  → /resonac.md
- note: Resonac에서 기판 소재 매입.
- [confirms] 난야PCB (EN, ir, published 2025-05-01) https://www.npc.com.tw/npceb2b/en/: "Resonac에서 기판 소재 매입."
- [confirms] MatrixBCG (EN, analysis, published 2025-01-01) https://matrixbcg.com/blogs/growth-strategy/nanyapcb: "Resonac에서 기판 소재 매입."

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_Generated for LLM/agent consumption. Each edge lists stance (confirms/mentions/contradicts), source publisher, language, date, and excerpt for verification._