{"slug":"micron","name":"Micron Technology","name_en":"Micron Technology","ticker":"MU","updated_at":"2026-06-21T08:18:01.391377+00:00","canonical":"https://valuechain.wiki/micron","kicker":"메모리 · DRAM/NAND/HBM","kicker_en":"Memory · DRAM/NAND/HBM","lead":"미국 3대 메모리 제조사. HBM3E를 NVIDIA H200·AMD MI350에 공급하며 AI 메모리 경쟁에 합류. FY2025 매출 $37.4B, EUV(1γ) 도입.","lead_en":"One of the three major US memory makers. Supplies HBM3E to NVIDIA H200 and AMD MI350, joining the AI-memory race. FY2025 revenue $37.4B, adopting EUV (1-gamma).","segments":{"fy":2025,"parts":[{"desc":"Cloud Memory Business Unit: 하이퍼스케일 클라우드·데이터센터 HBM","name":"CMBU"},{"desc":"Mobile/Core memory","name":"MCBU"},{"desc":"Automotive·Embedded (자동차·산업·소비자)","name":"AEBU"},{"desc":"SSD·managed NAND","name":"Storage"}],"total":"$37.4B (FY2025, FY24 $25.1B, FY23 $15.5B)","source":"https://www.sec.gov/Archives/edgar/data/723125/000072312525000028/mu-20250828.htm","currency":"USD","concentration":"단일 최대고객 17% (FY2025, CMBU 클라우드부문, 고객명 비공개). FY24 10%, FY23 <10%"},"segments_en":{"parts":[{"desc":"Cloud Memory Business Unit: HBM for hyperscale cloud and data center","name":"CMBU"},{"desc":"Mobile/Core memory","name":"MCBU"},{"desc":"Automotive and Embedded (auto, industrial, consumer)","name":"AEBU"},{"desc":"SSD, managed NAND","name":"Storage"}],"total":"$37.4B (FY2025; FY24 $25.1B, FY23 $15.5B)","concentration":"Largest single customer 17% (FY2025, CMBU cloud segment, customer not disclosed). FY24 10%, FY23 <10%"},"edges":[{"direction":"revenue","counterparty":"NVIDIA","counterparty_slug":"nvidia","confidence":"high","metric":{"type":"supply_relationship","as_of":"2026-01-25","qualifier":"HBM·메모리 공급, 매입자측 확인"},"note":"NVIDIA 10-K가 Micron을 메모리(HBM 포함) 공급사로 명시(매입자측 1차). Micron 최대 단일고객 17%(FY2025, CMBU 클라우드)는 고객명 비공개라 NVIDIA로 추정되나 미확인.","note_en":"NVIDIA's 10-K names Micron as a memory (incl. HBM) supplier (buyer-side primary). Micron's largest single customer at 17% (FY2025, CMBU cloud) is undisclosed, so NVIDIA is inferred but unconfirmed.","sources":[{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":null,"kind":"filing","lang":"en","published_at":"2026-02-26","url":"https://www.sec.gov/Archives/edgar/data/1045810/000104581026000021/nvda-20260125.htm","title":"NVIDIA Form 10-K (FY2026, 2026-01-25)","title_en":null,"excerpt":"NVIDIA 10-K: \"We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.\" Micron→NVIDIA 공급을 매입자측 1차 공시로 확인.","excerpt_en":"NVIDIA 10-K: \"We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.\" Buyer-side primary filing confirming Micron to NVIDIA supply."},{"stance":"mentions","publisher":"SEC EDGAR","publisher_en":null,"kind":"filing","lang":"en","published_at":"2025-10-03","url":"https://www.sec.gov/Archives/edgar/data/723125/000072312525000028/mu-20250828.htm","title":"Micron Form 10-K (FY2025, 2025-08-28)","title_en":null,"excerpt":"Micron 10-K: \"Revenue from one customer was 17% (primarily included in the CMBU segment) of total revenue for 2025.\" 고객명 비공개라 NVIDIA로 단정 불가(추정).","excerpt_en":"Micron 10-K: \"Revenue from one customer was 17% (primarily included in the CMBU segment) of total revenue for 2025.\" The customer is undisclosed, so NVIDIA cannot be confirmed (inferred)."},{"stance":"confirms","publisher":"전자신문","publisher_en":"ETNews","kind":"news","lang":"ko","published_at":"2024-02-27","url":"https://www.etnews.com/20240227000072","title":"美 마이크론, 'HBM3E' 양산 개시…삼성·SK보다 빨라","title_en":"US Micron starts HBM3E mass production, ahead of Samsung and SK","excerpt":"전자신문: 마이크론 HBM3E 양산 개시, 엔비디아 H200에 적용. 삼성·SK보다 빠른 시장 진입.","excerpt_en":"ETNews: Micron started HBM3E mass production for NVIDIA's H200, entering the market ahead of Samsung and SK."}]},{"direction":"cost","counterparty":"ASML","counterparty_slug":"asml","confidence":"high","metric":{"type":"supply_status","basis":"EUV 노광장비(1γ DRAM)","basis_en":"EUV lithography (1-gamma DRAM)","qualifier":"sole_source"},"note":"EUV 리소그래피 장비 매입. 1γ(1-gamma)가 마이크론 첫 EUV DRAM 노드, 1δ에서 EUV 확대. ASML은 EUV 유일 공급사(sole-source).","note_en":"Buys EUV lithography tools. 1-gamma is Micron's first EUV DRAM node, with EUV expanding at 1-delta. ASML is the sole EUV supplier.","sources":[{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":null,"kind":"filing","lang":"en","published_at":"2025-10-03","url":"https://www.sec.gov/Archives/edgar/data/723125/000072312525000028/mu-20250828.htm","title":"Micron Form 10-K (FY2025, 2025-08-28)","title_en":null,"excerpt":"Micron 10-K: \"...our first DRAM node incorporating EUV lithography...\" + \"...a single or sole source, and we may be unable to qualify new suppliers...\" ASML은 EUV 장비 유일 공급사.","excerpt_en":"Micron 10-K: \"...our first DRAM node incorporating EUV lithography...\" and \"...a single or sole source, and we may be unable to qualify new suppliers...\" ASML is the sole EUV equipment supplier."},{"stance":"mentions","publisher":"TrendForce","publisher_en":null,"kind":"news","lang":"en","published_at":"2025-03-11","url":"https://www.trendforce.com/news/2025/03/11/news-micron-pioneers-1%CE%B3-ddr5-samples-with-reduced-euv-use-but-future-risks-loom/","title":"Micron Pioneers 1γ DDR5 Samples with Reduced EUV Use","title_en":null,"excerpt":"TrendForce: 마이크론 1γ DDR5 샘플, EUV 사용. 향후 1δ에서 EUV 확대.","excerpt_en":"TrendForce: Micron sampled 1-gamma DDR5 using EUV, with EUV expanding at 1-delta."},{"stance":"confirms","publisher":"Micron IR / GlobeNewswire","publisher_en":null,"kind":"ir","lang":"en","published_at":"2025-02-25","url":"https://www.globenewswire.com/news-release/2025/02/25/3032114/14450/en/Micron-Announces-Shipment-of-1g-1-gamma-DRAM.html","title":"Micron Announces Shipment of 1γ (1-gamma) DRAM","title_en":null,"excerpt":"Micron IR: 1γ DRAM 출하, EUV 리소그래피 첫 적용 DRAM 노드.","excerpt_en":"Micron IR: shipped 1-gamma DRAM, its first DRAM node using EUV lithography."}]},{"direction":"revenue","counterparty":"AMD","counterparty_slug":"amd","confidence":"high","metric":{"type":"supply_status","basis":"AMD MI350 HBM3E(삼성과 듀얼)","basis_en":"AMD MI350 HBM3E (dual with Samsung)","qualifier":"qualified"},"note":"HBM3E 36GB 12-high를 AMD Instinct MI350에 공급(삼성과 듀얼소싱). 전작 MI325X엔 8-high HBM3E.","note_en":"Supplies 36GB 12-high HBM3E to AMD Instinct MI350 (dual-sourced with Samsung). The prior MI325X used 8-high HBM3E.","sources":[{"stance":"confirms","publisher":"TrendForce","publisher_en":"TrendForce","kind":"news","lang":"en","published_at":"2025-06-13","url":"https://www.trendforce.com/news/2025/06/13/news-unpacking-amds-mi350-powered-by-tsmcs-n3p-with-samsung-micron-as-dual-hbm3e-suppliers/","title":"Unpacking AMD's MI350: Samsung/Micron Dual HBM3E","title_en":"Unpacking AMD's MI350: Samsung/Micron Dual HBM3E","excerpt":"TrendForce: AMD MI350은 TSMC N3P 기반, 삼성·마이크론을 HBM3E 듀얼 공급사로 채택.","excerpt_en":"TrendForce: AMD MI350 is built on TSMC N3P and uses Samsung and Micron as dual HBM3E suppliers."},{"stance":"confirms","publisher":"Micron / Nasdaq","publisher_en":null,"kind":"ir","lang":"en","published_at":"2025-06-12","url":"https://www.nasdaq.com/articles/micron-technology-integrates-hbm3e-36gb-memory-amd-instinct-mi350-series-solutions","title":"Micron Integrates HBM3E 36GB into AMD Instinct MI350 Series","title_en":null,"excerpt":"Micron: HBM3E 36GB를 AMD Instinct MI350 시리즈에 통합.","excerpt_en":"Micron: integrated 36GB HBM3E into the AMD Instinct MI350 series."},{"stance":"mentions","publisher":"AMD","publisher_en":null,"kind":"ir","lang":"en","published_at":"2025-06-12","url":"https://www.amd.com/en/blogs/2025/amd-instinct-mi350-series-and-beyond-accelerating-the-future-of-ai-and-hpc.html","title":"AMD Instinct MI350 Series and Beyond","title_en":null,"excerpt":"AMD: MI350 시리즈가 288GB HBM3E 탑재(마이크론·삼성).","excerpt_en":"AMD: the MI350 series carries 288GB of HBM3E (Micron and Samsung)."}]},{"direction":"cost","counterparty":"신에쓰화학","counterparty_slug":"shin-etsu","confidence":"high","metric":null,"note":"Shin-Etsu Chemical에서 300mm 실리콘 웨이퍼 매입(LTA).","note_en":"Buys 300mm silicon wafers from Shin-Etsu Chemical under LTA.","sources":[{"stance":"confirms","publisher":"아이씨엔매거진","publisher_en":"ICN Magazine","kind":"news","lang":"ko","published_at":"2026-01-15","url":"https://icnweb.kr/2026/79720/","title":"HBM4 시대의 보이지 않는 병목—특수 폴리시드 웨이퍼","title_en":"HBM4’s hidden bottleneck — special polished wafers","excerpt":"Micron Technology 웨이퍼 수급에 Shin-Etsu Chemical 의존.","excerpt_en":"Micron Technology depends on Shin-Etsu Chemical for wafer supply."}]},{"direction":"cost","counterparty":"섬코","counterparty_slug":"sumco","confidence":"high","metric":null,"note":"SUMCO Corporation에서 300mm 실리콘 웨이퍼 매입(LTA).","note_en":"Buys 300mm silicon wafers from SUMCO Corporation under LTA.","sources":[{"stance":"confirms","publisher":"아이씨엔매거진","publisher_en":"ICN Magazine","kind":"news","lang":"ko","published_at":"2026-01-15","url":"https://icnweb.kr/2026/79720/","title":"HBM4 시대의 보이지 않는 병목—특수 폴리시드 웨이퍼","title_en":"HBM4’s hidden bottleneck — special polished wafers","excerpt":"Micron Technology 웨이퍼 수급에 SUMCO Corporation 의존.","excerpt_en":"Micron Technology depends on SUMCO Corporation for wafer supply."}]},{"direction":"revenue","counterparty":"Apple","counterparty_slug":"apple","confidence":"mid","metric":null,"note":"아이폰용 메모리를 애플에 공급(3사 중 하나).","note_en":"Supplies iPhone memory to Apple (one of three).","sources":[{"stance":"mentions","publisher":"한국경제","publisher_en":"Korea Economic Daily","kind":"news","lang":"ko","published_at":"2025-12-21","url":"https://www.hankyung.com/article/202512216673i","title":"\"애플 물량 싹쓸이\"…삼성 반도체의 '숨은 공신'","title_en":"Samsung's quiet win: sweeping up Apple's memory orders","excerpt":"아이폰 LPDDR 공급 3사에 마이크론 포함.","excerpt_en":"Micron is among the three iPhone LPDDR suppliers."}]},{"direction":"revenue","counterparty":"Broadcom","counterparty_slug":"broadcom","confidence":"mid","metric":null,"note":"브로드컴 AI 가속기용 HBM 공급사.","note_en":"Supplies HBM for Broadcom's AI accelerators.","sources":[{"stance":"mentions","publisher":"ZDNet Korea","publisher_en":"ZDNet Korea","kind":"news","lang":"ko","published_at":"2026-03-05","url":"https://zdnet.co.kr/view/?no=20260305121446","title":"브로드컴, AI칩 고성장 자신…삼성·SK 메모리 수요 견인","title_en":"Broadcom confident in AI chip growth, driving Samsung/SK memory demand","excerpt":"삼성·SK·마이크론 HBM 수요가 브로드컴 AI칩으로 확대.","excerpt_en":"Demand for Samsung, SK and Micron HBM expands with Broadcom's AI chips."}]},{"direction":"cost","counterparty":"램리서치","counterparty_slug":"lam-research","confidence":"mid","metric":{"type":"supply_status","basis":"식각·증착(etch/deposition)","basis_en":"Etch/deposition","qualifier":"named_customer"},"note":"식각·증착 장비 매입(메모리 미세화). Lam의 주요 고객사로 마이크론 명시.","note_en":"Buys etch and deposition tools (memory scaling). Micron named among Lam's main customers.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2025-08-11","url":"https://www.sec.gov/Archives/edgar/data/0000707549/000070754925000075/lrcx-20250629.htm","title":"Lam Research FY2025 Form 10-K","title_en":"Lam Research FY2025 Form 10-K","excerpt":"마이크론이 램의 메모리 고객.","excerpt_en":"Micron is a Lam memory customer."},{"stance":"mentions","publisher":"Granitefirm Analysis","publisher_en":null,"kind":"analysis","lang":"en","published_at":"2024-08-12","url":"https://www.granitefirm.com/blog/us/2024/08/12/lam-research-chip-equipment/","title":"How does Lam Research make money? (customers: TSMC, Samsung, Micron, Intel)","title_en":null,"excerpt":"Granitefirm: Lam Research 주요 고객은 TSMC·삼성·마이크론·인텔. 식각·증착 강점.","excerpt_en":"Granitefirm: Lam Research's main customers are TSMC, Samsung, Micron and Intel, with strengths in etch and deposition."}]},{"direction":"cost","counterparty":"도쿄일렉트론","counterparty_slug":"tokyo-electron","confidence":"mid","metric":null,"note":"도쿄일렉트론에서 코터·식각·증착·세정 장비 매입.","note_en":"Buys coater, etch, deposition and clean tools from Tokyo Electron.","sources":[{"stance":"confirms","publisher":"시사저널e","publisher_en":"Sisa Journal e","kind":"news","lang":"ko","published_at":null,"url":"https://www.sisajournal-e.com/news/articleView.html?idxno=406466","title":"해외 장비社 삼성·SK 공략 강화 (TEL 등 국내투자 봇물)","title_en":"Foreign toolmakers including TEL ramp investment to court Samsung and SK","excerpt":"Micron Technology가 TEL 전공정 장비 도입.","excerpt_en":"Micron Technology adopts TEL wafer-fab tools."}]},{"direction":"cost","counterparty":"GlobalWafers","counterparty_slug":"globalwafers","confidence":"mid","metric":null,"note":"GlobalWafers에서 300mm 실리콘 웨이퍼 매입/사용.","note_en":"Uses/buys 300mm silicon wafers from GlobalWafers.","sources":[{"stance":"confirms","publisher":"GlobalWafers","publisher_en":"GlobalWafers","kind":"ir","lang":"en","published_at":"2025-03-01","url":"https://www.globalwafers.com/en/investors","title":"글로벌웨이퍼스 IR","title_en":"GlobalWafers Investor Relations","excerpt":"IR: 실리콘 웨이퍼 매출·고객.","excerpt_en":"IR: silicon-wafer revenue and customers."},{"stance":"confirms","publisher":"Mordor Intelligence","publisher_en":"Mordor Intelligence","kind":"analysis","lang":"en","published_at":"2025-01-01","url":"https://www.mordorintelligence.com/industry-reports/semiconductor-silicon-wafer-market","title":"실리콘 웨이퍼 시장 (상위 5사 과점)","title_en":"Silicon Wafer Market (top-five oligopoly)","excerpt":"300mm 상위 5사 과점, 글로벌웨이퍼스 ~15%.","excerpt_en":"Top-five 300mm oligopoly; GlobalWafers ~15%."},{"stance":"confirms","publisher":"디일렉","publisher_en":"THE ELEC","kind":"news","lang":"ko","published_at":"2024-06-01","url":"https://www.thelec.kr/news/articleView.html?idxno=9435","title":"글로벌웨이퍼스, 실트로닉 인수 시도(獨 불허로 무산)","title_en":"GlobalWafers’ Siltronic bid (blocked by Germany)","excerpt":"TSMC·UMC·삼성 등에 웨이퍼 공급.","excerpt_en":"Supplies wafers to TSMC, UMC, Samsung."}]},{"direction":"cost","counterparty":"Advantest","counterparty_slug":"advantest","confidence":"mid","metric":null,"note":"Advantest에서 반도체 테스트 장비(ATE) 매입.","note_en":"Buys test equipment (ATE) from Advantest.","sources":[{"stance":"confirms","publisher":"알파비즈","publisher_en":"AlphaBiz","kind":"news","lang":"ko","published_at":"2025-09-01","url":"https://alphabiz.co.kr/news/view/1065571888915355","title":"어드밴테스트, HBM 테스터 시장 압도적 기술력","title_en":"Advantest dominates the HBM tester market","excerpt":"HBM 테스터 압도적 기술력, SK하이닉스 등.","excerpt_en":"Dominant HBM tester tech; SK hynix and others."},{"stance":"confirms","publisher":"어드밴테스트","publisher_en":"Advantest","kind":"ir","lang":"en","published_at":"2025-06-01","url":"https://www.advantest.com/document/en/investors/ir-library/annual/E_02_IAR2025.pdf","title":"어드밴테스트 통합연차보고서 2025","title_en":"Advantest Integrated Annual Report 2025","excerpt":"연차보고서: ATE 매출·고객.","excerpt_en":"Annual report: ATE revenue and customers."},{"stance":"confirms","publisher":"Mordor Intelligence","publisher_en":"Mordor Intelligence","kind":"analysis","lang":"en","published_at":"2025-01-01","url":"https://www.mordorintelligence.com/industry-reports/semiconductor-test-equipment-market","title":"반도체 테스트 장비 시장 (어드밴테스트 ~58%)","title_en":"Semiconductor Test Equipment Market (Advantest ~58%)","excerpt":"테스트 장비 세계 ~58% 1위.","excerpt_en":"No.1 in test equipment at ~58%."}]},{"direction":"cost","counterparty":"Teradyne","counterparty_slug":"teradyne","confidence":"mid","metric":null,"note":"Teradyne에서 반도체 테스트 장비(ATE) 매입.","note_en":"Buys test equipment (ATE) from Teradyne.","sources":[{"stance":"confirms","publisher":"한국경제","publisher_en":"Korea Economic Daily","kind":"news","lang":"ko","published_at":"2026-02-24","url":"https://www.hankyung.com/article/2026022418631","title":"테라다인 질주…반도체 호황·로봇 붐 올라탔다","title_en":"Teradyne surges on the chip upturn and robotics boom","excerpt":"테라다인, 반도체 호황에 질주.","excerpt_en":"Teradyne surges on the chip upturn."},{"stance":"confirms","publisher":"SEC EDGAR","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2025-02-26","url":"https://www.sec.gov/cgi-bin/browse-edgar?action=getcompany&CIK=TER&type=10-K","title":"Teradyne 연례보고서 (10-K)","title_en":"Teradyne Form 10-K","excerpt":"10-K: 반도체 테스트 매출.","excerpt_en":"10-K: semiconductor-test revenue."},{"stance":"confirms","publisher":"Teradyne","publisher_en":"Teradyne","kind":"ir","lang":"en","published_at":"2025-01-01","url":"https://www.teradyne.com/semiconductor-testing/","title":"Teradyne 반도체 테스트","title_en":"Teradyne semiconductor testing","excerpt":"메모리·SoC·컴퓨팅 테스트.","excerpt_en":"Memory, SoC and computing test."}]}]}