{"slug":"ase","name":"ASE테크놀로지","name_en":"ASE Technology","ticker":"ASX","updated_at":"2026-06-20T13:56:56.609529+00:00","canonical":"https://valuechain.wiki/ase","kicker":"세계 1위 OSAT (패키징·테스트)","kicker_en":"World’s largest OSAT (packaging & test)","lead":"세계 1위 OSAT(후공정 패키징·테스트). FY2025 매출 약 $19B(분기 ~$5B). TSMC가 넘긴 CoWoS 첨단 패키징·테스트 물량을 받아 엔비디아·AMD 등 AI 칩 고객을 지원하며, 첨단 패키징 매출이 2024 $0.45B→2025 $1.1B로 급증했다.","lead_en":"The world’s largest OSAT (back-end packaging and test). FY2025 revenue about $19B (~$5B per quarter). It absorbs CoWoS advanced-packaging and test volume that TSMC overflows, serving AI-chip customers such as Nvidia and AMD; advanced-packaging revenue jumped from $0.45B (2024) to $1.1B (2025).","segments":{"fy":2025,"parts":[{"desc":"첨단 패키징(CoWoS-S/L)·테스트","name":"ATM (패키징·테스트)"},{"desc":"전자제조 서비스","name":"EMS"}],"total":"FY2025 매출 약 $19B (첨단 패키징 $1.1B, +144%)","source":"https://www.sec.gov/Archives/edgar/data/0001122411/000119312526135585/d50802d20f.htm","concentration":"세계 1위 OSAT. 고객 엔비디아·AMD 등 팹리스. TSMC CoWoS 오버플로우 수혜."},"segments_en":{"parts":[{"desc":"Advanced packaging (CoWoS-S/L), test","name":"ATM (packaging & test)"},{"desc":"Electronics manufacturing services","name":"EMS"}],"total":"FY2025 revenue about $19B (advanced packaging $1.1B, +144%)","concentration":"World’s #1 OSAT. Customers Nvidia, AMD and other fabless. Benefits from TSMC CoWoS overflow."},"edges":[{"direction":"revenue","counterparty":"팹리스·IDM 고객","counterparty_slug":null,"confidence":"high","metric":{"type":"revenue","unit":"USD","basis":"연간 총매출(추정)","value":19000000000,"period":"FY2025","basis_en":"annual total revenue (approx)","qualifier":"approx"},"note":"다수 팹리스·IDM의 패키징·테스트(세계 1위 OSAT). FY2025 매출 약 $19B.","note_en":"Packaging and test for many fabless/IDM customers (world’s #1 OSAT). FY2025 revenue about $19B.","sources":[{"stance":"confirms","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-04-01","url":"https://www.sec.gov/Archives/edgar/data/0001122411/000119312526135585/d50802d20f.htm","title":"ASE Technology FY2025 Form 20-F","title_en":"ASE Technology FY2025 Form 20-F","excerpt":"세계 1위 OSAT, 분기 매출 약 $5B.","excerpt_en":"World’s #1 OSAT, ~$5B quarterly revenue."},{"stance":"confirms","publisher":"디지타임스","publisher_en":"DigiTimes","kind":"news","lang":"en","published_at":"2025-10-31","url":"https://www.digitimes.com/news/a20251031PD246/ase-advanced-packaging-revenue-testing-2026.html","title":"ASE 첨단 패키징 매출, 2026년 10억달러 증가","title_en":"ASE advanced packaging revenue to rise US$1B in 2026","excerpt":"첨단 패키징 매출 2024 $0.45B→2025 $1.1B.","excerpt_en":"Advanced packaging revenue $0.45B (2024) to $1.1B (2025)."}]},{"direction":"revenue","counterparty":"NVIDIA","counterparty_slug":"nvidia","confidence":"high","metric":null,"note":"엔비디아 AI칩의 첨단 패키징(CoWoS 오버플로우)·테스트. TSMC가 넘긴 물량 일부를 수행.","note_en":"Advanced packaging (CoWoS overflow) and test for Nvidia AI chips; absorbs volume TSMC transfers.","sources":[{"stance":"confirms","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-04-01","url":"https://www.sec.gov/Archives/edgar/data/0001122411/000119312526135585/d50802d20f.htm","title":"ASE Technology FY2025 Form 20-F","title_en":"ASE Technology FY2025 Form 20-F","excerpt":"20-F: 주요 팹리스 고객 대상 첨단 패키징·테스트.","excerpt_en":"20-F: advanced packaging and test for major fabless customers."},{"stance":"confirms","publisher":"트렌드포스","publisher_en":"TrendForce","kind":"news","lang":"en","published_at":"2026-01-14","url":"https://www.trendforce.com/news/2026/01/14/news-ase-buys-nt2-8b-zhunan-facility-packaging-orders-reportedly-span-nvidia-amd-and-more/","title":"ASE, 패키징 수주에 NVIDIA·AMD 포함","title_en":"ASE packaging orders reportedly span Nvidia, AMD and more","excerpt":"ASE 패키징 수주에 엔비디아 포함.","excerpt_en":"ASE packaging orders span Nvidia."},{"stance":"confirms","publisher":"글로벌이코노믹","publisher_en":"Global Economic","kind":"news","lang":"ko","published_at":"2025-12-09","url":"https://www.g-enews.com/article/Global-Biz/2025/12/202512090936299708fbbec65dfb_1","title":"TSMC 넘친 물량, ASE·앰코가 흡수…패키징 양강","title_en":"TSMC overflow goes to ASE and Amkor, the packaging duopoly","excerpt":"TSMC 넘친 CoWoS 물량을 ASE가 흡수, 엔비디아 지원.","excerpt_en":"ASE absorbs TSMC CoWoS overflow, serving Nvidia."}]},{"direction":"revenue","counterparty":"AMD","counterparty_slug":"amd","confidence":"mid","metric":null,"note":"AMD Venice CPU 풀공정 패키징(2026~, $3~4억 추정).","note_en":"Full-process packaging for AMD Venice CPUs (from 2026, est. $300-400M).","sources":[{"stance":"confirms","publisher":"트렌드포스","publisher_en":"TrendForce","kind":"news","lang":"en","published_at":"2026-01-14","url":"https://www.trendforce.com/news/2026/01/14/news-ase-buys-nt2-8b-zhunan-facility-packaging-orders-reportedly-span-nvidia-amd-and-more/","title":"ASE, 패키징 수주에 NVIDIA·AMD 포함","title_en":"ASE packaging orders reportedly span Nvidia, AMD and more","excerpt":"AMD Venice CPU가 2026 하반기 ASE 풀공정 패키징 예정.","excerpt_en":"AMD Venice CPUs to enter ASE full-process packaging in 2H 2026."}]},{"direction":"cost","counterparty":"BESI","counterparty_slug":"besi","confidence":"mid","metric":null,"note":"다이 어태치·하이브리드 본딩 장비를 BESI에서 매입.","note_en":"Buys die-attach and hybrid-bonding tools from BESI.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-04-01","url":"https://www.sec.gov/Archives/edgar/data/0001122411/000119312526135585/d50802d20f.htm","title":"ASE Technology FY2025 Form 20-F","title_en":"ASE Technology FY2025 Form 20-F","excerpt":"20-F: 첨단 패키징 장비 매입.","excerpt_en":"20-F: buys advanced-packaging equipment."}]},{"direction":"cost","counterparty":"삼성전기","counterparty_slug":"samsung-electro-mechanics","confidence":"mid","metric":null,"note":"패키지 기판(FC-BGA 등)을 삼성전기 등에서 매입.","note_en":"Buys package substrates (FC-BGA, etc.) from suppliers such as Samsung Electro-Mechanics.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-04-01","url":"https://www.sec.gov/Archives/edgar/data/0001122411/000119312526135585/d50802d20f.htm","title":"ASE Technology FY2025 Form 20-F","title_en":"ASE Technology FY2025 Form 20-F","excerpt":"20-F: 패키지 기판 조달.","excerpt_en":"20-F: sources package substrates."}]},{"direction":"cost","counterparty":"한미반도체","counterparty_slug":"hanmi-semiconductor","confidence":"mid","metric":null,"note":"한미반도체에서 TC본더 등 후공정 장비 매입.","note_en":"Buys TC bonders and back-end tools from Hanmi Semiconductor.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-04-01","url":"https://www.sec.gov/Archives/edgar/data/0001122411/000119312526135585/d50802d20f.htm","title":"ASE Technology FY2025 Form 20-F","title_en":"ASE Technology FY2025 Form 20-F","excerpt":"ASE가 후공정 장비를 매입(한미 포함).","excerpt_en":"ASE buys back-end equipment (incl. Hanmi)."}]},{"direction":"cost","counterparty":"ASMPT","counterparty_slug":"asmpt","confidence":"mid","metric":null,"note":"다이·와이어 본더 등 후공정 패키징 장비를 ASMPT에서 매입.","note_en":"Buys die/wire bonders and packaging tools from ASMPT.","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-04-01","url":"https://www.sec.gov/Archives/edgar/data/0001122411/000119312526135585/d50802d20f.htm","title":"ASE Technology FY2025 Form 20-F","title_en":"ASE Technology FY2025 Form 20-F","excerpt":"20-F: 후공정 장비를 주요 장비사에서 매입.","excerpt_en":"20-F: buys back-end equipment from key toolmakers."}]},{"direction":"cost","counterparty":"소재·리드프레임 (비공개)","counterparty_slug":null,"confidence":"low","metric":{"type":"qualifier","value":null,"qualifier":"confirmed_no_disclosed_value"},"note":"리드프레임·본딩와이어·몰딩 소재 매입(비공개).","note_en":"Buys leadframes, bonding wire and molding materials (undisclosed).","sources":[{"stance":"mentions","publisher":"미국 증권거래위원회(SEC EDGAR)","publisher_en":"SEC EDGAR","kind":"filing","lang":"en","published_at":"2026-04-01","url":"https://www.sec.gov/Archives/edgar/data/0001122411/000119312526135585/d50802d20f.htm","title":"ASE Technology FY2025 Form 20-F","title_en":"ASE Technology FY2025 Form 20-F","excerpt":"20-F: 패키징 소재 공급망.","excerpt_en":"20-F: packaging-materials supply chain."}]}]}